We developed a theoretical model of a novel thermal laser shock method for separation of glass and glass-ceramic wafers into chips. The suggested model allowed us to determine the operating parameters of the device for wafer splitting. The investigated method involves two stages: 1) formation of a surface (blind) microcrack (or a grid of surface microcracks) using a double thermal shock method, and 2) splitting the cracked wafer into chips along the microcrack contour by applying small bending stresses. The emphasis was given to splitting of thin wafers with the thickness less than 1 mm. The latter process is more involved because of the undesirable spontaneous transition of a surface microcrack into a through crack.

Issue Section:
Technical Papers
Keywords:
glass ceramics, microcracks, thermal shock, bending, fracture, internal stresses, thermal analysis, laser beam applications
Topics:
Fracture (Materials), Laser beams, Lasers, Microcracks, Semiconductor wafers, Thermal shock, Thermal stresses, Temperature
1.
Suhir, E., 1988, “Thermal Stress Failures in Microelectronic Components—Review and Extension,” Advances in Thermal Modeling of Electronic Components and Systems, Vol. 1, A. Bar-Cohen and A. D. Kraus, eds., Hemisphere, New York, pp. 337–412.
2.
Hnatek, E., 1987, Integrated Circuit Quality and Reliability, Marcel Dekker, New York, 698 pp.
3.
Lumley
,
R.
,
1969
, “
Controlled Separation of Brittle Materials Using a Laser
,”
Am. Ceram. Soc. Bull.
,
48
, pp.
850
–
854
.
4.
Powell, J., 1993, CO2-Laser Cutting, Springer-Verlag, Berlin, 246 pp.
5.
Karaev
,
A.
, and
Kornilov
,
A.
,
1982
, “
Analysis of Peculiarities of the Separation Process of Semiconductor Wafers into Segments Used in the IC Technology
,”
Phys. Chem. Mater. Treat.
,
1
, pp.
64
–
67
.
6.
Elperin
,
T.
,
Kornilov
,
A.
, and
Rudin
,
G.
,
2000
, “
Formation of Surface Microcrack for Separation of Nonmetallic Wafers Into Chips
,”
ASME J. Electron. Packag.
,
122
, pp.
317
–
322
.
7.
Elperin, T., Kornilov, A., and Rudin, G., 1997, “Advanced Laser Technology for Precise Separation of Brittle Non-Metallic Materials,” Abstracts of the 8th Israel Materials Engineering Conference, Beer-Sheva, April 16–17.
8.
Elperin, T., Kornilov, A., and Rudin, G., 2000, “Formation of Surface Microcracks and Separation of Non-Metallic Materials Using a Laser Thermal Shock,” Abstracts and Proceedings of the 28th Israel Conference on Mechanical Engineering, Beer-Sheva, June 14–15, pp. 411–412.
9.
Liu
,
G.
,
Morsi
,
Y.
, and
Van Der Walt
,
J.
,
1999
, “
Analysis of Spray Cooling Heat Flux
,”
ASME J. Heat Transfer
,
121
, pp.
742
–
745
.
10.
Noda, N., Hetnarski, R., and Tanigawa, Y., 2000, Thermal Stresses, Lastran Corporation, New York, 333 pp.
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