Telephone companies use electronics to route calls between customers. The electronics are generally closely packed together and placed in steel containers outdoors. Forced air convection utilizing the outside ambient air is an effective means to cool outdoor electronic cabinets and is generally the system of choice given the relatively low cost and simplicity when compared to alternative cooling methods. Simple axial flow fans are typically turned on and off by a thermostat located inside the cabinet to keep the inside air temperature below a predetermined maximum. This simple cooling system is usually effective during summer operations. However, it may result in overheating and excessive thermal cycling in winter operations. Transient temperature data from experiments on a telecommunications cabinet is presented illustrating this problem. One possible solution to this problem is using continuously operating fans at low flow rates. This solution was arrived at through a combination of experimental testing and numerical simulation.

1.
Argento
C. W.
,
Joshi
Y. K.
,
Osterman
M. D.
,
1996
, “
Forced Convection Air-Cooling of a Commercial Electronic Chassis: An Experimental and Computational Case Study
,”
IEEE Transactions on Components, Packaging, and Manufacturing Technology—Part A
, Vol.
19
, No.
2
, pp.
248
257
.
2.
Bar-Cohen
A.
,
1992
, “
State-of-the-Art and Trends in the Thermal Packaging of Electronic Equipment
,”
ASME JOURNAL OF ELECTRONIC PACKAGING
, Vol.
114
, pp.
257
270
.
3.
Bar-Cohen
A.
,
Witzman
S.
,
1995
, “
Thermally Induced Failures in Electronic Equipment—Field Reliability Modeling
,”
International Journal of Microelectronic Packaging
, Vol.
1
, pp.
1
12
.
4.
Chu, R. U., and Simons, R. E., 1987, “Heat Transfer in Electronic Equipment,” in Heat Transfer in High Technology and Power Engineering, Hemisphere, New York, pp. 106–130.
5.
Deiters, T., and Hill, T. B., 1991, “Correlation of Experimental Measurements to Computer Modeling of a Forced Convection Cooled Electronics Enclosure,” presented at the ASME Winter Annual Meeting, Atlanta, Georgia, (91-WA-EEP-33).
6.
Hoffman, J. D., 1991, Numerical Methods for Engineers and Scientists, McGraw-Hill, New York.
7.
Jacobs
M. E.
,
1989
, “
The Practical Limits of Forced-Air Cooling of Electronic Equipment
,”
INTELEC
, Vol.
1
, pp.
1
4
.
8.
Juds, M. A., Chan, S. H., 1992, “Cabinet: A Lumped Parameter Computer Program for Multi-Compartment Vented Electronic Enclosures,” Proceedings, Advances in Electronic Packaging, ASME, New York, pp. 89–101.
9.
Kraus, A. D., Bar-Cohen, A., 1983, Thermal Analysis and Control of Electronic Equipment, Hemisphere, New York.
10.
McKay, J. R., 1989, “Predicting Transient Air Temperature Rise in Outdoor Cabinets Containing Telephone Equipment,” report no. TM-ARH-013463, Bell Communications Research.
11.
Press, W., Flannery, B., Teukolsky, S., Vetterling, W., 1989, Numerical Recipes, Cambridge University Press, New York.
12.
Reid, D. P., 1986, “Thermal Design and Simulation of In-Cabinet Electronic Equipment,” INTELEC, pp. 371–375.
13.
Steinberg, D., 1991, Cooling Techniques for Electronic Equipment, John Wiley & Sons, New York.
14.
Suhir, E., Lee, Y. C., 1989, “Thermal, Mechanical, and Environmental Durability Design Methodologies,” in Electronic Materials Handbook, Vol. 1, ASME, New York.
15.
Zimmerman
E. B.
, and
Colwell
G. T.
,
1996
, “
Transient Modeling of the Thermal Behavior of Outdoor Electronic Cabinets
,”
ASME JOURNAL OF ELECTRONIC PACKAGING
, Vol.
118
, pp.
258
263
.
16.
Zivanovic, M., 1990, “An Approach to the Design of a Forced-Air Cooling System for I/O Cards in Standard 19-inch Card Frames,” in Heat Transfer in Electronic and Microelectronic Equipment, A. E. Errgles, ed., Hemisphere, New York, pp. 381–392.
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