A new one-dimensional thermal network modeling approach is proposed that can accurately predict transient/dynamic temperature distribution of passive cooling systems. The present model has applications in variety of electronic, power electronic, photonics, and telecom systems, especially where the system load fluctuates over time. The main components of a cooling system including: heat spreaders, heat pipes, and heat sinks as well as thermal boundary conditions such as natural convection and radiation heat transfer are analyzed, analytically modeled and presented in the form of resistance and capacitance (RC) network blocks. The present model is capable of predicting the transient/dynamic (and steady state) thermal behavior of cooling system with significantly less cost of modeling compared to conventional numerical simulations. Furthermore, the present method takes into account system “thermal inertia” and is capable of capturing thermal lags in various components. The model is presented in two forms: zero-dimensional and one-dimensional which are different in terms of complicacy. A custom-designed test-bed is also built and a comprehensive experimental study is conducted to validate the proposed model. The experimental results show great agreement, less than 4.5% relative difference in comparison with the modeling results.
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September 2014
Research-Article
A New Analytical Approach for Dynamic Modeling of Passive Multicomponent Cooling Systems
A. Gholami,
A. Gholami
Laboratory for Alternative Energy
Conversion (LAEC),
School of Mechatronic Systems Engineering,
Conversion (LAEC),
School of Mechatronic Systems Engineering,
Simon Fraser University
,Surrey, BC V3T 0A3
, Canada
Search for other works by this author on:
M. Ahmadi,
M. Ahmadi
Laboratory for Alternative Energy
Conversion (LAEC),
School of Mechatronic Systems Engineering,
Conversion (LAEC),
School of Mechatronic Systems Engineering,
Simon Fraser University
,Surrey, BC V3T 0A3
, Canada
Search for other works by this author on:
M. Bahrami
M. Bahrami
1
Laboratory for Alternative Energy
Conversion (LAEC),
School of Mechatronic Systems Engineering,
e-mail: mbahrami@sfu.ca
Conversion (LAEC),
School of Mechatronic Systems Engineering,
Simon Fraser University
,Surrey, BC V3T 0A3
, Canada
e-mail: mbahrami@sfu.ca
1Corresponding author.
Search for other works by this author on:
A. Gholami
Laboratory for Alternative Energy
Conversion (LAEC),
School of Mechatronic Systems Engineering,
Conversion (LAEC),
School of Mechatronic Systems Engineering,
Simon Fraser University
,Surrey, BC V3T 0A3
, Canada
M. Ahmadi
Laboratory for Alternative Energy
Conversion (LAEC),
School of Mechatronic Systems Engineering,
Conversion (LAEC),
School of Mechatronic Systems Engineering,
Simon Fraser University
,Surrey, BC V3T 0A3
, Canada
M. Bahrami
Laboratory for Alternative Energy
Conversion (LAEC),
School of Mechatronic Systems Engineering,
e-mail: mbahrami@sfu.ca
Conversion (LAEC),
School of Mechatronic Systems Engineering,
Simon Fraser University
,Surrey, BC V3T 0A3
, Canada
e-mail: mbahrami@sfu.ca
1Corresponding author.
Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received January 27, 2014; final manuscript received April 18, 2014; published online May 12, 2014. Assoc. Editor: Gongnan Xie.
J. Electron. Packag. Sep 2014, 136(3): 031010 (9 pages)
Published Online: May 12, 2014
Article history
Received:
January 27, 2014
Revision Received:
April 18, 2014
Citation
Gholami, A., Ahmadi, M., and Bahrami, M. (May 12, 2014). "A New Analytical Approach for Dynamic Modeling of Passive Multicomponent Cooling Systems." ASME. J. Electron. Packag. September 2014; 136(3): 031010. https://doi.org/10.1115/1.4027509
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