Topics: Crack propagation , Solder joints , Failure , Creep , Cycles , Finite element analysis , Fracture (Materials) , Solders , Computer software , Cracking (Materials)

Experimental Analysis of Thermal Cycling Fatigue of Four-Layered FR4 Printed Wiring Boards

Tsung-Yu Pan, Ronald R. Cooper, Howard D. Blair, Thomas J. Whalen, John M. Nicholson

J. Electron. Packag. June 1994, 116(2): 76–82. doi: https://doi.org/10.1115/1.2905508

Abstract

View articletitled, Experimental Analysis of Thermal Cycling Fatigue of Four-Layered FR4 Printed Wiring Boards

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Topics: Experimental analysis , Fatigue , Printed circuit boards , Cycles , Design , Electrical resistance , Fracture (Materials) , Chain , Cracking (Materials) , Electronic packages

Thermal Fatigue Damage in the Solder Joints of Leadless Chip Resistors

R. K. Govila, E. Jih, Y.-H. Pao, C. Larner

J. Electron. Packag. June 1994, 116(2): 83–88. doi: https://doi.org/10.1115/1.2905509

Abstract

View articletitled, Thermal Fatigue Damage in the Solder Joints of Leadless Chip Resistors

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Topics: Fatigue damage , Resistors , Solder joints , Solders , Damage , Stress concentration , Corners (Structural elements) , Cracking (Materials) , Cycles , Design

Effects of Solder Joint Voiding and Seating Plane Stability on Surface Mount Lead Standoff

M. K. Schwiebert

J. Electron. Packag. June 1994, 116(2): 89–91. doi: https://doi.org/10.1115/1.2905510

Abstract

View articletitled, Effects of Solder Joint Voiding and Seating Plane Stability on Surface Mount Lead Standoff

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Topics: Solder joints , Stability , Surface mount packaging , Solders , Rocks , Surface mount technology

Local PWB and Component Bowing of an Assembly Subjected to a Bending Moment

D. B. Barker, Sidharth

J. Electron. Packag. June 1994, 116(2): 92–97. doi: https://doi.org/10.1115/1.2905511

Abstract

View articletitled, Local PWB and Component Bowing of an Assembly Subjected to a Bending Moment

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Topics: Manufacturing , Printed circuit boards , Cross section (Physics) , Electronic components , Rotation , Stiffness , Stress

A Fractional-Factorial Numerical Technique for Stress Analysis of Glass-To-Metal Lead Seals

Barry Mathieu, Abhijit Dasgupta

J. Electron. Packag. June 1994, 116(2): 98–104. doi: https://doi.org/10.1115/1.2905512

Abstract

View articletitled, A Fractional-Factorial Numerical Technique for Stress Analysis of Glass-To-Metal Lead Seals

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Topics: Glass , Metals , Stress analysis (Engineering) , Stress , Design , Experimental design , Fracture (Materials) , Fracture (Process) , Geometry , Simulation

The Effects of Adhesive Nonlinearity on Thermal Stress in Layered Components

Wan-Lee Yin, James L. Dale

J. Electron. Packag. June 1994, 116(2): 105–109. doi: https://doi.org/10.1115/1.2905497

Abstract

View articletitled, The Effects of Adhesive Nonlinearity on Thermal Stress in Layered Components

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Topics: Adhesives , Thermal stresses , Stress , Bonding , Materials properties , Stress-strain relations , Variational techniques

Elastic Analysis of Flip-Chip Solder Joints Undergoing Thermal Excursions

H. D. Conway, P. Bo̸rgesen, C.-Y. Li

J. Electron. Packag. June 1994, 116(2): 110–115. doi: https://doi.org/10.1115/1.2905498

Abstract

View articletitled, Elastic Analysis of Flip-Chip Solder Joints Undergoing Thermal Excursions

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Topics: Elastic analysis , Flip-chip , Solder joints , Stress , Deformation , Thermodynamic power cycles

Immersion-Cooled Standard Electronic Clamshell Module: A Building Block for Future High-Flux Avionic Systems

Issam Mudawar, Peter E. Jimenez, Robert E. Morgan

J. Electron. Packag. June 1994, 116(2): 116–125. doi: https://doi.org/10.1115/1.2905499

Abstract

View articletitled, Immersion-Cooled Standard Electronic Clamshell Module: A Building Block for Future High-Flux Avionic Systems

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Topics: Aluminum , Blocks (Building materials) , Boiling , Cavities , Condensed matter , Coolants , Cooling , Energy dissipation , Flow (Dynamics) , Hardware

Use of a Two-Dimensional Simulation Model in the Thermal Analysis of a Multi-Board Electronic Module

C. Beckermann, T. F. Smith, B. Pospichal

J. Electron. Packag. June 1994, 116(2): 126–133. doi: https://doi.org/10.1115/1.2905500

Abstract

View articletitled, Use of a Two-Dimensional Simulation Model in the Thermal Analysis of a Multi-Board Electronic Module

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Topics: Simulation models , Thermal analysis , Heat transfer , Radiation (Physics) , Air flow , Convection , Drag (Fluid dynamics) , Geometry , Heat conduction , Heat losses

Thermal Model of a PC

Ronald L. Linton, D. Agonafer

J. Electron. Packag. June 1994, 116(2): 134–137. doi: https://doi.org/10.1115/1.2905501

Abstract

View articletitled, Thermal Model of a PC

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Topics: Air flow , Computers , Convection , Cooling , Electronic packages , Flow (Dynamics) , Geometry , Modeling , Simulation , Temperature

Natural Convection Heat Transfer From an Array of Rectangular Protrusions in an Enclosure Filled With Dielectric Liquid

Y. Joshi, M. D. Kelleher, M. Powell, E. I. Torres

J. Electron. Packag. June 1994, 116(2): 138–147. doi: https://doi.org/10.1115/1.2905502

Abstract

View articletitled, Natural Convection Heat Transfer From an Array of Rectangular Protrusions in an Enclosure Filled With Dielectric Liquid

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Topics: Dielectric liquids , Heat transfer , Natural convection , Temperature , Boundary-value problems , Cooling , Electronic packages , Energy dissipation , Heat exchangers , Plates (structures)

Investigation of Thermomechanical Properties of Low Temperature Cofired Ceramic

J. M. Hu, D. Barker, R. Ghoshtagore, M. Pecht

J. Electron. Packag. June 1994, 116(2): 148–153. doi: https://doi.org/10.1115/1.2905503

Abstract

View articletitled, Investigation of Thermomechanical Properties of Low Temperature Cofired Ceramic

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Topics: Ceramics , Low temperature , Thermomechanics , Temperature , Bending strength , Design , Elastic moduli , Electronic packages , Fracture toughness , Materials properties

Technical Briefs

Bending and Twisting of 60Sn40Pb Solder Interconnects With Creep

John H. Lau

J. Electron. Packag. June 1994, 116(2): 154–157. doi: https://doi.org/10.1115/1.2905504

Abstract

View articletitled, Bending and Twisting of 60Sn40Pb Solder Interconnects With Creep

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Topics: Creep , Solders , Cylinders , Geometry , Materials properties

Influence of Surface Mount Lead End Geometry on Fatigue Life

Vineet K. Gupta, Donald B. Barker

J. Electron. Packag. June 1994, 116(2): 157–160. doi: https://doi.org/10.1115/1.2905505

Abstract

View articletitled, Influence of Surface Mount Lead End Geometry on Fatigue Life

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Topics: Fatigue life , Geometry , Surface mount packaging , Shapes , Solder joints , Solders , Dimensions , Fatigue , Fatigue damage , Finite element analysis