Topics: Fracture (Materials) , Shapes , Solder joints , Solders , Computer-aided design , Fatigue cracks , Capacitors , Ceramics , Copper , Image processing

Boundary Layer Fracture in Composite Solder Joints

Roger B. Clough, Alexander J. Shapiro, Andrew J. Bayba, George K. Lucey, Jr.

J. Electron. Packag. December 1995, 117(4): 270–274. doi: https://doi.org/10.1115/1.2792104

Abstract

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Topics: Boundary layers , Composite materials , Fracture (Materials) , Fracture (Process) , Solder joints , Shear (Mechanics) , Solders , Copper , Creep , Displacement

Optimal Chip Layout on a Printed Circuit Board Using Design Sensitivity Analysis of Subdomain Configuration

Seo Jin Joo, Byung Man Kwak

J. Electron. Packag. December 1995, 117(4): 275–280. doi: https://doi.org/10.1115/1.2792105

Abstract

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Topics: Design sensitivity analysis , Printed circuit boards , Design , Optimization , Sensitivity analysis , Shape design , Shapes

Cleaning and Reflow of Pb-Sn C4 Solder Bumps

Caroline S. Lee, Doug C. Crafts, T. W. Eagar

J. Electron. Packag. December 1995, 117(4): 281–287. doi: https://doi.org/10.1115/1.2792106

Abstract

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Topics: Solders , Tin , Etching , Corrosion , Diffusion (Physics) , Electroplating , Metallurgy , Reflow soldering , Sulfur , Water

Integrated Infrared Failure Analysis of Printed Circuit Boards

J. J. Miles, C. R. Zelak, J. M. Kliman, J. E. Sunderland

J. Electron. Packag. December 1995, 117(4): 288–293. doi: https://doi.org/10.1115/1.2792107

Abstract

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Topics: Failure analysis , Printed circuit boards , Testing , Heat transfer , Infrared imaging , Manufacturing , Radiation (Physics)

Computations for a Three-by-Three Array of Protrusions Cooled by Liquid Immersion: Effect of Substrate Thermal Conductivity

D. Mukutmoni, Y. K. Joshi, M. D. Kelleher

J. Electron. Packag. December 1995, 117(4): 294–300. doi: https://doi.org/10.1115/1.2792108

Abstract

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Topics: Computation , Thermal conductivity , Heat , Coolants , Cooling , Electrical measurement , Electronic components , Fluid dynamics , Fluids , Heat sinks

Effect of Wall Conduction on Natural Convection in an Enclosure With a Centered Heat Source

Yi-Hsiang Huang, Suresh K. Aggarwal

J. Electron. Packag. December 1995, 117(4): 301–306. doi: https://doi.org/10.1115/1.2792109

Abstract

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Topics: Heat , Heat conduction , Natural convection , Heat transfer , Thermal conductivity , Wall thickness , Rayleigh number , Algorithms , Boundary-value problems , Cavities

Natural Convection in Shallow, Horizontal Air Layers Encountered in Electronic Cooling

Elias Papanicolaou, Sridhar Gopalakrishna

J. Electron. Packag. December 1995, 117(4): 307–316. doi: https://doi.org/10.1115/1.2792110

Abstract

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Topics: Computer cooling , Natural convection , Convection , Heat transfer , Cooling , Dimensions , Energy conservation , Heat conduction , Heat flux , Heating

Simulation of Heat Transfer in a Reflow Soldering Oven With Air and Nitrogen Injection

Y. S. Son, T. L. Bergman, M. T. Hyun

J. Electron. Packag. December 1995, 117(4): 317–322. doi: https://doi.org/10.1115/1.2792111

Abstract

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Topics: Heat transfer , Nitrogen , Ovens , Reflow soldering , Simulation , Buoyancy , Computer simulation , Cooling , Fluctuations (Physics) , Heating

Comparison of Two-Phase Electronic Cooling Using Free Jets and Sprays

Kurt A. Estes, Issam Mudawar

J. Electron. Packag. December 1995, 117(4): 323–332. doi: https://doi.org/10.1115/1.2792112

Abstract

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Topics: Computer cooling , Jets , Sprays , Cooling , Critical heat flux , Subcooling , Flow (Dynamics) , Liquid films , Boiling , Coolants

Review of Heat Transfer Technologies in Electronic Equipment

L. T. Yeh

J. Electron. Packag. December 1995, 117(4): 333–339. doi: https://doi.org/10.1115/1.2792113

Abstract

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Topics: Electronic equipment , Heat transfer , Air Force , Design , Electronic systems , Electronics , Energy dissipation , Failure , Heat , Reliability