An experimental study was conducted to determine the performances of silicon microheat pipes (MHPs) filled with different fluids. The MHP arrays are made of 27 triangular microchannels chemically etched in a silicon wafer. This wafer is closed by molecular bonding of a bulk oxidized silicon wafer. The results show that the use of MHPs with low liquid charges can increase the effective thermal conductivity of the array. The best improvement of the effective thermal conductivity of the MHP array is equal to 41% for methanol and pentane, 12% for ethanol and nil for water and FC72.
Issue Section:
Technical Briefs
Keywords:
heat pipes,
microchannel flow,
thermal conductivity,
electronics packaging,
microheat pipe,
experiment,
heat transfer,
silicon technology,
effective thermal conductivity
Topics:
Fluids,
Methanol,
Microchannels,
Pipes,
Silicon,
Thermal conductivity,
Semiconductor wafers,
Water,
Bonding,
Ethanol,
Temperature
1.
Zagdhoudi
, M. C.
, Sartre
, V.
, and Lallemand
, M.
, 1997, “Theoretical Investigation of Micro Heat Pipe Performances
,” 10th IHPC
, Stuttgart, Germany, Sept. 21–25.2.
Kang
, S.-W.
, and Huang
, D.
, 2002, “Fabrication of Star Grooves and Rhombus Grooves Micro Heat Pipe
,” J. Micromech. Microeng.
0960-1317, 12
, pp. 525
–531
.3.
Peterson
, G. P.
, Duncan
, A. B.
, and Weichold
, M. H.
, 1993, “Experimental Investigation of Micro Heat Pipes Fabricated in Silicon Wafers
,” ASME J. Heat Transfer
0022-1481, 115
, pp. 751
–756
.4.
Badran
, B.
, Gerner
, F. M.
, Ramadas
, P.
, Henderson
, T.
, and Baker
, K. W.
, 1997, “Experimental Results for Low-Temperature Silicon Micromachined Micro Heat Pipe Arrays Using Water and Methanol as Working Fluids
,” Exp. Heat Transfer
0891-6152, 10
, pp. 253
–272
.5.
Lee
, M.
, Wong
, M.
, and Zohar
, Y.
, 2003, “Characterization of an Integrated Micro Heat Pipe
,” J. Micromech. Microeng.
0960-1317, 13
, pp. 58
–64
.6.
Launay
, S.
, Sartre
, V.
, and Lallemand
, M.
, 2004, “Experimental Study on Silicon Micro-Heat Pipe Arrays
,” Appl. Therm. Eng.
1359-4311, 24
(2–3
), pp. 233
–243
.7.
Tong
, Q. Y.
, and Gösele
, U.
, 1999, Semiconductor Wafer Bonding: Science and Technology
, Wiley
, New York
.8.
Cioulachtjian
, S.
, Launay
, S.
, and Lallemand
, M.
, 2003, “Angles de Contact en Milieu Saturé d’une Goutte d’Eau sur une Surface d’Oxyde de Silicium
,” SFT 2003
, Elsevier
, Paris
, pp. 403
–407
.Copyright © 2006
by American Society of Mechanical Engineers
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