The effect of altitude on electronic cooling is evaluated experimentally. Material properties of air vary as a function of altitude due to changes in atmospheric pressure and temperature. These changes have a negative impact on the heat transfer effectiveness and result in higher component temperature when compared to sea level conditions. Experiments are carried out in a hypobaric chamber using electronic printed circuit boards populated with heated rectangular blocks placed in a small wind tunnel. The altitude is varied between 0 and 5000 m above sea level and the air speed is varied between 1 and 5 m/s. The results show the local adiabatic heat transfer coefficient and thermal wake function diminish with altitude. This information is useful for design and analysis of electronic equipment for operation over a range of altitudes and air speeds typically encountered in forced air convection cooling applications.
Experimental Evaluation of Air-Cooling Electronics at High Altitudes
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received by the EPPD December 20, 1999. Associate Editor: Y. Joshi.
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Wong, H., and Peck, R. E. (December 20, 1999). "Experimental Evaluation of Air-Cooling Electronics at High Altitudes ." ASME. J. Electron. Packag. December 2001; 123(4): 356–365. https://doi.org/10.1115/1.1392319
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