In this paper, flow during the filling and post-filling stages in semiconductor chip encapsulation has been analyzed. A finite-element method based on the Hele-Shaw approximation is used for the flow analysis in the chip cavity. The compressibility of the epoxy-molding compound has been considered to analyze the post-filling stage. The model has been verified by comparing resulting predictions with experimental results. Specifically, pressure has been measured in a rectangular cavity and compared with simulation results. The calculated and experimental results show good agreement. [S1043-7398(00)00101-8]
Integrated Flow Analysis During Filling and Post-Filling Stage of Semiconductor Encapsulation
Contributed by the Electrical and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received by the EEPD April 5, 1999; revision received August 17, 1999. Associate Technical Editor: A. Tay.
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Han , S., and Wang, K. K. (August 17, 1999). "Integrated Flow Analysis During Filling and Post-Filling Stage of Semiconductor Encapsulation ." ASME. J. Electron. Packag. March 2000; 122(1): 20–27. https://doi.org/10.1115/1.483127
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