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Volume 118, Issue 2

June 1996

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ISSN 1043-7398

EISSN 1528-9044

In this Issue

Technical Papers
Technical Briefs

Technical Papers

Fatigue Crack Initiation in Solder Joints

Z. Zhang, Daping Yao, J. K. Shang

J. Electron. Packag. June 1996, 118(2): 41–44. doi: https://doi.org/10.1115/1.2792129

Abstract

View articletitled, Fatigue Crack Initiation in Solder Joints

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Topics: Fatigue cracks , Solder joints , Cycles , Fatigue , Finite element methods , Fracture (Materials) , Simulation , Solders , Stress

An Experimental Technique for Studying Mixed-Mode Fatigue Crack Growth in Solder Joints

Daping Yao, Z. Zhang, J. K. Shang

J. Electron. Packag. June 1996, 118(2): 45–48. doi: https://doi.org/10.1115/1.2792130

Abstract

View articletitled, An Experimental Technique for Studying Mixed-Mode Fatigue Crack Growth in Solder Joints

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Topics: Fatigue cracks , Solder joints , Fracture (Materials) , Solders , Failure , Fatigue , Finite element analysis , Sands

Effect of Microstructure Size on Deformation Kinetics and Thermo-Mechanical Fatigue of 63Sn37Pb Solder Joints

Zhenfeng Guo, Hans Conrad

J. Electron. Packag. June 1996, 118(2): 49–54. doi: https://doi.org/10.1115/1.2792131

Abstract

View articletitled, Effect of Microstructure Size on Deformation Kinetics and Thermo-Mechanical Fatigue of 63Sn37Pb Solder Joints

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Topics: Deformation , Fatigue , Solder joints , Thermomechanics , Cooling , Creep , Fatigue cracks , Fatigue life , Stress , Temperature

Solder Joint Reliability Prediction by the Integrated Matrix Creep Method

R. J. Iannuzzelli, J. M. Pitarresi, V. Prakash

J. Electron. Packag. June 1996, 118(2): 55–61. doi: https://doi.org/10.1115/1.2792132

Abstract

View articletitled, Solder Joint Reliability Prediction by the Integrated Matrix Creep Method

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Topics: Creep , Reliability , Solder joints , Fatigue life , Design , Interferometry , Lasers , Modeling , Simulation , Solders

A Thermal Fatigue Failure Mechanism of 58Bi-42Sn Solder Joints

Zequn Mei, Helen Holder

J. Electron. Packag. June 1996, 118(2): 62–66. doi: https://doi.org/10.1115/1.2792133

Abstract

View articletitled, A Thermal Fatigue Failure Mechanism of 58Bi-42Sn Solder Joints

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Topics: Fatigue failure , Solder joints , Tin , Coatings , Failure , Agglomeration (Materials) , Atoms , Cycles , Failure analysis , Melting

Energy Approach to the Fatigue of 60/40 Solder: Part II— Influence of Hold Time and Asymmetric Loading

H. D. Solomon, E. D. Tolksdorf

J. Electron. Packag. June 1996, 118(2): 67–71. doi: https://doi.org/10.1115/1.2792134

View articletitled, Energy Approach to the Fatigue of 60/40 Solder: Part II— Influence of Hold Time and Asymmetric Loading

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Topics: Fatigue , Solders

A Nonlinear Multi-Domain Stress Analysis Method for Surface-Mount Solder Joints

S. Ling, A. Dasgupta

J. Electron. Packag. June 1996, 118(2): 72–79. doi: https://doi.org/10.1115/1.2792135

Abstract

View articletitled, A Nonlinear Multi-Domain Stress Analysis Method for Surface-Mount Solder Joints

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Topics: Solder joints , Stress analysis (Engineering) , Surface mount packaging , Stress , Fatigue , Creep , Electronic packages , Deformation , Finite element analysis , Modeling

Bus Bar Solder Joint Durability Evaluation

T. Eric Wong, Harold M. Cohen

J. Electron. Packag. June 1996, 118(2): 80–86. doi: https://doi.org/10.1115/1.2792136

Abstract

View articletitled, Bus Bar Solder Joint Durability Evaluation

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Topics: Durability , Solder joints , Damage , Military aircraft , Reliability , Temperature , Computers , Electronic packaging , Failure , Fatigue life

Stress Analysis of Printed Circuit Boards With Highly Populated Solder Joints and Components: A Micromechanics Approach

K. X. Hu, Y. Huang, C. P. Yeh, K. W. Wyatt

J. Electron. Packag. June 1996, 118(2): 87–93. doi: https://doi.org/10.1115/1.2792137

Abstract

View articletitled, Stress Analysis of Printed Circuit Boards With Highly Populated Solder Joints and Components: A Micromechanics Approach

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Topics: Micromechanics (Engineering) , Printed circuit boards , Solder joints , Stress analysis (Engineering) , Lumber , Accounting , Composite materials , Energy budget (Physics) , Finite element analysis , Stress concentration