PBGA has the advantage of being compatible with existing surface-mount process. The eutectic solder balls collapse during reflow accommodates the lack of co-planarity, the surface tension between solder ball and associated pad creates a strong self-centering property to compensate for any placement offsets. However, some problems emerged in practice due to its special features. The major challenges for manufacturer are the inspection of solder joint and to perform touch-up. In most cases, the defect of solder joint cannot be found until in-circuit or functional testing is performed. At this stage, it becomes difficult to determine whether the defect is due to a solder joint or the component itself. Hence controlling the open defect is very important in the PBGA assembling process. It was found that three kinds of defective modes are responsible for the open defect; insufficient heating in the solder melting phase, poor thermal stability of PCB and PBGA and insufficient amount of printing solder paste. Based on the defect mechanism analysis, by optimizing the soldering process, very high assembly yield was achieved.
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e-mail: shfan@ee.cityu.edu.hk
e-mail: eeycchan@cityu.edu.hk
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March 2003
Technical Briefs
Open Defects in PBGA Assembly Solder Joints
S. H. Fan,
e-mail: shfan@ee.cityu.edu.hk
S. H. Fan
Department of Electronic Engineering, City University of Hong Kong, Kowloon, Hong Kong
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Y. C. Chan,
e-mail: eeycchan@cityu.edu.hk
Y. C. Chan
Department of Electronic Engineering, City University of Hong Kong, Kowloon, Hong Kong
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J. K. L. Lai
J. K. L. Lai
Department of Physics and Materials Science, City University of Hong Kong, Kowloon, Hong Kong
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S. H. Fan
Department of Electronic Engineering, City University of Hong Kong, Kowloon, Hong Kong
e-mail: shfan@ee.cityu.edu.hk
Y. C. Chan
Department of Electronic Engineering, City University of Hong Kong, Kowloon, Hong Kong
e-mail: eeycchan@cityu.edu.hk
J. K. L. Lai
Department of Physics and Materials Science, City University of Hong Kong, Kowloon, Hong Kong
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received by the EPPD Division, March 19, 2002. Associate Editor: Y.-H. Pao.
J. Electron. Packag. Mar 2003, 125(1): 157-161 (5 pages)
Published Online: March 14, 2003
Article history
Received:
March 19, 2002
Online:
March 14, 2003
Citation
Fan , S. H., Chan , Y. C., and Lai , J. K. L. (March 14, 2003). "Open Defects in PBGA Assembly Solder Joints ." ASME. J. Electron. Packag. March 2003; 125(1): 157–161. https://doi.org/10.1115/1.1536951
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