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Just Accepted Manuscript
Research-Article January 18, 2025
Optimization of Micro-Pillars Electroplating Bonding Processes and Additives
J. Electron. Packag.
doi: https://doi.org/10.1115/1.4067651
Research-Article January 18, 2025
Microbead Encapsulation for Protection of Electronic Components
J. Electron. Packag.
doi: https://doi.org/10.1115/1.4067650
Research-Article January 18, 2025
Applications, Design Methods, and Challenges for Additive Manufacturing of Thermal Solutions for Heterogeneous Integration of Electronics
J. Electron. Packag.
doi: https://doi.org/10.1115/1.4067649
Research-Article November 27, 2024
Electrochemical Linked to Mechanical Simulation for an Assessment of State-Of-Health of Thin-flexible Li-ion Batteries on Dynamic Flexing and Calendar Aging
J. Electron. Packag.
doi: https://doi.org/10.1115/1.4067266
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Optimization of Micro-Pillars Electroplating Bonding Processes and Additives
J. Electron. Packag
Microbead Encapsulation for Protection of Electronic Components
J. Electron. Packag
Performance Analysis of a Brazed Plate Heat Exchanger During Condensation of R1233zd(E)
J. Electron. Packag (June 2025)
Wideband Equivalent Circuit Modeling and Parameter Extraction Method for Through Via in Ceramic Package Substrate
J. Electron. Packag (June 2025)
