Volume 114 Issue 2 | J. Electron. Packag.

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Volume 114, Issue 2

June 1992

ISSN 1043-7398

EISSN 1528-9044

Foreword

Special Issue on Mechanics of Surface Mount Assemblies

Donald Barker, Hans Conrad, Peter Engel, John Lan, Yi-Hsin Pao, Anthony Rafanelli, Harvey Solomon, Donald Stone

J. Electron. Packag. June 1992, 114(2): 103. doi: https://doi.org/10.1115/1.2906403

View articletitled, Special Issue on Mechanics of Surface Mount Assemblies

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Topics: Surface mount assemblies

Research Papers

Fatigue Lives on 60Sn/40Pb Solder Joints Made With Different Cooling Rates

Z. Mei, J. W. Morris, Jr.

J. Electron. Packag. June 1992, 114(2): 104–108. doi: https://doi.org/10.1115/1.2906404

Abstract

View articletitled, Fatigue Lives on 60Sn/40Pb Solder Joints Made With Different Cooling Rates

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Topics: Cooling , Fatigue , Solder joints , Furnaces , Grain size , Quenching (Metalworking) , Shear (Mechanics) , Solidification

Confirmation of Creep and Fatigue Damage in Pb/Sn Solder Joints

A. I. Attarwala, J. K. Tien, G. Y. Masada, G. Dody

J. Electron. Packag. June 1992, 114(2): 109–111. doi: https://doi.org/10.1115/1.2906405

Abstract

View articletitled, Confirmation of Creep and Fatigue Damage in Pb/Sn Solder Joints

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Topics: Creep , Fatigue damage , Solder joints , Tin , Fatigue , Fracture (Materials) , Solders , Crack propagation , Cracking (Materials) , Cycles

Plastic Deformation Kinetics of Eutectic Pb-Sn Solder Joints in Monotonic Loading and Low-Cycle Fatigue

Z. Guo, A. F. Sprecher, H. Conrad

J. Electron. Packag. June 1992, 114(2): 112–117. doi: https://doi.org/10.1115/1.2906406

Abstract

View articletitled, Plastic Deformation Kinetics of Eutectic Pb-Sn Solder Joints in Monotonic Loading and Low-Cycle Fatigue

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Topics: Deformation , Low cycle fatigue , Solder joints , Tin , Stress , Alloys , Dislocations , Shear (Mechanics)

Deformation and Fracture of Pb-Sn-Eutectic Under Tensile and Fatigue Loading

S.-M. Lee, D. S. Stone

J. Electron. Packag. June 1992, 114(2): 118–121. doi: https://doi.org/10.1115/1.2906407

Abstract

View articletitled, Deformation and Fracture of Pb-Sn-Eutectic Under Tensile and Fatigue Loading

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Topics: Deformation , Fatigue , Fracture (Materials) , Tin , Failure , Cavitation , Displacement , Fatigue testing , Grain boundaries , Compression

A Conjectured Solder Fatigue Law Based on Nonlinear Dynamics

S. Russell, R. Caroselli, J. Mason, M. Shah

J. Electron. Packag. June 1992, 114(2): 122–127. doi: https://doi.org/10.1115/1.2906408

Abstract

View articletitled, A Conjectured Solder Fatigue Law Based on Nonlinear Dynamics

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Topics: Fatigue , Nonlinear dynamics , Solders , Creep , Bifurcation , Chaos theory , Deformation , Engineering disciplines , Grain boundaries , Grain size

Wetting Dynamics of Molten Solder Alloys on Metal Substrates

T. J. Singler, J. A. Clum, E. R. Prack

J. Electron. Packag. June 1992, 114(2): 128–134. doi: https://doi.org/10.1115/1.2906409

Abstract

View articletitled, Wetting Dynamics of Molten Solder Alloys on Metal Substrates

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Topics: Alloys , Dynamics (Mechanics) , Metals , Solders , Wetting , Surface energy , Tin , Tin alloys

Measurement of Mechanical Behavior of High Lead Lead-Tin Solder Joints Subjected to Thermal Cycling

Yi-Hsin Pao, Scott Badgley, Ratan Govila, Linda Baumgartner, Richard Allor, Ron Cooper

J. Electron. Packag. June 1992, 114(2): 135–144. doi: https://doi.org/10.1115/1.2906410

Abstract

View articletitled, Measurement of Mechanical Behavior of High Lead Lead-Tin Solder Joints Subjected to Thermal Cycling

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Topics: Mechanical behavior , Solder joints , Fracture (Process) , Solders , Stress , Creep , Fatigue , Shear stress , Adhesives , Alloys

Thermomechanical Fatigue Life Prediction of 63Sn/37Pb Solder

Q. Guo, E. C. Cutiongco, L. M. Keer, M. E. Fine

J. Electron. Packag. June 1992, 114(2): 145–151. doi: https://doi.org/10.1115/1.2906411

Abstract

View articletitled, Thermomechanical Fatigue Life Prediction of 63Sn/37Pb Solder

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Topics: Fatigue life , Solders , Thermomechanics , Failure , Fatigue testing , Cycles , Fatigue , Compressive stress , Dislocations , Stress

Solder Creep-Fatigue Analysis by an Energy-Partitioning Approach

A. Dasgupta, C. Oyan, D. Barker, M. Pecht

J. Electron. Packag. June 1992, 114(2): 152–160. doi: https://doi.org/10.1115/1.2906412

Abstract

View articletitled, Solder Creep-Fatigue Analysis by an Energy-Partitioning Approach

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Topics: Creep , Fatigue , Solders , Temperature , Cycles , Damage , Finite element methods , Solder joints , Stress , Constitutive equations

Isothermal Fatigue of LCC/PWB Interconnections

H. D. Solomon

J. Electron. Packag. June 1992, 114(2): 161–168. doi: https://doi.org/10.1115/1.2906413

Abstract

View articletitled, Isothermal Fatigue of LCC/PWB Interconnections

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Topics: Fatigue , Printed circuit boards , Failure , Solder joints , Cycles , Deflection , Solders , Temperature

Experimental and Analytical Studies of 28-Pin Thin Small Outline Package (TSOP) Solder-Joint Reliability

J. Lau, S. Golwalkar, S. Erasmus, R. Surratt, P. Boysan

J. Electron. Packag. June 1992, 114(2): 169–176. doi: https://doi.org/10.1115/1.2906414

Abstract

View articletitled, Experimental and Analytical Studies of 28-Pin Thin Small Outline Package (TSOP) Solder-Joint Reliability

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Topics: Reliability , Solder joints , Temperature , Corners (Structural elements) , Failure , Failure analysis , Fatigue , Fatigue life , Finite element analysis , Scanning electron microscopy

Effect of SMC Lead Dimensional Variabilities on Lead Compliance and Solder Joint Fatigue Life

D. B. Barker, I. Sharif, A. Dasgupta, M. G. Pecht

J. Electron. Packag. June 1992, 114(2): 177–184. doi: https://doi.org/10.1115/1.2906415

Abstract

View articletitled, Effect of SMC Lead Dimensional Variabilities on Lead Compliance and Solder Joint Fatigue Life

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Topics: Fatigue life , Solder joints , Surface mount components , Stiffness , Finite element analysis , Surface mount packaging , Computation , Design , Dimensions , Failure

Solder Creep-Fatigue Interactions With Flexible Leaded Parts

R. G. Ross, Jr., L. C. Wen, G. R. Mon, E. Jetter

J. Electron. Packag. June 1992, 114(2): 185–192. doi: https://doi.org/10.1115/1.2906416

Abstract

View articletitled, Solder Creep-Fatigue Interactions With Flexible Leaded Parts

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Topics: Creep , Fatigue , Solders , Computer software , Cycles , Stress , Temperature , Accounting , Algorithms , Deflection

Refined Variational Solutions of the Interfacial Thermal Stresses in a Laminated Beam

W.-L. Yin

J. Electron. Packag. June 1992, 114(2): 193–198. doi: https://doi.org/10.1115/1.2906417

Abstract

View articletitled, Refined Variational Solutions of the Interfacial Thermal Stresses in a Laminated Beam

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Topics: Die cutting , Polynomials , Shear stress , Shearing (Deformation) , Stress , Temperature , Thermal stresses , Variational techniques

Effects of Thickness on Thermal Stresses in a Thin Solder or Adhesive Layer

An-Yu Kuo, Kuan-Luen Chen

J. Electron. Packag. June 1992, 114(2): 199–202. doi: https://doi.org/10.1115/1.2906418

View articletitled, Effects of Thickness on Thermal Stresses in a Thin Solder or Adhesive Layer

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Topics: Adhesives , Solders , Thermal stresses

Approximate Structural Analysis of Circuit Card Systems Subjected to Torsion

P. A. Engel, J. T. Vogelmann

J. Electron. Packag. June 1992, 114(2): 203–210. doi: https://doi.org/10.1115/1.2906419

Abstract

View articletitled, Approximate Structural Analysis of Circuit Card Systems Subjected to Torsion

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Topics: Circuits , Structural analysis , Torsion , Corners (Structural elements) , Deflection , Finite element analysis , Finite element methods , Stiffness

Stress Analysis and Thermal Characterization of a High Pin Count PQFP

A. Mertol

J. Electron. Packag. June 1992, 114(2): 211–220. doi: https://doi.org/10.1115/1.2906420

Abstract

View articletitled, Stress Analysis and Thermal Characterization of a High Pin Count PQFP

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Topics: Stress analysis (Engineering) , Thermal characterization , Molding , Stress , Junctions , Cooling , Finite element analysis , Finite element model , Flat heat pipes , Simulation

Elasto-Plastic Large Deflection Analysis of a Copper Film

J. H. Lau

J. Electron. Packag. June 1992, 114(2): 221–225. doi: https://doi.org/10.1115/1.2906421

Abstract

View articletitled, Elasto-Plastic Large Deflection Analysis of a Copper Film

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Topics: Copper , Deflection , Ductility , Pressure , Stress , Finite element methods , Mechanical behavior

Electronic Materials and Structures for Multichip Modules

H. K. Charles, Jr.

J. Electron. Packag. June 1992, 114(2): 226–233. doi: https://doi.org/10.1115/1.2906422

Abstract

View articletitled, Electronic Materials and Structures for Multichip Modules

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Topics: Multi-chip modules , Packaging , Density , Electronic packaging , Manufacturing , Thrust

Ramberg-Osgood Parameters for 63–37 Sn-Pb Solder

A. J. Rafanelli

J. Electron. Packag. June 1992, 114(2): 234–238. doi: https://doi.org/10.1115/1.2906423

Abstract

View articletitled, Ramberg-Osgood Parameters for 63–37 Sn-Pb Solder

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Topics: Solders , Tin , Fracture toughness , Hardening , Stress , Work hardening

A General Analytical Solution for Free Vibration of Rectangular Plates Resting on Fixed Supports and With Attached Masses

R. K. Singal, D. J. Gorman

J. Electron. Packag. June 1992, 114(2): 239–245. doi: https://doi.org/10.1115/1.2906424

Abstract

View articletitled, A General Analytical Solution for Free Vibration of Rectangular Plates Resting on Fixed Supports and With Attached Masses

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Topics: Free vibrations , Plates (structures) , Design , Electronic packaging , Mode shapes , Rotational inertia , Solar energy , Space vehicles

Effect of the Nonlinear Behavior of the Material on Two-Point Bending of Optical Glass Fibers

E. Suhir

J. Electron. Packag. June 1992, 114(2): 246–250. doi: https://doi.org/10.1115/1.2906425

Abstract

View articletitled, Effect of the Nonlinear Behavior of the Material on Two-Point Bending of Optical Glass Fibers

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Topics: Fibers , Optical glass , Compression , Stress , Stress-strain relations , Tension , Coatings , Deformation

Onset of Transition in the Flow Over a Three-Dimensional Array of Rectangular Obstacles

S. V. Garimella, P. A. Eibeck

J. Electron. Packag. June 1992, 114(2): 251–255. doi: https://doi.org/10.1115/1.2906426

Abstract

View articletitled, Onset of Transition in the Flow Over a Three-Dimensional Array of Rectangular Obstacles

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Topics: Flow (Dynamics) , Reynolds number , Computers , Dimensions , Flow visualization , Geometry , Heat transfer , Printed circuit boards , Turbulence , Water

Book Reviews

Structural Analysis in Microelectronics

E. Suhir, Author, Peter A. Engel, Reviewer

J. Electron. Packag. June 1992, 114(2): 256. doi: https://doi.org/10.1115/1.2906427

View articletitled, <em>Structural Analysis in Microelectronics</em>

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Topics: Microelectronic devices , Structural analysis

Foreword

Special Issue on Mechanics of Surface Mount Assemblies

Research Papers

Fatigue Lives on 60Sn/40Pb Solder Joints Made With Different Cooling Rates

Confirmation of Creep and Fatigue Damage in Pb/Sn Solder Joints

Plastic Deformation Kinetics of Eutectic Pb-Sn Solder Joints in Monotonic Loading and Low-Cycle Fatigue

Deformation and Fracture of Pb-Sn-Eutectic Under Tensile and Fatigue Loading

A Conjectured Solder Fatigue Law Based on Nonlinear Dynamics

Wetting Dynamics of Molten Solder Alloys on Metal Substrates

Measurement of Mechanical Behavior of High Lead Lead-Tin Solder Joints Subjected to Thermal Cycling

Thermomechanical Fatigue Life Prediction of 63Sn/37Pb Solder

Solder Creep-Fatigue Analysis by an Energy-Partitioning Approach

Isothermal Fatigue of LCC/PWB Interconnections

Experimental and Analytical Studies of 28-Pin Thin Small Outline Package (TSOP) Solder-Joint Reliability

Effect of SMC Lead Dimensional Variabilities on Lead Compliance and Solder Joint Fatigue Life

Solder Creep-Fatigue Interactions With Flexible Leaded Parts

Refined Variational Solutions of the Interfacial Thermal Stresses in a Laminated Beam

Effects of Thickness on Thermal Stresses in a Thin Solder or Adhesive Layer

Approximate Structural Analysis of Circuit Card Systems Subjected to Torsion

Stress Analysis and Thermal Characterization of a High Pin Count PQFP

Elasto-Plastic Large Deflection Analysis of a Copper Film

Electronic Materials and Structures for Multichip Modules

Ramberg-Osgood Parameters for 63–37 Sn-Pb Solder

A General Analytical Solution for Free Vibration of Rectangular Plates Resting on Fixed Supports and With Attached Masses

Effect of the Nonlinear Behavior of the Material on Two-Point Bending of Optical Glass Fibers

Onset of Transition in the Flow Over a Three-Dimensional Array of Rectangular Obstacles

Book Reviews

Structural Analysis in Microelectronics

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