The effect of heat-spreader sizes on the temperature distribution, thermal resistance, and cooling power of a set of cost-effective cavity-down plastic ball grid array (PBGA) packages assembled on a FR-4 epoxy glass printed circuit board (PCB) is presented. The sizes of these packages are 35 × 35 mm and 40 × 40 mm with 4 and 5 rows of solder balls.

Issue Section:
Technical Papers
Topics:
Ball-Grid-Array packages, Cavities, Flat heat pipes, Ball-Grid-Array packaging, Cooling, Epoxy adhesives, Epoxy resins, Glass, Printed circuit boards, Solders, Temperature distribution, Thermal resistance
1.
Lau
J.
, and
Chen
K.
,
1997
, “
Thermal and Mechanical Evaluations of a Cost-Effective Plastic Ball Grid Array Package
,”
ASME Transactions, Journal of Electronic Packaging
, Vol.
119
, pp.
208
–
212
.
2.
Lau, J., and Pao, Y., 1997, Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies, McGraw-Hill, New York.
3.
Lau, J. H., et al., 1998, “Single-Core Two-Side Substrate with µ-Strip and Co-Plane Signal Trace, and Power and Ground Planes Through Split-Wrap-Around (SWA) or Split-Via-Connections (SVC) for Packaging IC Devices,” US Patent No. 5,825,084.
4.
Lau
J.
, and
Chen
T.
,
1998
, “
Cooling Assessment and Distribution of Heat Dissipation of A Cavity Down Plastic Ball Grid Array Package—NuBGA
,”
IMAPS Transactions, International Journal of Microcircuits & Electronic Packaging
, Vol.
21
, No.
1
. pp.
109
–
118
.
5.
Lau
J.
, and
Chou
T.
,
1998
, “
Electrical Design of a Cost-Effective Thermal Enhanced Plastic Ball Grid Array Package—NuBGA
,”
IEEE Transactions on CPMT, Part B
, Vol.
21
, No.
1
, pp.
35
–
42
.
6.
Lau
J.
,
Chen
K.
, and
Wu
F.
,
1998
, “
Thermal Performance of a Low-Cost Thermal Enhanced Plastic Ball Grid Array Package—NuBGA
,”
Microelectronics International
, Vol.
15
, No.
2
, pp.
25
–
33
.
7.
Lau
J.
,
Chen
T.
, and
Chou
T.
,
1998
, “
Design, Analysis, and Measurement of the Cost Effective Substrate of a Plastic Ball Grid Array Package—NuBGA
,”
Circuit World
, Vol.
25
, No.
2
, pp.
41
–
48
.
8.
Tummala, R., Rymaszewski, E., and Klopfenstein, A., 1997, Microelectronics Packaging Handbook, Chapman & Hall, New York.
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