Conventional flip chip on board processing involves four major steps: flux application, solder reflow, underfill flow, and underfill cure. The latter two steps are particularly time consuming. To address this issue, a new flip chip process has been developed in which underfill is dispensed prior to chip placement or directly on the wafer and solder reflow and underfill cure occur simultaneously. This reduces the cycle time required for manufacturing. However, the presence of the underfill can affect the flip chips’ capacity for self-alignment. Self-alignment occurs in controlled collapse bonding when the solder interconnects become liquidus and, driven by surface tension, pull the chip into registration with the substrate. To study flip chip self-alignment in the presence of underfill, the viscous forces acting on the chip during realignment are modeled after Couette flow and the overall system is modeled as a spring-mass-damper. This paper details the modeling process and includes parametric studies to predict those conditions that are more conducive to alignment, as well as those which are not.
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December 2010
Research Papers
Translation Solder Self-Alignment Mechanics Modeling for a Flip Chip in the Presence of a Viscous Fluid
Brett Fennell,
Brett Fennell
The George W. Woodruff School of Mechanical Engineering,
Georgia Institute of Technology
, Atlanta, GA 30332-0405
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Sangil Lee,
Sangil Lee
The George W. Woodruff School of Mechanical Engineering,
Georgia Institute of Technology
, Atlanta, GA 30332-0405
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Daniel F. Baldwin
Daniel F. Baldwin
The George W. Woodruff School of Mechanical Engineering,
Georgia Institute of Technology
, Atlanta, GA 30332-0405
Search for other works by this author on:
Brett Fennell
The George W. Woodruff School of Mechanical Engineering,
Georgia Institute of Technology
, Atlanta, GA 30332-0405
Sangil Lee
The George W. Woodruff School of Mechanical Engineering,
Georgia Institute of Technology
, Atlanta, GA 30332-0405
Daniel F. Baldwin
The George W. Woodruff School of Mechanical Engineering,
Georgia Institute of Technology
, Atlanta, GA 30332-0405J. Electron. Packag. Dec 2010, 132(4): 041013 (6 pages)
Published Online: December 8, 2010
Article history
Received:
November 29, 2009
Revised:
September 25, 2010
Online:
December 8, 2010
Published:
December 8, 2010
Citation
Fennell, B., Lee, S., and Baldwin, D. F. (December 8, 2010). "Translation Solder Self-Alignment Mechanics Modeling for a Flip Chip in the Presence of a Viscous Fluid." ASME. J. Electron. Packag. December 2010; 132(4): 041013. https://doi.org/10.1115/1.4002825
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