Abstract

Canary structures being used as early warning indicators represent an important tool for condition and health monitoring of electronic components and systems. In this paper, printed circuit boards (PCBs) with canary structures based on surface mounted device (SMD)-2512 ceramic chip resistors with reduced solder pad sizes were studied. Focus of these investigations was set on thermomechanical and mechanical stresses caused by passive thermal cycling as well as by vibrational loads. For this purpose, experimental methods such as deformation analysis and accelerated aging tests as well as finite element (FE) based methods were applied. In addition, an outlook on the implementation of these canary structures into dual inverter electronic control boards for electrical powertrain applications will be given.

Issue Section:
Special Papers
Keywords:
PHM, canary structures, solder joint reliability, FE simulation, thermomechanical warpage
Topics:
Failure, Fatigue, Printed circuit boards, Resistors, Simulation, Solder joints, Solders, Stress, Thermomechanics, Warping, Finite element analysis, Temperature, Deformation, Cycles, Surface mount devices, Vibration

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