Solder joint fatigue failure under vibration loading continues to be a concern in microelectronic industry. Existing literature has not adequately addressed high-cycle fatigue failure of high-lead solder joints, especially under a broad spectrum of vibration frequencies. Also, damage mapping across solder joints in an area-array package has not been effectively studied using numerical models and experimental cross sectioning. This paper aims to develop an experimental and modeling approach that can accurately determine the solder joint behavior of electronic components under vibration conditions. In particular, this paper discusses the out-of-plane sinusoidal vibration experiments at , numerical modeling, and fatigue life prediction for a 1089 input∕output ceramic column grid array (CCGA) package on a FR4 board. Detailed investigation and characterization involving dye-and-pry analysis, microstructural examination, and numerical modeling enabled the development of a high-cycle stress-based equation for lead-containing CCGA under sinusoidal loading. The developed approach has been applied to a number of cases including a CCGA package with a heat sink as well as a CCGA package subjected to frequency sweeps. It is seen that the predictions from the developed model agree well with experimental data and that the developed model can map the evolution of solder damage across all solder joints and can also provide important design recommendations in terms of solder joint location as well as heat sink attachment.
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e-mail: suresh.sitaraman@me.gatech.edu
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March 2008
Research Papers
Analysis and Prediction of Vibration-Induced Solder Joint Failure for a Ceramic Column Grid Array Package
Andy Perkins,
Andy Perkins
Computer Aided Simulation for Package Reliability (CASPaR) Laboratory, The George W. Woodruff School of Mechanical Engineering,
Georgia Institute of Technology
, Atlanta, GA 30332-0569
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Suresh K. Sitaraman
Suresh K. Sitaraman
Computer Aided Simulation for Package Reliability (CASPaR) Laboratory, The George W. Woodruff School of Mechanical Engineering,
e-mail: suresh.sitaraman@me.gatech.edu
Georgia Institute of Technology
, Atlanta, GA 30332-0569
Search for other works by this author on:
Andy Perkins
Computer Aided Simulation for Package Reliability (CASPaR) Laboratory, The George W. Woodruff School of Mechanical Engineering,
Georgia Institute of Technology
, Atlanta, GA 30332-0569
Suresh K. Sitaraman
Computer Aided Simulation for Package Reliability (CASPaR) Laboratory, The George W. Woodruff School of Mechanical Engineering,
Georgia Institute of Technology
, Atlanta, GA 30332-0569e-mail: suresh.sitaraman@me.gatech.edu
J. Electron. Packag. Mar 2008, 130(1): 011012 (11 pages)
Published Online: February 14, 2008
Article history
Received:
December 4, 2006
Revised:
July 30, 2007
Published:
February 14, 2008
Citation
Perkins, A., and Sitaraman, S. K. (February 14, 2008). "Analysis and Prediction of Vibration-Induced Solder Joint Failure for a Ceramic Column Grid Array Package." ASME. J. Electron. Packag. March 2008; 130(1): 011012. https://doi.org/10.1115/1.2837520
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