A unified creep plasticity damage (UCPD) model for eutectic Sn-Pb and Pb-free solders was developed and implemented into finite element analysis codes. The new model will be described along with the relationship between the model's damage evolution equation and an empirical Coffin–Manson relationship for solder fatigue. Next, developments needed to model crack initiation and growth in solder joints will be described. Finally, experimentally observed cracks in typical solder joints subjected to thermal mechanical fatigue are compared with model predictions. Finite element based modeling is particularly suited for predicting solder joint fatigue of advanced electronics packaging, e.g. package-on-package (PoP), because it allows for evaluation of a variety of package materials and geometries.
Issue Section:
Research Papers
Topics:
Cycles,
Damage,
Fracture (Materials),
Lead-free solders,
Solder joints,
Solders,
Failure,
Fatigue,
Simulation
References
1.
Perkins
, A. E.
, and Sitaraman
, S. K.
, 2009
, Solder Joint Reliability Predictions for Multiple Environments
, Springer
, New York
.2.
Zhang
, Q.
, and Dasgupta
, A.
, 2005
, “Systematic Study on Thermo-Mechanical Durability of Pb-Free Assemblies: Experiments and FE Analysis
,” ASME J. Electron. Packag.
, 127
(4
), pp. 415
–429
.10.1115/1.20988123.
Darveaux
, R.
, 2002
, “Effect of Simulation Methodology on Solder Joint Crack Growth Correlation and Fatigue Life Prediction
,” ASME J. Electron. Packag.
, 124
(3
), pp. 147
–154
.10.1115/1.14137644.
Towashiraporn
, P.
, Subbarayan
, G. S.
, and Desai
, C. S.
, 2005
, “A Hybrid Model for Computationally Efficient Fatigue Fracture Simulations at Microelectronic Assembly Interfaces
,” Int. J. Solids Struct.
, 42
(15
), pp. 4468
–4483
.10.1016/j.ijsolstr.2004.12.0125.
Bhate
, D.
, Chan
, D.
, Subbarayan
, G.
, and Nguyen
, L.
, 2008
, “A Nonlinear Fracture Mechanics Approach to Modeling Fatigue Crack Growth in Solder Joints
,” ASME J. Electron. Packag.
, 130
(2
), p. 021003
.10.1115/1.28400576.
Ladani
, L. J.
, and Dasgupta
, A.
, 2008
, “Damage Initiation and Propagation in Voided Joints: Modeling and Experiment
,” ASME J. Electron. Packag.
, 130
(1
), p. 011008
.10.1115/1.28375627.
Anand
, L.
, 1985
, “Constitutive Equations for Hot-Working of Metals
,” Int. J. Plast.
, 1
(3
), pp. 213
–231
.10.1016/0749-6419(85)90004-X8.
Busso
, E. P.
, Kitano
, M.
, and Kumazawa
, T.
, 1992
, “A Visco-Plastic Constitutive Model for 60/40 Tin-Lead Solder Used in IC Package Joints
,” Trans. ASME J. Eng. Mater. Technol.
, 114
(3
), pp. 331
–337
.10.1115/1.29041819.
Frear
, D. R.
, Burchett
, S. N.
, Neilsen
, M. K.
, and Stephens
, J. J.
, 1997
, “Microstructurally Based Finite Element Simulation of Solder Joint Behaviour
,” Soldering Surf. Mount Technol.
, 9
(1
), pp. 39
–42
.10.1108/0954091971080060110.
Nose
, H.
, Sakane
, M.
, Tsukada
, Y.
, and Nishimura
, H.
, 2003
, “Temperature and Strain Rate Effects on Tensile Strength and Inelastic Constitutive Relationship of Sn-Pb Solders
,” ASME J. Electron. Packag.
, 125
(1
), pp. 59
–66
.10.1115/1.153305811.
Fossum
, A. F.
, Vianco
, P. T.
, Neilsen
, M. K.
, and Pierce
, D. M.
, 2006
, “A Practical Viscoplastic Damage Model for Lead-Free Solder
,” ASME J. Electron. Packag.
, 128
(1
), pp. 71
–81
.10.1115/1.216051412.
Ohguchi
, K. I.
, Sasaki
, K.
, and Ishibashi
, M.
, 2006
, “A Quantitative Evaluation of Time-Independent and Time-Dependent Deformations of Lead-Free and Lead-Containing Solder Alloys
,” J. Electron. Mater.
, 35
(1
), pp. 132
–139
.10.1007/s11664-006-0195-913.
Sharma
, P.
, and Dasgupta
, A.
, 2002
, “Micro-Mechanics of Creep-Fatigue Damage in Pb-Sn Solder Due To Thermal Cycling; Part I: Formulation; Part II: Mechanistic Insights and Cyclic Durability Predictions From Monotonic Data
,” ASME J. Electron. Packag.
, 124
(3
), pp. 292
–298
.10.1115/1.149320214.
Desai
, C. S.
, Basaran
, C.
, Dishongh
, T.
, and Prince
, J.
, 1998
, “Thermomechanical Analysis in Electronic Packaging With Unified Constitutive Models for Materials and Joints
,” IEEE Trans. Compon. Packag. Manuf. Technol., Part B
, 21
(1
), pp. 87
–97
.10.1109/96.65951115.
Ladani
, L.
, and Dasgupta
, A.
, 2009
, “A Meso-Scale Damage Evolution Model for Cyclic Fatigue of Viscoplastic Materials
,” Int. J. Fatigue
, 31
(4
), pp. 703
–711
.10.1016/j.ijfatigue.2008.03.01316.
Boyce
, G. L.
, Brewer
, L. N.
, Neilsen
, M. K.
, and Perricone
, M. J.
, 2011
, “On the Strain Rate and Temperature Dependent Tensile Behavior of Eutectic Sn-Pb Solder
,” ASME J. Electron. Packag.
, 133
(3
), p. 031009
.10.1115/1.400484617.
Solomon
, H.
, 1986
, “Fatigue of 60/40 Solder
,” IEEE Trans. Compon., Hybrids, Manuf. Technol.
, 9
(4
), pp. 423
–432
.10.1109/TCHMT.1986.113667218.
Cuddalorepatta
, G.
, and Dasgupta
, A.
, 2005
, “Cyclic Mechanical Durability of Sn3. 0Ag0. 5Cu Pb-Free Solder Alloy
,” International Mechanical Engineering Congress and Exhibition Paper
, Orlando, FL
, ASME
Paper No. IMECE2005-81171.10.1115/IMECE2005-8117119.
Zhou
, Y.
, Al-Bassyiouni
, M.
, and Dasgupta
, A.
, 2009
, “Vibration Durability Assessment of Sn3.0Ag0.5Cu and Sn37Pb Solders Under Harmonic Excitation
,” ASME J. Electron. Packag.
, 131
(1
), p. 011016
.10.1115/1.307819520.
Kariya
, Y.
, and Otsuka
, M.
, 1998
, “Mechanical Fatigue Characteristics of Sn-3.5 Ag-x (x= Bi, Cu, Zn and In) Solder Alloys
,” J. Electron. Mater.
, 27
(11
), pp. 1229
–1235
.10.1007/s11664-998-0074-721.
Vianco
, P. T.
, Rejent
, J. A.
, and Kilgo
, A. C.
, 2003
, “Time-Independent Mechanical and Physical Properties of the Ternary 95.5 Sn-3.9 Ag-0.6 Cu Solder
,” J. Electron. Mater.
, 32
(3
), pp. 142
–151
.10.1007/s11664-003-0185-022.
More
, J. J.
, 1978
, “The Levenberg-Marquardt Algorithm: Implementation and Theory
,” Biennial Conference on Numerical Analysis
, Dundee, Scotland
, June 28–July 1, pp. 105
–116
.23.
NASA-DoD Lead-Free Electronics Project Joint Test Report—Final, December 2011, http://teerm.nasa.gov/nasa_dodleadfreeelectronics_proj2.htm
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