The power density of portable electronic devices continues to increase because packaging advances reduce their size even as features are added and enhanced. Designing thermal management systems to accommodate steady-state conditions as opposed to fixed duty cycles can substantially increase cost, size, and weight. The feasibility of transient thermal management of handsets using phase change materials (PCMs) was experimentally investigated using an ABS handset mock-up. At selected intervals of time, the nonuniform case temperature of the handset was measured using an infrared (IR) camera, while thermocouples measured the temperatures of the PCM and simulated power amplifier (heater). Transient and steady-state heat transfer rates by natural convective and radiation from the handset to the environment were numerically computed from the temperature data in the thermal images. The effects of PCM material, power supplied to the handset, and handset orientation on the time required for the handset case to reach a given (maximum) temperature and “recovery” time were examined.
Transient Thermal Management of a Handset Using Phase Change Material (PCM)
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received by the EPPD Division, September 13, 2000; revised manuscript received October 5, 2001. Associate Editor: R. Wirtz.
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Hodes, M., Weinstein, R. D., Pence, S. J., Piccini, J. M., Manzione, L., and Chen, C. (December 12, 2002). "Transient Thermal Management of a Handset Using Phase Change Material (PCM) ." ASME. J. Electron. Packag. December 2002; 124(4): 419–426. https://doi.org/10.1115/1.1523061
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