This paper presents a strain transfer investigation for Surface Acoustic Wave (SAW) strain sensors. For evaluation, a SAW strain sensor is assembled with a pretested bond material for potentially high strain transfer on a test holder. The setup is stressed with an axially homogeneous strain up to 500 ppm. The strain transfer ratio is computed from the applied load, the reference measurements with foil strain gauge, and the measured SAW strain sensor signal. The strain transfer performance of the bond material is also investigated with respect to the temperature dependency in the range between 22 °C and 85 °C. At these elevated temperatures an average strain transfer ratio of 0.606 ± 0.7% was measured. Mechanical load cycling tests up to 1000 cycles are used for the evaluation of the elastic fatigue of the bond material. The effects of mechanical load cycling and aging of the bond layer are analyzed with the SAW strain sensor response. After 1000 mechanical load cycles, the transferred strain into the SAW strain sensor is 0.582 ± 0.153%. Finally, the experimental results are compared with the results of a 3D FEM simulation which are deviating by less than 10%.
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December 2014
Research-Article
Strain Transfer Analysis of Integrated Surface Acoustic Wave Sensors
Jochen Hempel,
Jochen Hempel
Laboratory for Electrical Instrumentation,
Department of Microsystems Engineering,
e-mail: hempel@imtek.de
Department of Microsystems Engineering,
University of Freiburg
,Freiburg
, Germany
e-mail: hempel@imtek.de
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Sohaib Anees,
Sohaib Anees
Laboratory for Electrical Instrumentation,
Department of Microsystems Engineering,
e-mail: sohaibanees@gmail.com
Department of Microsystems Engineering,
University of Freiburg
,Freiburg
, Germany
e-mail: sohaibanees@gmail.com
Search for other works by this author on:
Elena Zukowski,
Elena Zukowski
Laboratory for Assembly
and Packaging Technology,
Department of Microsystems Engineering,
e-mail: Elena.Zukowski@de.bosch.com
and Packaging Technology,
Department of Microsystems Engineering,
University of Freiburg
,Freiburg
, Germany
e-mail: Elena.Zukowski@de.bosch.com
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Michael Berndt,
Michael Berndt
Laboratory for Assembly
and Packaging Technology,
Department of Microsystems Engineering,
e-mail: Michael.Berndt@imtek.uni-freiburg.de
and Packaging Technology,
Department of Microsystems Engineering,
University of Freiburg
,Freiburg
, Germany
e-mail: Michael.Berndt@imtek.uni-freiburg.de
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Jürgen Wilde,
Jürgen Wilde
Laboratory for Assembly
and Packaging Technology,
Department of Microsystems Engineering,
e-mail: juergen.wilde@imtek.uni-freiburg.de
and Packaging Technology,
Department of Microsystems Engineering,
University of Freiburg
,Freiburg
, Germany
e-mail: juergen.wilde@imtek.uni-freiburg.de
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Leonhard M. Reindl
Leonhard M. Reindl
Laboratory for Electrical Instrumentation,
Department of Microsystems Engineering,
e-mail: leonhard.reindl@imtek.uni-freiburg.de
Department of Microsystems Engineering,
University of Freiburg
,Freiburg
, Germany
e-mail: leonhard.reindl@imtek.uni-freiburg.de
Search for other works by this author on:
Jochen Hempel
Laboratory for Electrical Instrumentation,
Department of Microsystems Engineering,
e-mail: hempel@imtek.de
Department of Microsystems Engineering,
University of Freiburg
,Freiburg
, Germany
e-mail: hempel@imtek.de
Sohaib Anees
Laboratory for Electrical Instrumentation,
Department of Microsystems Engineering,
e-mail: sohaibanees@gmail.com
Department of Microsystems Engineering,
University of Freiburg
,Freiburg
, Germany
e-mail: sohaibanees@gmail.com
Elena Zukowski
Laboratory for Assembly
and Packaging Technology,
Department of Microsystems Engineering,
e-mail: Elena.Zukowski@de.bosch.com
and Packaging Technology,
Department of Microsystems Engineering,
University of Freiburg
,Freiburg
, Germany
e-mail: Elena.Zukowski@de.bosch.com
Michael Berndt
Laboratory for Assembly
and Packaging Technology,
Department of Microsystems Engineering,
e-mail: Michael.Berndt@imtek.uni-freiburg.de
and Packaging Technology,
Department of Microsystems Engineering,
University of Freiburg
,Freiburg
, Germany
e-mail: Michael.Berndt@imtek.uni-freiburg.de
Jürgen Wilde
Laboratory for Assembly
and Packaging Technology,
Department of Microsystems Engineering,
e-mail: juergen.wilde@imtek.uni-freiburg.de
and Packaging Technology,
Department of Microsystems Engineering,
University of Freiburg
,Freiburg
, Germany
e-mail: juergen.wilde@imtek.uni-freiburg.de
Leonhard M. Reindl
Laboratory for Electrical Instrumentation,
Department of Microsystems Engineering,
e-mail: leonhard.reindl@imtek.uni-freiburg.de
Department of Microsystems Engineering,
University of Freiburg
,Freiburg
, Germany
e-mail: leonhard.reindl@imtek.uni-freiburg.de
Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received July 29, 2013; final manuscript received December 30, 2013; published online September 19, 2014. Assoc. Editor: Nils Høivik.
J. Electron. Packag. Dec 2014, 136(4): 041002 (6 pages)
Published Online: September 19, 2014
Article history
Received:
July 29, 2013
Revision Received:
December 30, 2013
Citation
Hempel, J., Anees, S., Zukowski, E., Berndt, M., Wilde, J., and Reindl, L. M. (September 19, 2014). "Strain Transfer Analysis of Integrated Surface Acoustic Wave Sensors." ASME. J. Electron. Packag. December 2014; 136(4): 041002. https://doi.org/10.1115/1.4026437
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