A vapor chamber using high thermal conductivity and permeability graphite foam as a wick has been designed, built, and tested. With ethanol as the working fluid, the vapor chamber has been demonstrated at a heat flux of . The effects of the capillary limit, the boiling limit, and the thermal resistance in restricting the overall performance of a vapor chamber have been analyzed. Because of the high thermal conductivity of the graphite foams, the modeling results show that the performance of a vapor chamber using a graphite foam is about twice that of one using a copper wick structure. Furthermore, if water is used as the working fluid instead of ethanol, the performance of the vapor chamber will be increased further. Graphite foam vapor chambers with water as the working fluid can be made by treating the graphite foam with an oxygen plasma to improve the wetting of the graphite by the water.
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December 2006
Research Papers
A Graphite Foams Based Vapor Chamber for Chip Heat Spreading
Minhua Lu,
Minhua Lu
IBM T.J. Watson Research Center
, 1101 Kitchawan Road, Yorktown Heights, NY 10598
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Larry Mok,
Larry Mok
IBM T.J. Watson Research Center
, 1101 Kitchawan Road, Yorktown Heights, NY 10598
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R. J. Bezama
R. J. Bezama
IBM Microelectronics Division
, Route 52, Hopewell Junction, NY 12533
Search for other works by this author on:
Minhua Lu
IBM T.J. Watson Research Center
, 1101 Kitchawan Road, Yorktown Heights, NY 10598
Larry Mok
IBM T.J. Watson Research Center
, 1101 Kitchawan Road, Yorktown Heights, NY 10598
R. J. Bezama
IBM Microelectronics Division
, Route 52, Hopewell Junction, NY 12533J. Electron. Packag. Dec 2006, 128(4): 427-431 (5 pages)
Published Online: November 15, 2005
Article history
Received:
September 30, 2005
Revised:
November 15, 2005
Citation
Lu, M., Mok, L., and Bezama, R. J. (November 15, 2005). "A Graphite Foams Based Vapor Chamber for Chip Heat Spreading." ASME. J. Electron. Packag. December 2006; 128(4): 427–431. https://doi.org/10.1115/1.2351908
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