Failures of solder joints often result from development of cracks under complex mixed-mode loading conditions. In this study, a flexural peel technique was developed to investigate the growth of cracks at the interface between solder and Cu substrate. The technique was based on a tri-layer solder/Cu joints, with the solder layer sand-wiched between two Cu layers of desired thicknesses. Finite element analysis was used to calculate the mixed-mode condition at the crack tip as a function of the thicknesses of Cu outerlayers and the solder interlayer. The application of this technique to studying interface crack growth under fatigue loading is demonstrated for eutectic solder joints.
Issue Section:
Technical Papers
1.
Lau
J. H.
Rice
R. D.
Solder Joint Fatigue in Surface Mount Technology: State of the Art
,” Solid State Technology
, Vol. 28
, No. 10
, 1985
, pp. 91
–104
.2.
Solomon
H. D.
Low Cycle Fatigue of Surface-Mounted Chip Carrier/Printed Wiring Board Joints
,” IEEE Trans. Comp. Hybrids and Manuf. Technol.
, Vol. 12
, No. 4
, 1989
, pp. 473
–479
.3.
Bangs
E. R.
Beal
R. E.
Effect of Low Frequency Thermal Cycling on the Crack Susceptibility of Soldered Joints
,” Welding J.-Welding Res. Suppl.
, Vol. 54
, 1975
, pp. 377-s–388-s
377-s–388-s
.4.
Kang
S. K.
Zommer
N. D.
Feucht
D. L.
Heckel
R. W.
Thermal Fatigue Failure of Soft-Soldered Contacts to Silicon Power Transistors
,” IEEE Trans. Parts, Hybrids, and Packag.
, Vol. PHP–13
, 1977
, pp. 318
–321
.5.
Engelmaier
W.
Attarwala
A. L.
Surface-Mount Attachment Reliability of Clip-Loaded Ceramic Chip Carders on FR-4 Circuit Boards
,” IEEE Trans. Comp. Hybrids and Manuf. Technol.
, Vol. 12
, 1989
, pp. 284
–296
.6.
Seyyedi
J.
Thermal Fatigue of Low-Temperature Solder alloys in Insertion Mount Assembly
,” ASME JOURNAL OF ELECTRONIC PACKAGING
, Vol. 115
, 1993
, pp. 305
–311
.7.
Govila
R. K.
Pao
Y.-H.
Lamer
C.
Lau
J.
Twerefour
S.
Erasmus
S.
Dolot
S.
Failure Analysis of No-Clean and Water-Clean Solder Joints 0.4mm Pitch, 256-Pin Plastic Quad Flat Pack
,” ASME JOURNAL OF ELECTRONIC PACKAGING
, Vol. 116
, 1994
, pp. 184
–190
.8.
Yamada
S. E.
A Fracture Mechanics Approach to Soldered Joint Cracking
,” IEEE Trans. Comp. Hybrids and Manuf. Technol.
, Vol. 12
, No. 1
, 1989
, pp. 99
–104
.9.
Pao
Y.-H.
Pan
T.-Y.
Determination of Stress Intensity Factors for Interfacial Cracks in Bimaterial Systems
,” ASME JOURNAL OF ELECTRONICS PACKAGING
, Vol. 112
, 1990
, pp. 154
–161
.10.
Yao
D.
Shang
J. K.
Effect of Aging on Fatigue Crack Growth at Sn-Pb/Cu Interfaces
,” Metall. Mater. Trans. A
, Vol. 26A
, 1995
, pp. 2677
–2685
.11.
Lau
J. H.
Rice
D. W.
Avery
P. A.
Elastoplastic Analysis of Surface-Mount Solder Joints
,” IEEE Trans. Comp. Hybrids and Manuf. Technol.
, Vol. CHMT–10
, No. 3
, 1987
, pp. 346
–357
.12.
Zhang
Z.
Shang
J. K.
Subcritical Crack Growth at Bi-material Interfaces: Part I, Flexural Peel Technique
,” Metall. Mater. Trans. A
, Vol. 27A
, No. 1
, 1996
, pp. 205
–211
.13.
Rybicki
E. F.
Kanninen
M. F.
A Finite Element Calculation of Stress Intensity Factors by a Modified Crack Closure Integral
,” Engng. Fract. Mech.
, Vol. 9
, 1977
, pp. 931
–938
.14.
Raju
I. S.
Calculation of Strain Energy Release Rates with Higher Order and Singular Finite Elements
,” Engng. Fract. Mech.
, Vol. 28
, 1987
, pp. 251
–274
.15.
Wang
S. S.
Yau
J. F.
Interface Cracks in Adhensively Bonded Lap-Shear Joints
,” Int. J. Fracture
, Vol. 19
, 1982
, pp. 295
–309
.16.
Hamoush
S. A.
Ahmad
S. H.
Mode I and Mode II Stress Intensity Factors for Interfacial Cracks in Bi-material Media
,” Engng. Fract. Mech.
, Vol. 33
, 1989
, pp. 421
–427
.17.
Sun
C. T.
Jih
C. J.
On Strain Energy Release Rates for Interfacial Cracks in Bi-material Media
,” Engng. Fract. Mech.
, Vol. 28
, 1987
, pp. 13
–20
.18.
Yao, D., and Shang, J. K., “Effect of Load-Mix on Fatigue Crack Growth in Sn-Pb Solder Joints,” Proc. of 1995 ASME Winter Meeting, Nov. 12–17, 1995, San Francisco, CA, Paper number: 95-WA/EEP-10.
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