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Keywords: electronics packaging
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. January 2012, 79(1): 011010.
Published Online: December 13, 2011
... , K.-N. , 2002 , “ Overview of Multilayered Thin Film Theories for MEMS and Electronic Packaging Applications ,” ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems , June 1, IEEE , New York . 28 Tsai , M.-Y. , Chang , H.-Y...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. January 2010, 77(1): 011008.
Published Online: September 30, 2009
... level electronic package subjected to standard drop impact load. Results indicate that for the drop impact analysis of lead-free solder joints, the strain rate effect must be considered and rate-dependent material models of lead-free solders are indispensable. The European Parliament...