This study presents an efficient method to accurately predict solder joint geometry after a reflow process. The proposed method can be utilized for Solder Mask Defined (SMD), Non-Solder Mask Defined (NSMD), or C4 type solder joints. The reflow process involves several design factors capable of influencing the final shape of the molten solder joint, such as solder joint volume, restoring force, surface tension, contact angle, pad thickness, and pad size. These factors are all considered in the calculations. The computed results are compared with those using the Surface Evolver program and also with available numerical/experimental results. Their excellent agreement shows that the method developed herein can be practically applied to predict the reflow shape of SMD/NSMD solder joints. The difference between SMD and NSMD is also examined in detail. Results in this study provide designers with a fundamental guideline for accurately predicting the liquid formation of solder joints during the reflow process.
Prediction of Liquid Formation for Solder and Non-Solder Mask Defined Array Packages
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received by the EPPD August 18, 1999. Associate Editor: Aji-Hain Pas.
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Chen, W., Chiang, K., and Lin, S. (August 18, 1999). "Prediction of Liquid Formation for Solder and Non-Solder Mask Defined Array Packages ." ASME. J. Electron. Packag. March 2002; 124(1): 37–44. https://doi.org/10.1115/1.1401738
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