Topics: Ball-Grid-Array packaging , Flip-chip , Shapes , Solder joints , Finite element analysis , Design , Fatigue life , Reliability , Geometry , Solders

Simulation and Interpretation of Wetting Balance Tests Using the Surface Evolver

D. C. Whalley, P. P. Conway

J. Electron. Packag. September 1996, 118(3): 134–141. doi: https://doi.org/10.1115/1.2792143

Abstract

View articletitled, Simulation and Interpretation of Wetting Balance Tests Using the Surface Evolver

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Topics: Simulation , Wetting , Solders , Surface tension , Electromagnetic scattering , Errors , Modeling , Shapes , Solder joints , Soldering

Parametric Finite Element Method for Predicting Shapes of Three-Dimensional Solder Joints

N. J. Nigro, F. J. Zhou, S. M. Heinrich, A. F. Elkouh, R. A. Fournelle, P. S. Lee

J. Electron. Packag. September 1996, 118(3): 142–147. doi: https://doi.org/10.1115/1.2792144

Abstract

View articletitled, Parametric Finite Element Method for Predicting Shapes of Three-Dimensional Solder Joints

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Topics: Finite element methods , Shapes , Solder joints , Boundary-value problems , Finite element analysis , Interpolation , Potential energy , Solders

Reliability Simulations for Solder Joints Using Stochastic Finite Element and Artificial Neural Network Models

G. Subbarayan, Y. Li, R. L. Mahajan

J. Electron. Packag. September 1996, 118(3): 148–156. doi: https://doi.org/10.1115/1.2792145

Abstract

View articletitled, Reliability Simulations for Solder Joints Using Stochastic Finite Element and Artificial Neural Network Models

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Topics: Artificial neural networks , Engineering simulation , Finite element analysis , Reliability , Simulation , Solder joints , Design , Manufacturing , Finite element model , Ball-Grid-Array packages

Verification of Numerical Models Used in Microelectronics Packaging Design by Interferometric Displacement Measurement Methods

B. Han, Y. Guo, C. K. Lim, D. Caletka

J. Electron. Packag. September 1996, 118(3): 157–163. doi: https://doi.org/10.1115/1.2792146

Abstract

View articletitled, Verification of Numerical Models Used in Microelectronics Packaging Design by Interferometric Displacement Measurement Methods

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Topics: Computer simulation , Design , Displacement measurement , Microelectronic packaging , Interferometry , Displacement , Cycles , Electronic packaging , Geometry , Modeling

Prediction of Fatigue Failure of 60Sn-40Pb Solder Using Constitutive Model for Cyclic Viscoplasticity

Hiromasa Ishikawa, Katsuhiko Sasaki, Ken-ichi Ohguchi

J. Electron. Packag. September 1996, 118(3): 164–169. doi: https://doi.org/10.1115/1.2792147

Abstract

View articletitled, Prediction of Fatigue Failure of 60Sn-40Pb Solder Using Constitutive Model for Cyclic Viscoplasticity

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Topics: Constitutive equations , Fatigue failure , Solders , Viscoplasticity , Alloys , Deformation , Density , Compression , Creep , Fatigue life

Effect of Interface Roughness on Fatigue Crack Growth in Sn-Pb Solder Joints

J. K. Shang, Daping Yao

J. Electron. Packag. September 1996, 118(3): 170–173. doi: https://doi.org/10.1115/1.2792148

Abstract

View articletitled, Effect of Interface Roughness on Fatigue Crack Growth in Sn-Pb Solder Joints

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Topics: Fatigue cracks , Interface roughness , Solder joints , Tin , Fracture (Materials) , Elasticity , Fracture mechanics , Intermetallic compounds , Shear strength , Solders

Dynamic Aspects of Wetting Balance Tests

K. W. Moon, W. J. Boettinger, M. E. Williams, D. Josell, B. T. Murray, W. C. Carter, C. A. Handwerker

J. Electron. Packag. September 1996, 118(3): 174–183. doi: https://doi.org/10.1115/1.2792149

Abstract

View articletitled, Dynamic Aspects of Wetting Balance Tests

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Topics: Wetting , Plates (structures) , Fluids , Glass , Shapes , Solders , Computer software , Equilibrium (Physics) , Flow (Dynamics) , Shear stress