System-in-a-Package (SiP) aims to integrate the entire system functions within a system-level package containing multiple ICs and other components interconnected in a high-density substrate. A structure based on the SiP concept is proposed in this paper. Based on this SiP structure, four substrate candidates, namely FR4, liquid crystal polymer (LCP), teflon (PTFE) and low temperature co-fired ceramic (LTCC) were compared by assessing and measuring their mechanical reliability, electrical performance and environmental influence. First, to evaluate long-term reliability, the 3D finite element method (FEM) was used to calculate the stress distribution and warpage of the whole package. Both three-point bending and cooling in the manufacturing process were taken into consideration. The LCP has a coefficient of thermal expansion (CTE) close to that of the silicon chip, and a Young’s module close to that of FR4, which gave the best reliability in both bending and cooling situations. Next, the dielectric constants and the loss tangent for the four substrates were evaluated in the electrical performance investigation. The LCP has a low relative dielectric constant and a low dissipation factor for the frequency range 1 GHz to 35 GHz, making it a good substrate for high frequency applications. An environmental assessment included several environmental impact categories; this assessment indicated that LCP is the most environmentally acceptable substrate.
Skip Nav Destination
e-mail: liu.chen@me.chalmers.se
Article navigation
June 2004
Technical Papers
Characterization of Substrate Materials for System-in-a-Package Applications
Liu Chen,
e-mail: liu.chen@me.chalmers.se
Liu Chen
Swedish Microsystem Integration Technology (SMIT) Center, Division of Electronics Production, School of Mechanical Engineering, Chalmers University of Technology, SE 412 96, Go¨teborg, Sweden
Search for other works by this author on:
Anders S. G. Andræ,
Anders S. G. Andræ
Swedish Microsystem Integration Technology (SMIT) Center, Division of Electronics Production, School of Mechanical Engineering, Chalmers University of Technology, SE 412 96, Go¨teborg, Sweden
Search for other works by this author on:
Gang Zou,
Gang Zou
Swedish Microsystem Integration Technology (SMIT) Center, Division of Electronics Production, School of Mechanical Engineering, Chalmers University of Technology, SE 412 96, Go¨teborg, Sweden
Search for other works by this author on:
Johan Liu
Johan Liu
Swedish Microsystem Integration Technology (SMIT) Center, Division of Electronics Production, School of Mechanical Engineering, Chalmers University of Technology, SE 412 96, Go¨teborg, Sweden
Search for other works by this author on:
Liu Chen
Swedish Microsystem Integration Technology (SMIT) Center, Division of Electronics Production, School of Mechanical Engineering, Chalmers University of Technology, SE 412 96, Go¨teborg, Sweden
e-mail: liu.chen@me.chalmers.se
Anders S. G. Andræ
Swedish Microsystem Integration Technology (SMIT) Center, Division of Electronics Production, School of Mechanical Engineering, Chalmers University of Technology, SE 412 96, Go¨teborg, Sweden
Gang Zou
Swedish Microsystem Integration Technology (SMIT) Center, Division of Electronics Production, School of Mechanical Engineering, Chalmers University of Technology, SE 412 96, Go¨teborg, Sweden
Johan Liu
Swedish Microsystem Integration Technology (SMIT) Center, Division of Electronics Production, School of Mechanical Engineering, Chalmers University of Technology, SE 412 96, Go¨teborg, Sweden
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received July 2003. Associate Editor: G.-Q. Lu.
J. Electron. Packag. Jun 2004, 126(2): 195-201 (7 pages)
Published Online: July 8, 2004
Article history
Received:
July 1, 2003
Online:
July 8, 2004
Citation
Chen, L., Andræ , A. S. G., Zou , G., and Liu, J. (July 8, 2004). "Characterization of Substrate Materials for System-in-a-Package Applications ." ASME. J. Electron. Packag. June 2004; 126(2): 195–201. https://doi.org/10.1115/1.1648057
Download citation file:
Get Email Alerts
Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability
J. Electron. Packag
Related Articles
Development of G-Helix Structure as Off-Chip Interconnect
J. Electron. Packag (June,2004)
Special Section on InterPACK 2013
J. Electron. Packag (December,2014)
Comparative Study of Phenolic-Based and Amine-Based Underfill Materials in Flip Chip Plastic Ball Grid Array Package
J. Electron. Packag (December,2010)
Related Proceedings Papers
Related Chapters
Design for Displacement Strains
Process Piping: The Complete Guide to ASME B31.3, Fourth Edition
Stress Concentration Factors in Multiple Row Joints
Structural Shear Joints: Analyses, Properties and Design for Repeat Loading
Telecom: A Field with Myths and Mistakes All Its Own
More Hot Air