Background: This paper presents a reduced mathematical model using a practical numerical formulation of the thermal behavior of an integrated power electronics module (IPEM). This model is based on the expanded lumped thermal capacitance method (LTCM), in which the number of variables involved in the analysis of heat transfer is reduced only to time. Method of Approach: By applying the LTCM, a simple, nonspatial, but highly nonlinear model is obtained for the case of the IPEM Generation II. Steady and transient results of the model are validated against results from a three-dimensional, transient thermal analysis software tool, FLOTHERM™ 3.1. The electrothermal coupling was obtained by implementing the reduced-order thermal model into the SABER™ circuit simulator. Two experimental setups, for low- and high-speed thermal responses, were developed and used to calibrate the reduced model with actual data. Results: The comparison of the LTCM model implemented in a Generation II IPEM with FLOTHERM 3.1 results compared very favorably in terms of accuracy and efficiency, reducing the computational time significantly. Additional validations of the reduced thermal model were made using experiment data for the low-speed thermal response at different constant powers, and good agreement was demonstrated in all cases. A comparison between SABER™ simulations, which incorporated the proposed LTCM, and the fast thermal experimental response results is also presented to validate the dynamic electrothermal model response, and excellent agreement was found for this case. Conclusions: The good agreement found for all three cases presented, the three-dimensional, transient numerical formulation, and the low- and high-speed experimental data indicates that reduced electrothermal models are an excellent alterative for design methodologies of new generations of IPEMs.
Dynamic Reduced Electrothermal Model for Integrated Power Electronics Modules (IPEM)
Manuscript received May 3, 2004; revision received May 21, 2004. Review conducted by: B. Sammakia.
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Herna´ndez-Mora, M., Gonza´lez, J. E., Ve´lez-Reyes, M., Ortiz-Rodrı´guez, J. M., Pang , Y., and Scott, E. (January 24, 2005). "Dynamic Reduced Electrothermal Model for Integrated Power Electronics Modules (IPEM) ." ASME. J. Electron. Packag. December 2004; 126(4): 477–490. https://doi.org/10.1115/1.1827264
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