Thermomigration experiments were conducted to study the change in mechanical properties of 95.5Sn–4Ag–0.5Cu (SAC405) lead-free solder joint under high temperature gradients. This paper presents some observations on samples that were subjected to thermal gradient (TG) for 286 h, 712 h, and 1156 h. It was observed that samples subjected to thermal gradient did not develop a intermetallic compound (IMC) layer, and we observed disintegration of IMC. On the other hand, samples subjected to isothermal annealing exhibited IMC growth. In samples subjected to thermomigration, near the cold side the Cu concentration is significantly higher compared with hot side. Extensive surface hardness testing showed an increase in hardness from the hot to cold sides, which possibly indicates that Sn grain coarsening is in the same direction.
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March 2009
Research Papers
Influence of Thermomigration on Lead-Free Solder Joint Mechanical Properties
Mohd F. Abdulhamid,
Mohd F. Abdulhamid
Electronic Packaging Laboratory, University at Buffalo,
SUNY
, Buffalo, NY 14260
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Cemal Basaran
Cemal Basaran
Electronic Packaging Laboratory, University at Buffalo,
e-mail: cjb@buffalo.edu
SUNY
, Buffalo, NY 14260
Search for other works by this author on:
Mohd F. Abdulhamid
Electronic Packaging Laboratory, University at Buffalo,
SUNY
, Buffalo, NY 14260
Cemal Basaran
Electronic Packaging Laboratory, University at Buffalo,
SUNY
, Buffalo, NY 14260e-mail: cjb@buffalo.edu
J. Electron. Packag. Mar 2009, 131(1): 011002 (12 pages)
Published Online: February 11, 2009
Article history
Received:
September 25, 2007
Revised:
April 17, 2008
Published:
February 11, 2009
Citation
Abdulhamid, M. F., and Basaran, C. (February 11, 2009). "Influence of Thermomigration on Lead-Free Solder Joint Mechanical Properties." ASME. J. Electron. Packag. March 2009; 131(1): 011002. https://doi.org/10.1115/1.3068296
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