Thermoelectric coolers (TEC) are potentially ideal devices to cool electronic components or small electronic enclosures. However, practical heat exchange can limit the COP and restrict the range of useful applications. The TEC must reject heat from the hot side to the ambient, which is typically air. The COP can be increased by reducing the hot-side temperature, which requires a high-performance heat exchanger. An understanding of the heat sources in the TEC is presented, and relations are presented to define the hot-side thermal resistance required to operate at desired operating conditions. A novel air-cooled thermosyphon reboiler-condenser system has been developed that promises significantly higher COP for thermoelectric coolers than is possible with current heat exchange technology. This heat exchanger design concept is described and compared to conventional technology.

Issue Section:
Technical Papers
Topics:
Heat, Thermoelectric cooling, Thermoelectric coolers, Heat exchangers, Condensers (steam plant), Design, Electronic components, Temperature, Thermal resistance
1.
Chen, J., and Yan, Z., 1994, “Optimal Performance of a Thermoelectric Refrigerator,” 13th Int’l. Conf. on Thermoelectrics, Amer. Inst. Physics, Woodbury, NY, pp. 199–202.
2.
Chien, L.-H., and Webb, R. L., 1996, “Parametric Studies of Nucleate Pool Boiling on Structured Surfaces: Part I—Effect of Tunnel Dimensions and Comparison of R-11,” ASME Proc. National Heat Transfer Conf., L. Witte et al., eds., Vol. 4, pp. 129–136.
3.
Chien, L.-H., and Webb, R. L., 1996, “Parametric Studies of Nucleate Pool Boiling on Structured Surfaces: Part II—Effect of Pore Diameter and Pore Pitch,” ASME Proc. National Heat Transfer Conf., Vol. 4, L. Witte et al., eds., pp. 137–144.
4.
Dahl, M. M., and Erb, L. D., 1976, “Liquid Heat Exchanger Interface and Method,” U.S. Patent 3,990,862.
5.
Goldsmid, H. J., 1986, Electronic Refrigeration, Pion, Ltd., London, pp.7–10.
6.
Goldsmid, H. J., 1995, “Conversion Efficiency and Figure of Merit,” CRC Handbook of Thermoelectrics, CRC Press, Boca Raton, FL., pp. 19–25.
7.
Haider, I., 1994, “A Theoretical and Experimental Study of Nucleate Pool Boiling Enhancement on Structured Surfaces,” PhD thesis, Pennsylvania State University, University Park, PA.
8.
Ioffe, A. F., 1957, Thermoelements and Thermoelectric Cooling, Infosearch Ltd., London, pp. 96–100.
9.
Modahl, R. J., and Lukeroth, V. C., 1982, “Heat Transfer Surface for Efficient Boiling of Liquid R-11 and its Equivalents,” U.S. Patent 4,354,550.
10.
Peterson, G. P., 1994, An Introduction to Heat Pipes, John Wiley & Sons, NY, pp. 147–152.
11.
Song, S., Lee, S., and Au, V., 1994, “Closed-Form Equation for Thermal Constriction/Spreading Resistances with Variable Resistance Boundary Conditions,” Proc. 1994 Int’l. Electronic Packaging Society Conf., Int’l. Elect. Packaging Soc., Edina, MN, pp. 111–121.
12.
Webb, R. L., 1994, Principles of Enhanced Heat Transfer, John Wiley & Sons, NY.
13.
Webb
R. L.
, and
Pais
C.
,
1992
, “
Nucleate Boiling Data for Five Refrigerants on Plain, Integral-Fin and Enhanced Tube Geometries
,”
International Journal Heat and Mass Transfer
, Vol.
35
, No.
8
, pp.
1893
–
1904
.
14.
Webb, R. L., Chang, Y., and Wang, C., 1995, “Heat Transfer and Friction Correlations for the Louver Fin Geometry,” 1995 Vehicle Thermal Management Systems Conference Proceedings, Soc. of Automotive Engineers, Warrendale, PA, pp. 533–541.
15.
Yang
C.-Y.
, and
Webb
R. L.
,
1996
, “
Condensation of R-12 in Small Hydraulic Diameter Extruded Aluminum Tubes with and without Micro-fins
,”
Int. Jour. Heat and Mass Transfer
, Vol.
39
, No.
4
, pp.
791
–
800
.
This content is only available via PDF.
Copyright © 1998
 by The American Society of Mechanical Engineers
You do not currently have access to this content.