In this paper, a semi-implicit time integration scheme has been developed for a damage-coupled constitutive model to characterize the mechanical behavior of 63Sn-37Pb solder material under thermo-mechanical fatigue (TMF) loading. The scheme is developed to provide an efficient numerical procedure of integration and iteration for calculating stress and other associated state variables within a strain-driven format. In particular, a novel Newton-Raphson iteration algorithm for the damage coupled constitutive material model involving von Mises viscoplastic potential function with nonlinear mixed hardening is formulated. An algorithmic tangent stiffness tensor is derived and the model is implemented numerically into a commercial finite element (FE) code ABAQUS through its user-defined material subroutine. Several numerical simulations are conducted for validation of the proposed algorithm.
Time Integration Algorithm for a Cyclic Damage Coupled Thermo-Viscoplasticity Model for 63Sn-37Pb Solder Applications
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received March 2003; final revision, September 2003. Associate Editor: E. Lorenzini.
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Yang , X., Chow, C. L., and Lau, K. J. (April 30, 2004). "Time Integration Algorithm for a Cyclic Damage Coupled Thermo-Viscoplasticity Model for 63Sn-37Pb Solder Applications ." ASME. J. Electron. Packag. March 2004; 126(1): 148–158. https://doi.org/10.1115/1.1649246
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