This paper presents, discusses, and compares results from experimental and computational studies of the plastic encapsulation process for a 144-lead TQFP package. The experimental results were obtained using an instrumented molding press, while the computational predictions were obtained using a newly-developed software for modeling transfer molding processes. Validation of the software is emphasized, and this was done mainly by comparing the computational results with the corresponding experimental measurements for pressure, temperature, and flow front advancement in the cavities and runners. The experimental and computational results were found to be in good agreement, especially for the flow-front shapes and locations. [S1043-7398(00)00502-8]
Computational Modeling and Validation of the Encapsulation of Plastic Packages by Transfer Molding
Contributed by the Electrical and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received by the EEPD August 19, 1988; revision received September 21, 1999. Associate Technical Editor: G. De Mey.
- Views Icon Views
- Share Icon Share
- Search Site
Nguyen , L., Quentin , C., Lee, W., Bayyuk, S., Bidstrup-Allen , S. A., and Wang, S. (September 21, 1999). "Computational Modeling and Validation of the Encapsulation of Plastic Packages by Transfer Molding ." ASME. J. Electron. Packag. June 2000; 122(2): 138–146. https://doi.org/10.1115/1.483146
Download citation file: