Topics: Natural convection , Transients (Dynamics) , Fluids , Temperature , Heat conduction , Heat , Coolants , Flow (Dynamics) , Plumes (Fluid dynamics) , Steady state

Design Parameters and Practical Considerations in the Two-Phase Forced-Convection Cooling of Multi-Chip Modules

Christopher O. Gersey, Thomas C. Willingham, Issam Mudawar

J. Electron. Packag. September 1992, 114(3): 280–289. doi: https://doi.org/10.1115/1.2905452

Abstract

View articletitled, Design Parameters and Practical Considerations in the Two-Phase Forced-Convection Cooling of Multi-Chip Modules

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Topics: Cooling , Design , Forced convection , Multi-chip modules , Critical heat flux , Heart failure , Flow (Dynamics) , Subcooling , Boiling , Coolants

Effects of Orientation on Critical Heat Flux From Chip Arrays During Flow Boiling

C. O. Gersey, I. Mudawar

J. Electron. Packag. September 1992, 114(3): 290–299. doi: https://doi.org/10.1115/1.2905453

Abstract

View articletitled, Effects of Orientation on Critical Heat Flux From Chip Arrays During Flow Boiling

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Topics: Boiling , Critical heat flux , Flow (Dynamics) , Coolants , Cooling systems , Flux (Metallurgy) , Gravity (Force) , Heat transfer coefficients , Multi-chip modules , Packaging

Parametric Studies for Thermal Design of Surface Mounted Components of Standard Electronic Modules

A. Hadim, N. J. Nagurny

J. Electron. Packag. September 1992, 114(3): 300–304. doi: https://doi.org/10.1115/1.2905454

Abstract

View articletitled, Parametric Studies for Thermal Design of Surface Mounted Components of Standard Electronic Modules

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Topics: Design , Cavities , Computer software , Heat conduction , Heat transfer , Network models , Solders , Thermal analysis

A Physics of Failure Approach to Component Placement

M. D. Osterman

J. Electron. Packag. September 1992, 114(3): 305–309. doi: https://doi.org/10.1115/1.2905455

Abstract

View articletitled, A Physics of Failure Approach to Component Placement

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Topics: Failure , Physics , Temperature , Hazards , Printed circuit boards , Reliability , Cooling , Cycles , Forced convection , Manufacturing

Investigation and Prediction of Creep and Creep-Like Behavior of Solids by Laser Methods

E. V. Cherstvov, A. N. Mokhel, R. L. Salganik, V. N. Soutorshin

J. Electron. Packag. September 1992, 114(3): 310–313. doi: https://doi.org/10.1115/1.2905456

Abstract

View articletitled, Investigation and Prediction of Creep and Creep-Like Behavior of Solids by Laser Methods

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Topics: Creep , Lasers , Solids , Resolution (Optics)

Thermal Stress Analysis of Pin Grid Array Structures: Pin and Solder Joint Problems

Peter A. Engel, Kee Rong Wu

J. Electron. Packag. September 1992, 114(3): 314–321. doi: https://doi.org/10.1115/1.2905457

Abstract

View articletitled, Thermal Stress Analysis of Pin Grid Array Structures: Pin and Solder Joint Problems

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Topics: Solder joints , Thermal stresses , Stress , Cross section (Physics) , Failure mechanisms , Finite element methods , Iterative methods , Plasticity , Pressure , Solders

Thermal Stress Analysis of Pin Grid Array Structures: Module and Card Interactions

P. A. Engel, J. R. Webb

J. Electron. Packag. September 1992, 114(3): 322–328. doi: https://doi.org/10.1115/1.2905458

Abstract

View articletitled, Thermal Stress Analysis of Pin Grid Array Structures: Module and Card Interactions

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Topics: Thermal stresses , Ceramics , Deformation , Force measurement , Plates (structures) , Shear (Mechanics) , Stress

Predicted Bow of Plastic Packages Due to the Nonuniform Through-Thickness Distribution of Temperature

E. Suhir, L. T. Manzione

J. Electron. Packag. September 1992, 114(3): 329–335. doi: https://doi.org/10.1115/1.2905459

Abstract

View articletitled, Predicted Bow of Plastic Packages Due to the Nonuniform Through-Thickness Distribution of Temperature

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Topics: Temperature , Molding , Warping , Cycles , Design , Geometry , Hardening (Curing) , Materials properties , Molded plastics , Optimization

Shape and Force Relationships for Molten Axisymmetric Solder Connections

R. H. Katyl, W. T. Pimbley

J. Electron. Packag. September 1992, 114(3): 336–341. doi: https://doi.org/10.1115/1.2905460

Abstract

View articletitled, Shape and Force Relationships for Molten Axisymmetric Solder Connections

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Topics: Shapes , Solders , Collapse , Computational methods , Equilibrium (Physics) , Gravity (Force) , Surface tension

Drill Wear Monitoring in Circuit Board Manufacturing Using Drilling Forces and Their Spectra

Ciro N. Ramirez, R. Joe Thornhill

J. Electron. Packag. September 1992, 114(3): 342–348. doi: https://doi.org/10.1115/1.2905461

Abstract

View articletitled, Drill Wear Monitoring in Circuit Board Manufacturing Using Drilling Forces and Their Spectra

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Topics: Drilling , Drills (Tools) , Manufacturing , Printed circuit boards , Spectra (Spectroscopy) , Wear , Computer simulation , Cutting , Vibration

Reliable Ceramic Window Design for Electronic Devices

Hsien-Yang Yeh

J. Electron. Packag. September 1992, 114(3): 349–352. doi: https://doi.org/10.1115/1.2905462

Abstract

View articletitled, Reliable Ceramic Window Design for Electronic Devices

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Topics: Ceramics , Design , Fracture (Materials) , Vacuum , Leakage , Traveling waves , Approximation , Fracture mechanics , Heating , Plates (structures)

Technical Briefs

Thermoelastic Solutions for a Semi-Infinite Substrate With a Powered Electronic Device

John H. Lau

J. Electron. Packag. September 1992, 114(3): 353–358. doi: https://doi.org/10.1115/1.2905463

View articletitled, Thermoelastic Solutions for a Semi-Infinite Substrate With a Powered Electronic Device

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Topics: Thermoelasticity

Fluid Flow Modeling and Simulation for the Coaxial Cable of the LEASAT Antenna System

Hsien-Yang Yeh, Hen-Geul Yeh

J. Electron. Packag. September 1992, 114(3): 358–360. doi: https://doi.org/10.1115/1.2905464

Abstract

View articletitled, Fluid Flow Modeling and Simulation for the Coaxial Cable of the LEASAT Antenna System

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Topics: Cables , Fluid dynamics , Modeling , Simulation , Satellites , Pressure , Computer simulation , Fluid mechanics , Kinetic theory , Modeling analysis

Drill Wear Monitoring in Circuit Board Manufacturing: An Experimental Study

Ciro N. Ramirez, R. Joe Thornhill

J. Electron. Packag. September 1992, 114(3): 360–364. doi: https://doi.org/10.1115/1.2905465

Abstract

View articletitled, Drill Wear Monitoring in Circuit Board Manufacturing: An Experimental Study

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Topics: Drills (Tools) , Manufacturing , Printed circuit boards , Wear , Drilling , Machinery , Sensors , Torque , Vibration

Book Reviews

Handbook of Electronic Packaging Design

Michael Pecht, Editor, Hamid A. Hadim, Reviewer

J. Electron. Packag. September 1992, 114(3): 365. doi: https://doi.org/10.1115/1.2905466

View articletitled, <em>Handbook of Electronic Packaging Design</em>

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Topics: Design , Electronic packaging

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Performance Analysis of a Brazed Plate Heat Exchanger during Condensation of R1233zd(E)

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Wideband Equivalent Circuit Modeling and Parameter Extraction Method for Through Via in Ceramic Package Substrate

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Electrochemical Linked to Mechanical Simulation for an Assessment of State-Of-Health of Thin-flexible Li-ion Batteries on Dynamic Flexing and Calendar Aging

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Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability

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Anand Model Constants of Sn-Ag-Cu Solders: What Do They Actually Mean?

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Research Papers

State-of-the-Art and Trends in the Thermal Packaging of Electronic Equipment

Transient Natural Convection From a Leadless Chip Carrier in a Liquid Filled Enclosure: A Numerical Study

Design Parameters and Practical Considerations in the Two-Phase Forced-Convection Cooling of Multi-Chip Modules

Effects of Orientation on Critical Heat Flux From Chip Arrays During Flow Boiling

Parametric Studies for Thermal Design of Surface Mounted Components of Standard Electronic Modules

A Physics of Failure Approach to Component Placement

Investigation and Prediction of Creep and Creep-Like Behavior of Solids by Laser Methods

Thermal Stress Analysis of Pin Grid Array Structures: Pin and Solder Joint Problems

Thermal Stress Analysis of Pin Grid Array Structures: Module and Card Interactions

Predicted Bow of Plastic Packages Due to the Nonuniform Through-Thickness Distribution of Temperature

Shape and Force Relationships for Molten Axisymmetric Solder Connections

Drill Wear Monitoring in Circuit Board Manufacturing Using Drilling Forces and Their Spectra

Reliable Ceramic Window Design for Electronic Devices

Technical Briefs

Thermoelastic Solutions for a Semi-Infinite Substrate With a Powered Electronic Device

Fluid Flow Modeling and Simulation for the Coaxial Cable of the LEASAT Antenna System

Drill Wear Monitoring in Circuit Board Manufacturing: An Experimental Study

Book Reviews

Handbook of Electronic Packaging Design

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