This paper investigates a strain based crack propagation model, and discusses the application of fracture mechanics approach in the reliability validation of leadless solder joints. The model includes the creep effect at different temperatures and hold times, and correlates well the thermal cycling test of 90 Pb/10 Sn joints. By apply this model, an engineering method to develop the inspection criteria in accelerated reliability validation tests of leadless solder joints is proposed.
Issue Section:
Technical Briefs
Topics:
Crack propagation,
Solder joints,
Reliability,
Creep,
Fracture mechanics,
Inspection,
Temperature,
Tin
1.
Pao
Y.-H.
Govila
R.
Badgley
S.
Jih
E.
An Experimental and Finite Element Study of Thermal Fatigue Fracture of PbSn Solder Joints
,” ASME JOURNAL OF ELECTRONIC PACKAGING
, Vol. 115
, 1993
, pp. 1
–8
.2.
Li, C., Subrahmanyan, R., Wilcox, J. R., and Stone, D., “A Damage Integral Methodology for Thermal and Mechanical Fatigue of Solder Joints,” Solder Joint Reliability—Theory and Application, (Lau, ed.), Van Nostrand Reinhold, New York, N. Y., 1991, pp. 361–383.
3.
Guo, Z., Sprecher, A. F., and Conrad, H., “Effect of Sn Content on Crack Growth Rate in Low-Cycle Fatigue of Pb-Sn Solder Joints,” Proceedings of 5th Electronic Materials and Processing Congress, Cambridge, MA, ASM, 1992.
4.
Lau
J. H.
Thermal Fatigue Life Prediction of Flip Chip Solder Joint by Fracture Mechanics Method
,” International Journal of Fracture Mechanics
, Vol. 45
No. 5
, 1993
, pp. 643
–654
.5.
Guo
Z.
Conrad
H.
Fatigue Crack Growth Rate in 63Sn37Pb Solder Joints
,” ASME JOURNAL OF ELECTRONIC PACKAGING
, Vol. 115
, 1993
, pp. 159
–164
.6.
Paydar, N., Tong, Y., and Akay, H. U., “A Finite Element Study of Fatigue Life Prediction Methods For Thermally Loaded Solder Joints,” Advances in Electronic Packaging, EER-Vol. 4–2, ASME, 1993, pp. 1063–1069.
7.
Pao, Y., Jih, E., and Reddy, V., “Thermal Fatigue Life Prediction of Surface Mount Solder Interconnects—A Design Integrated Approach,” Mechanics and Materials for Electronic Packaging: Design and Process Issues, the Proceedings of ASME Winter Annual Meeting, AMD-Vol. 195, 1994, pp. 181–191.
8.
Hu
J. M.
Physics-of-Failure Based Component Qualification of Automotive Electronics
,” Communications in Reliability, Maintainability, and Supportability, An International Journal
, Vol. 1
, No. 2
, SAE, pp. 21
–33
, 1994
.9.
Hu, J. M., Barker, D., Dasgupta, A., and Arora, A., “The Role of Failure-Mechanism Identification in Accelerated Testing,” Journal of The Institute of Environmental Sciences, pp. 39–45, July/August 1993.
10.
Hu, J. M., “A Technique To Reduce Sample Size in Accelerated Reliability Qualification Tests,” Mechanics and Materials for Electronic Packaging: Design and Process Issues, the Proceedings of ASME Winter Annual Meeting, AMD-Vol. 195, 1994, pp. 117–123.
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