Issue Section:
Technical Papers
1.
Solomon
H. D.
Tolksdorf
E. D.
1995
, ASME Journal of Electronic Packaging
, Vol. 117
, pp. 130
–136
.2.
Coffin
F.
1954
, Trans. ASME
, Vol. 76
, pp. 931
–950
.3.
Manson, S. S., 1952, “Behavior of Materials Under Conditions of Thermal Stress,” Heat Transfer Symposium, Univ of Michigan, June 27–28, Univ. of Mich. Press; also NACA TN2933, July 1953.
4.
Manson
S. S.
1960
, Mech. Des.
, Vol. 32
(14
), pp. 139
–144
.5.
Coffin, L. F., Jr., 1969, “Predictive Parameters and their Application to High Temperature Low Cycle Fatigue.” Fracture, Proc. of Second International Conf. on Fatigue 1969, Chapman and Hall, London, pp. 643–654.
6.
Solomon, H. D., 1988, “The Influence of Hold Time and Fatigue Cycle Wave Shape on the Low Cycle Fatigue of 60/40 Solder,” 38 ECC, May 9, Los Angeles, CA. Also, GE Report Number 88CRD125, May 1988.
7.
Solomon, H. D., 1986, “Creep, Strain Rate Sensitivity and Low Cycle Fatigue of 60/40 Solder,” Brazing and Soldering, No. 11, Autumn, pp. 68–76. Also in GE Report No. 86CRD145.
8.
Grosskreutz, J. C., 1971, in ASTM STP495, ASTM, pp. 5–60.
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