Solder joints of leadless surface mounted components, which were thermally cycled, were studied to determine their failure mode and to compare the results with work done on bulk solder specimens. Previous studies done on the characterization of the mechanical properties of cyclically tested bulk Pb/Sn solder of different compositions show that their deformation behavior is a result of an interaction between creep and fatigue damage processes. Fractographic forensics of the failed solder joints also showed damage due to both creep and fatigue processes. Fatigue striations were observed side by side with creep voids and extensive intergranular cracking. The crack growth rate (da/dn) was calculated to be around 0.25 μm/cycle. It is also established that the failure is crack propagation controlled. It was found that the crack initiation site on at least one of the joints was a tin rich area. The size of the voids varied from 0.1 μm to 0.5 μm.
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June 1992
Research Papers
Confirmation of Creep and Fatigue Damage in Pb/Sn Solder Joints
A. I. Attarwala,
A. I. Attarwala
Mechanical Engineering Department, The University of Texas at Austin, Austin, TX 78712-1063
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J. K. Tien,
J. K. Tien
Mechanical Engineering Department, The University of Texas at Austin, Austin, TX 78712-1063
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G. Y. Masada,
G. Y. Masada
Mechanical Engineering Department, The University of Texas at Austin, Austin, TX 78712-1063
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G. Dody
G. Dody
Motorola Inc., Austin, TX 78721
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A. I. Attarwala
Mechanical Engineering Department, The University of Texas at Austin, Austin, TX 78712-1063
J. K. Tien
Mechanical Engineering Department, The University of Texas at Austin, Austin, TX 78712-1063
G. Y. Masada
Mechanical Engineering Department, The University of Texas at Austin, Austin, TX 78712-1063
G. Dody
Motorola Inc., Austin, TX 78721
J. Electron. Packag. Jun 1992, 114(2): 109-111 (3 pages)
Published Online: June 1, 1992
Article history
Received:
August 1, 1991
Online:
April 28, 2008
Citation
Attarwala, A. I., Tien, J. K., Masada, G. Y., and Dody, G. (June 1, 1992). "Confirmation of Creep and Fatigue Damage in Pb/Sn Solder Joints." ASME. J. Electron. Packag. June 1992; 114(2): 109–111. https://doi.org/10.1115/1.2906405
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