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Issues
June 1992
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Foreword
Special Issue on Mechanics of Surface Mount Assemblies
Donald Barker, Hans Conrad, Peter Engel, John Lan, Yi-Hsin Pao, Anthony Rafanelli, Harvey Solomon, Donald Stone
J. Electron. Packag. June 1992, 114(2): 103.
doi: https://doi.org/10.1115/1.2906403
Topics:
Surface mount assemblies
Research Papers
Fatigue Lives on 60Sn/40Pb Solder Joints Made With Different Cooling Rates
J. Electron. Packag. June 1992, 114(2): 104–108.
doi: https://doi.org/10.1115/1.2906404
Topics:
Cooling
,
Fatigue
,
Solder joints
,
Furnaces
,
Grain size
,
Quenching (Metalworking)
,
Shear (Mechanics)
,
Solidification
Confirmation of Creep and Fatigue Damage in Pb/Sn Solder Joints
J. Electron. Packag. June 1992, 114(2): 109–111.
doi: https://doi.org/10.1115/1.2906405
Topics:
Creep
,
Fatigue damage
,
Solder joints
,
Tin
,
Fatigue
,
Fracture (Materials)
,
Solders
,
Crack propagation
,
Cracking (Materials)
,
Cycles
Plastic Deformation Kinetics of Eutectic Pb-Sn Solder Joints in Monotonic Loading and Low-Cycle Fatigue
J. Electron. Packag. June 1992, 114(2): 112–117.
doi: https://doi.org/10.1115/1.2906406
Topics:
Deformation
,
Low cycle fatigue
,
Solder joints
,
Tin
,
Stress
,
Alloys
,
Dislocations
,
Shear (Mechanics)
Deformation and Fracture of Pb-Sn-Eutectic Under Tensile and Fatigue Loading
J. Electron. Packag. June 1992, 114(2): 118–121.
doi: https://doi.org/10.1115/1.2906407
Topics:
Deformation
,
Fatigue
,
Fracture (Materials)
,
Tin
,
Failure
,
Cavitation
,
Displacement
,
Fatigue testing
,
Grain boundaries
,
Compression
A Conjectured Solder Fatigue Law Based on Nonlinear Dynamics
J. Electron. Packag. June 1992, 114(2): 122–127.
doi: https://doi.org/10.1115/1.2906408
Topics:
Fatigue
,
Nonlinear dynamics
,
Solders
,
Creep
,
Bifurcation
,
Chaos theory
,
Deformation
,
Engineering disciplines
,
Grain boundaries
,
Grain size
Wetting Dynamics of Molten Solder Alloys on Metal Substrates
J. Electron. Packag. June 1992, 114(2): 128–134.
doi: https://doi.org/10.1115/1.2906409
Topics:
Alloys
,
Dynamics (Mechanics)
,
Metals
,
Solders
,
Wetting
,
Surface energy
,
Tin
,
Tin alloys
Measurement of Mechanical Behavior of High Lead Lead-Tin Solder Joints Subjected to Thermal Cycling
J. Electron. Packag. June 1992, 114(2): 135–144.
doi: https://doi.org/10.1115/1.2906410
Topics:
Mechanical behavior
,
Solder joints
,
Fracture (Process)
,
Solders
,
Stress
,
Creep
,
Fatigue
,
Shear stress
,
Adhesives
,
Alloys
Thermomechanical Fatigue Life Prediction of 63Sn/37Pb Solder
J. Electron. Packag. June 1992, 114(2): 145–151.
doi: https://doi.org/10.1115/1.2906411
Topics:
Fatigue life
,
Solders
,
Thermomechanics
,
Failure
,
Fatigue testing
,
Cycles
,
Fatigue
,
Compressive stress
,
Dislocations
,
Stress
Solder Creep-Fatigue Analysis by an Energy-Partitioning Approach
J. Electron. Packag. June 1992, 114(2): 152–160.
doi: https://doi.org/10.1115/1.2906412
Topics:
Creep
,
Fatigue
,
Solders
,
Temperature
,
Cycles
,
Damage
,
Finite element methods
,
Solder joints
,
Stress
,
Constitutive equations
Isothermal Fatigue of LCC/PWB Interconnections
J. Electron. Packag. June 1992, 114(2): 161–168.
doi: https://doi.org/10.1115/1.2906413
Topics:
Fatigue
,
Printed circuit boards
,
Failure
,
Solder joints
,
Cycles
,
Deflection
,
Solders
,
Temperature
Experimental and Analytical Studies of 28-Pin Thin Small Outline Package (TSOP) Solder-Joint Reliability
J. Electron. Packag. June 1992, 114(2): 169–176.
doi: https://doi.org/10.1115/1.2906414
Effect of SMC Lead Dimensional Variabilities on Lead Compliance and Solder Joint Fatigue Life
J. Electron. Packag. June 1992, 114(2): 177–184.
doi: https://doi.org/10.1115/1.2906415
Topics:
Fatigue life
,
Solder joints
,
Surface mount components
,
Stiffness
,
Finite element analysis
,
Surface mount packaging
,
Computation
,
Design
,
Dimensions
,
Failure
Solder Creep-Fatigue Interactions With Flexible Leaded Parts
J. Electron. Packag. June 1992, 114(2): 185–192.
doi: https://doi.org/10.1115/1.2906416
Topics:
Creep
,
Fatigue
,
Solders
,
Computer software
,
Cycles
,
Stress
,
Temperature
,
Accounting
,
Algorithms
,
Deflection
Refined Variational Solutions of the Interfacial Thermal Stresses in a Laminated Beam
J. Electron. Packag. June 1992, 114(2): 193–198.
doi: https://doi.org/10.1115/1.2906417
Topics:
Die cutting
,
Polynomials
,
Shear stress
,
Shearing (Deformation)
,
Stress
,
Temperature
,
Thermal stresses
,
Variational techniques
Effects of Thickness on Thermal Stresses in a Thin Solder or Adhesive Layer
J. Electron. Packag. June 1992, 114(2): 199–202.
doi: https://doi.org/10.1115/1.2906418
Topics:
Adhesives
,
Solders
,
Thermal stresses
Approximate Structural Analysis of Circuit Card Systems Subjected to Torsion
J. Electron. Packag. June 1992, 114(2): 203–210.
doi: https://doi.org/10.1115/1.2906419
Stress Analysis and Thermal Characterization of a High Pin Count PQFP
J. Electron. Packag. June 1992, 114(2): 211–220.
doi: https://doi.org/10.1115/1.2906420
Elasto-Plastic Large Deflection Analysis of a Copper Film
J. Electron. Packag. June 1992, 114(2): 221–225.
doi: https://doi.org/10.1115/1.2906421
Topics:
Copper
,
Deflection
,
Ductility
,
Pressure
,
Stress
,
Finite element methods
,
Mechanical behavior
Electronic Materials and Structures for Multichip Modules
J. Electron. Packag. June 1992, 114(2): 226–233.
doi: https://doi.org/10.1115/1.2906422
Topics:
Multi-chip modules
,
Packaging
,
Density
,
Electronic packaging
,
Manufacturing
,
Thrust
Ramberg-Osgood Parameters for 63–37 Sn-Pb Solder
J. Electron. Packag. June 1992, 114(2): 234–238.
doi: https://doi.org/10.1115/1.2906423
Topics:
Solders
,
Tin
,
Fracture toughness
,
Hardening
,
Stress
,
Work hardening
A General Analytical Solution for Free Vibration of Rectangular Plates Resting on Fixed Supports and With Attached Masses
J. Electron. Packag. June 1992, 114(2): 239–245.
doi: https://doi.org/10.1115/1.2906424
Topics:
Free vibrations
,
Plates (structures)
,
Design
,
Electronic packaging
,
Mode shapes
,
Rotational inertia
,
Solar energy
,
Space vehicles
Effect of the Nonlinear Behavior of the Material on Two-Point Bending of Optical Glass Fibers
J. Electron. Packag. June 1992, 114(2): 246–250.
doi: https://doi.org/10.1115/1.2906425
Topics:
Fibers
,
Optical glass
,
Compression
,
Stress
,
Stress-strain relations
,
Tension
,
Coatings
,
Deformation
Onset of Transition in the Flow Over a Three-Dimensional Array of Rectangular Obstacles
J. Electron. Packag. June 1992, 114(2): 251–255.
doi: https://doi.org/10.1115/1.2906426
Topics:
Flow (Dynamics)
,
Reynolds number
,
Computers
,
Dimensions
,
Flow visualization
,
Geometry
,
Heat transfer
,
Printed circuit boards
,
Turbulence
,
Water
Book Reviews
Structural Analysis in Microelectronics
J. Electron. Packag. June 1992, 114(2): 256.
doi: https://doi.org/10.1115/1.2906427
Topics:
Microelectronic devices
,
Structural analysis
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