An accurate and efficient analytical geometric method is presented for predicting the geometric parameters of the controlled collapse chip connection type solder joint using direct chip attach technology after a reflow process. By this method, the meridian of the solder joint is first discretized as a series of sufficiently fine fragmental arcs. After calculating the internal pressure inside the molten eutectic solder from the forces balance, the meridional and circumferential radii of curvature of each arc are then obtained from the Laplace-Young equation. As a result, the coordinates of each node of the arc and the solder joint geometry can be determined in turn. The factors that affect the final shape of the molten eutectic solder joints, including the solder volumes, external loading, pad size, surface tension of molten eutectic solder, and interfacial surface tension between the molten eutectic solder and the solid high-lead bump are considered herein. The results computed by the analytical geometric method are also compared with those obtained using the Surface Evolver program, the extended Heinrich’s model, and the experimental results. The results of the various approaches are mutually consistent.
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e-mail: whchen@pme.nthu.edu.tw
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December 2006
Research Papers
Predicting the Liquid Formation for the Solder Joints in Flip Chip Technology
Wen-Hwa Chen,
Wen-Hwa Chen
Tsing Hua Professor of Engineering
Fellow ASME
Department of Power Mechanical Engineering,
e-mail: whchen@pme.nthu.edu.tw
National Tsing Hua University
, Hsinchu, Taiwan 30043, Republic of China
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Shu-Ru Lin,
Shu-Ru Lin
Graduate Student
Department of Power Mechanical Engineering,
National Tsing Hua University
, Hsinchu, Taiwan 30043, Republic of China
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Kuo-Ning Chiang
Kuo-Ning Chiang
Professor
Fellow ASME
Department of Power Mechanical Engineering,
National Tsing Hua University
, Hsinchu, Taiwan 30043, Republic of China
Search for other works by this author on:
Wen-Hwa Chen
Tsing Hua Professor of Engineering
Fellow ASME
Department of Power Mechanical Engineering,
National Tsing Hua University
, Hsinchu, Taiwan 30043, Republic of Chinae-mail: whchen@pme.nthu.edu.tw
Shu-Ru Lin
Graduate Student
Department of Power Mechanical Engineering,
National Tsing Hua University
, Hsinchu, Taiwan 30043, Republic of China
Kuo-Ning Chiang
Professor
Fellow ASME
Department of Power Mechanical Engineering,
National Tsing Hua University
, Hsinchu, Taiwan 30043, Republic of ChinaJ. Electron. Packag. Dec 2006, 128(4): 331-338 (8 pages)
Published Online: September 29, 2005
Article history
Received:
December 29, 2004
Revised:
September 29, 2005
Citation
Chen, W., Lin, S., and Chiang, K. (September 29, 2005). "Predicting the Liquid Formation for the Solder Joints in Flip Chip Technology." ASME. J. Electron. Packag. December 2006; 128(4): 331–338. https://doi.org/10.1115/1.2229216
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