The traditional “evaporation∕melt and blow” mechanism of laser cutting of aluminum nitride (AlN) chip carriers and heat sinks suffers from energy losses due to its high thermal conductivity, formation of dross, decomposition to aluminum, and uncontrolled thermal cracking. In order to overcome these limitations, a thermochemical method that uses a defocused laser beam to melt a thin layer of AlN surface in oxygen environment was utilized. Subsequent solidification of the melt layer generated shrinkage and thermal gradient stresses that, in turn, created a crack along the middle path of laser beam and caused material separation through unstable crack propagation. The benefits associated with thermal stress fracture method over the traditional method are improved cut quality, higher cutting speed, and lower energy losses.
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June 2008
Technical Briefs
Improved Method of Laser Cutting of Aluminum Nitride
Raathai Molian,
Raathai Molian
Department of Mechanical Engineering,
Iowa State University
, Ames, IA 50011-2161
Search for other works by this author on:
Pranav Shrotriya,
Pranav Shrotriya
Department of Mechanical Engineering,
Iowa State University
, Ames, IA 50011-2161
Search for other works by this author on:
Pal Molian
Pal Molian
Department of Mechanical Engineering,
e-mail: molian@iastate.edu
Iowa State University
, Ames, IA 50011-2161
Search for other works by this author on:
Raathai Molian
Department of Mechanical Engineering,
Iowa State University
, Ames, IA 50011-2161
Pranav Shrotriya
Department of Mechanical Engineering,
Iowa State University
, Ames, IA 50011-2161
Pal Molian
Department of Mechanical Engineering,
Iowa State University
, Ames, IA 50011-2161e-mail: molian@iastate.edu
J. Electron. Packag. Jun 2008, 130(2): 024501 (3 pages)
Published Online: May 8, 2008
Article history
Received:
December 2, 2006
Revised:
September 5, 2007
Published:
May 8, 2008
Citation
Molian, R., Shrotriya, P., and Molian, P. (May 8, 2008). "Improved Method of Laser Cutting of Aluminum Nitride." ASME. J. Electron. Packag. June 2008; 130(2): 024501. https://doi.org/10.1115/1.2912223
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