Failures in electronic packaging under thermal fatigue often result from cracking in solder joints due to creep/fatigue crack growth. A nonlinear, time-dependent finite element analysis was performed to study the effect of critical design parameters on thermal reliability of leadless chip capacitor or resistor solder joints. The shear strain range based on thermal hysteresis response was used to study the sensitivity of various parameters, such as solder stand-off height, fillet geometry, Cu-pad length, and component length and thickness. The results were used as guidelines for designing reliable solder joints. In addition, an analytical model for the solder joint assembly was derived. It can be used .as an engineering approach for rapid assessment of large numbers of design parameters. The accuracy and effectiveness of the analytical model were evaluated by comparing with finite element results.

Issue Section:
Technical Papers
Topics:
Design, Resistors, Solder joints, Finite element analysis, Capacitors, Cracking (Materials), Creep, Electronic packaging, Failure, Fatigue, Fatigue cracks, Fracture (Process), Geometry, Manufacturing, Reliability, Shear (Mechanics), Solders
1.
ABAQUS, 1994, Hibbit, Karlsson & Sorensen, Inc., Pawtucket, RI 02860.
2.
Clech, J.-P., and Augis, J. A., 1987, “Engineering Analysis of Thermal Cycling Accelerated Tests for Surface-Mounted Attachment Reliability Evaluation,” Proceeding of 7th Int, Electronics Packaging Society Conference (IEPS), Boston, MA, Nov., pp. 385–410.
3.
Fishman, D., and Cooper, N., 1981, “Mounting Leadless Chip Carriers on to Printed Circuit Cards,” Proceedings of First International Electronics Packaging Society Conference, Cleveland, OH, Nov., pp. 45–59.
4.
Hall
P. M.
,
1984
, “
Forces, Moments, and Displacements During Thermal Chamber Cycling of Leadless Ceramic Chip Carriers Soldered to Printed Boards
,”
IEEE Transactions on Components, Hybrids, and Manufacturing Technology
, Vol.
7
, No.
4
, Dec., pp.
314
–
327
.
5.
Lassen, C. L., 1981, “Use of Metal Core Substrates for Leadless Chip Carrier Interconnection,” Electronic Packaging and Production, Mar., pp. 98–104.
6.
Lau
J. H.
,
Rice
D. W.
, and
Avery
P. A.
,
1987
, “
Elastoplastic Analysis of Surface-Mount Solder Joints
,”
IEEE Transactions on Components, Hybrids, and Manufacturing Technology
, Vol.
10
, No.
3
, Sept., pp.
346
–
357
.
7.
Lau, J. H., 1991, Solder Joint Reliability: Theory and Applications, Van Nostrand Reinhold, NY.
8.
Pao
Y.-H.
,
Badgley
S.
,
Govila
R.
,
Banmgartner
L.
,
Allor
R.
, and
Cooper
R.
,
1992
, “
Measurement of Mechanical Behavior of High Lead Lead-Tin Solder Joints Subjected to Thermal Cycling
,”
ASME JOURNAL OF ELECTRONIC PACKAGING
, Vol.
114
, June, pp.
135
–
144
.
9.
Pao, Y.-H., Badgley, S., Govila, R., and Jih, E., 1993, “Thermomechanical and Fatigue Behavior of Four Lead and Lead-Free Solder Joints,” Proceedings of the ASME International Electronics Packaging Conference, Advances in Electronic Packaging, EEP Vol. 4–2, Sept. 29–Oct. 2, Binghamton, NY, pp. 937–941.
10.
Settle, R. E. Jr., 1978, “A New Family of Microelectronic Packages for Avionics,” Solid State Technology, June, pp. 54–58.
11.
Sherry, W. M., and Hall, P. M., 1986, “Materials, Structures, and Mechanics of Solder Joints for Surface-Mount Microelectronics,” Proceedings of Third International Conference on lnterconnection Technology in Electronics, Fellbach, Germany, Feb., 18–20, pp. 47–81.
12.
Solomon
H. D.
,
1989
, “
Low Cycle Fatigue of Surface-Mounted Chip-Carrier/Printed Wiring Board Joints
,”
IEEE Transactions on Components, Hybrids, and Manufacturing Technology
, Vol.
12
, No.
4
, pp.
473
–
479
.
This content is only available via PDF.
Copyright © 1995
 by The American Society of Mechanical Engineers
You do not currently have access to this content.