In this study, a large number of creep tests were carried out to study the effect of stress level and testing temperature on the creep behavior of 63 Sn/37Pb solder in a systematic manner. Based on the dislocation controlled creep mechanism and Gibbs’ free-energy theory, a new creep constitutive model was proposed. The model was found to describe accurately the creep flow of the solder and to be capable of explaining the issues of stress and temperature dependent stress exponent and activation energy in the Arrhenius power-law creep model. Furthermore, the model was employed to predict accurately the long-term reliability of solder joints in a PBGA assembly.
A New Creep Constitutive Model for Eutectic Solder Alloy
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received by the EPPD September 27, 2000. Associate Editor: S. M. Henrich.
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Shi, X. Q., Wang, Z. P., Zhou , W., Pang, H. L. J., and Yang, Q. J. (May 2, 2002). "A New Creep Constitutive Model for Eutectic Solder Alloy ." ASME. J. Electron. Packag. June 2002; 124(2): 85–90. https://doi.org/10.1115/1.1462624
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