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Issues
March 1996
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Technical Papers
Fine Pitch Stencil Printing Process Modeling and Optimization
J. Electron. Packag. March 1996, 118(1): 1–6.
doi: https://doi.org/10.1115/1.2792121
Topics:
Modeling
,
Optimization
,
Printing
,
Solders
,
Design
,
Neural network models
,
Algorithms
,
Assembly lines
,
Engineering simulation
,
Machinery
Controlling the Dimensions of Laser Chemical Vapor Deposited Metallurgy
J. Electron. Packag. March 1996, 118(1): 7–10.
doi: https://doi.org/10.1115/1.2792126
Topics:
Dimensions
,
Lasers
,
Metallurgy
,
Vapors
,
Metals
,
Microchannels
,
Chemical vapor deposition
,
Circuits
,
Density
,
Finite element model
PCB Layout Design Using a Genetic Algorithm
J. Electron. Packag. March 1996, 118(1): 11–15.
doi: https://doi.org/10.1115/1.2792119
Topics:
Design
,
Genetic algorithms
,
Printed circuit boards
,
Heat
Statistical Model for the Inherent Tilt of Flip-Chips
J. Electron. Packag. March 1996, 118(1): 16–20.
doi: https://doi.org/10.1115/1.2792120
Topics:
Flip-chip devices
,
Algorithms
,
Dimensions
,
Simulation
,
Solders
Single-Phase and Boiling Cooling of Small Pin Fin Arrays by Multiple Nozzle Jet Impingement
J. Electron. Packag. March 1996, 118(1): 21–26.
doi: https://doi.org/10.1115/1.2792122
Topics:
Boiling
,
Cooling
,
Nozzles
,
Critical heat flux
,
Flow (Dynamics)
,
Heat transfer coefficients
,
Copper
,
Dimensions
,
Heat
,
Heat transfer
Comparison of the Cooling Performance of Staggered and In-Line Arrays of Electronic Packages
J. Electron. Packag. March 1996, 118(1): 27–30.
doi: https://doi.org/10.1115/1.2792123
Heat Transfer From an Array of Strips to Fluorinert Coolant in a Mixed Impinging-Jet/Channel-Flow Configuration
J. Electron. Packag. March 1996, 118(1): 31–36.
doi: https://doi.org/10.1115/1.2792124
Topics:
Channel flow
,
Coolants
,
Heat transfer
,
Strips
,
Cooling
,
Flow (Dynamics)
,
Water
Technical Brief
A Model for Deformation of Solder Bumps From Ramp Loading
J. Electron. Packag. March 1996, 118(1): 37–40.
doi: https://doi.org/10.1115/1.2792125
Topics:
Deformation
,
Solders
,
Algorithms
,
Ball-Grid-Array packaging
,
Design
,
Flip-chip
,
Reliability
,
Solder joints
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