In this technical brief, we describe a simple, yet versatile solder shape prediction model that can handle inclination (as is likely to occur when warped substrates are used) and misalignment of the top pad of the solder joint relative to the bottom pad. The developed model is general in nature and is demonstrated on a solder joint with circular top and bottom pads and on a stud joint where the interconnection is to a stud on which the wetted area is to be determined through simulation. The model was able to accurately predict the solder profiles from literature with an error of . A program written within the MATHEMATICA® environment was developed and used for the above simulations.
Issue Section:
Technical Briefs
1.
Heinrich
, S. M.
, and Lee
, P. S.
, 1997, “Solder Geometry Prediction in Electronic Packaging: An Overview
,” Advances in Electronic Packaging
, ASME
, New York
, Vol. 2
, pp. 1371
–1381
.2.
Subbarayan
, G.
, 1996, “A Procedure for Automated Shape and Life Prediction in Flip-Chip and BGA Solder Joints
,” ASME J. Electron. Packag.
1043-7398, 118
(3
), pp. 127
–133
.3.
Rayasam
, M.
, Thompson
, T. B.
, Subbarayan
, G.
, Gurumurthy
, C.
, and Wilcox
, J. R.
, 2006, “A Model for Assessing the Shape of Solder Joints in the Presence of PCB and Package Warpage
,” ASME J. Electron. Packag.
1043-7398, 128
, pp. 184
–191
.4.
Patra
, S. K.
, and Lee
, Y. C.
, 1991, “Quasi-Static Modeling of the Self Alignment Mechanism in Flip-Chip Soldering-Part 1: Single Solder Joint
,” ASME J. Electron. Packag.
1043-7398, 113
(4
), pp. 337
–342
.5.
Katyl
, R. H.
, and Pimbley
, W. T.
, 1992, “Shape and Force Relationships for Molten Axisymmetric Solder Connections
,” ASME J. Electron. Packag.
1043-7398, 114
(3
), pp. 336
–341
.Copyright © 2006
by American Society of Mechanical Engineers
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