Skip Nav Destination

Issues

Select Decade

Select Year

Issue

Volume 122, Issue 1

March 2000

Previous Issue
Next Issue

ISSN 1043-7398

EISSN 1528-9044

In this Issue

Technical Papers
Book Reviews
Erratum

Editor’s Note

Ephraim Suhir, Chi Shih Chang

J. Electron. Packag. March 2000, 122(1): 1–2. doi: https://doi.org/10.1115/1.483135

Abstract

View articletitled, Editor’s Note

Open the PDF for in another window

Topics: Electronic packaging , Engineering teachers , Industrial research , Packaging , Teams , Materials research , Polymers , Reliability , Solder joints , Testing

Technical Papers

Predicted Fundamental Vibration Frequency of a Heavy Electronic Component Mounted on a Printed Circuit Board

Ephraim Suhir, Fellow ASME

J. Electron. Packag. March 2000, 122(1): 3–5. doi: https://doi.org/10.1115/1.483134

Abstract

View articletitled, Predicted Fundamental Vibration Frequency of a Heavy Electronic Component Mounted on a Printed Circuit Board

Open the PDF for in another window

Topics: Electronic components , Oscillating frequencies , Oscillations , Printed circuit boards , Vibration , Stiffness , Resonance , Fatigue , Free vibrations

A System for First Order Reliability Estimation of Solder Joints in Area Array Packages

Anand M. Deshpande, Ganesh Subbarayan, Dan Rose

J. Electron. Packag. March 2000, 122(1): 6–12. doi: https://doi.org/10.1115/1.483125

Abstract

View articletitled, A System for First Order Reliability Estimation of Solder Joints in Area Array Packages

Open the PDF for in another window

Topics: Artificial neural networks , Fatigue life , Reliability , Solder joints , Design , Solders

Decomposition Techniques for the Efficient Analysis of Area-Array Packages

Anand M. Deshpande, Ganesh Subbarayan

J. Electron. Packag. March 2000, 122(1): 13–19. doi: https://doi.org/10.1115/1.483126

Abstract

View articletitled, Decomposition Techniques for the Efficient Analysis of Area-Array Packages

Open the PDF for in another window

Topics: Design , Finite element analysis , Solder joints , Solders , Displacement , Artificial neural networks

Integrated Flow Analysis During Filling and Post-Filling Stage of Semiconductor Encapsulation

Sejin Han, K. K. Wang

J. Electron. Packag. March 2000, 122(1): 20–27. doi: https://doi.org/10.1115/1.483127

Abstract

View articletitled, Integrated Flow Analysis During Filling and Post-Filling Stage of Semiconductor Encapsulation

Open the PDF for in another window

Topics: Cavities , Flow (Dynamics) , Hardening (Curing) , Molding , Packing (Shipments) , Packings (Cushioning) , Pressure , Semiconductors (Materials) , Temperature , Viscosity

On the Mechanical Reliability of Photo-BCB-Based Thin Film Dielectric Polymer for Electronic Packaging Applications

Jang-hi Im, Mem. ASME, Edward O. Shaffer, II, Theodore Stokich,, Jr., Andrew Strandjord, Jack Hetzner, James Curphy, Cheryl Karas, Greg Meyers, David Hawn, Ashok Chakrabarti, Steve Froelicher

J. Electron. Packag. March 2000, 122(1): 28–33. doi: https://doi.org/10.1115/1.483128

Abstract

View articletitled, On the Mechanical Reliability of Photo-BCB-Based Thin Film Dielectric Polymer for Electronic Packaging Applications

Open the PDF for in another window

Topics: Adhesion , Atomic force microscopy , Coatings , Polymers , Reliability , Thermal stability , Thin films , Fracture (Process) , Fracture (Materials) , Silicon

Temperature-Dependent Popcorning Analysis of Plastic Ball Grid Array Package During Solder Reflow With Fracture Mechanics Method

John H. Lau, Fellow ASME, S. W. Ricky Lee, Mem. ASME

J. Electron. Packag. March 2000, 122(1): 34–41. doi: https://doi.org/10.1115/1.483129

Abstract

View articletitled, Temperature-Dependent Popcorning Analysis of Plastic Ball Grid Array Package During Solder Reflow With Fracture Mechanics Method

Open the PDF for in another window

Topics: Fracture (Materials) , Fracture mechanics , Temperature , Stress , Copper , Solder masks

Over-Temperature Forecasts on Electronic Packages Through a Transient R–C Model

Ben-Je Lwo, Kun-Fu Tseng, Ching-Hsing Kao, Luke Su Lu

J. Electron. Packag. March 2000, 122(1): 42–47. doi: https://doi.org/10.1115/1.483130

Abstract

View articletitled, Over-Temperature Forecasts on Electronic Packages Through a Transient R–C Model

Open the PDF for in another window

Topics: Steady state , Temperature , Transients (Dynamics) , Circuits , Convection

Thermomechanical Fatigue Testing and Analysis of Solder Alloys

M. A. Palmer, P. E. Redmond, R. W. Messler,, Jr.

J. Electron. Packag. March 2000, 122(1): 48–54. doi: https://doi.org/10.1115/1.483131

Abstract

View articletitled, Thermomechanical Fatigue Testing and Analysis of Solder Alloys

Open the PDF for in another window

Topics: Alloys , Cycles , Solder joints , Solders , Stress , Thermomechanics , Tin , Failure , Fatigue , Temperature

New Reworkable High Temperature Low Modulus (in Excess of 400–500 °C) Adhesives for MCM-D Assembly

Jiali Wu, Randy T. Pike, S. K. Sitaraman, C. P. Wong

J. Electron. Packag. March 2000, 122(1): 55–60. doi: https://doi.org/10.1115/1.483124

Abstract

View articletitled, New Reworkable High Temperature Low Modulus (in Excess of 400–500 °C) Adhesives for MCM-D Assembly

Open the PDF for in another window

Topics: Adhesives , Tiles , Thermal stability , High temperature , Glass , Manufacturing , Pallets , Adhesion

Interfacial Thermal Stress Analysis of Anisotropic Multi-Layered Electronic Packaging Structures

Weidong Xie, Suresh K. Sitaraman

J. Electron. Packag. March 2000, 122(1): 61–66. doi: https://doi.org/10.1115/1.483133

Abstract

View articletitled, Interfacial Thermal Stress Analysis of Anisotropic Multi-Layered Electronic Packaging Structures

Open the PDF for in another window

Topics: Laminates , Stress , Thermal stresses , Shapes , Anisotropy , Electronic packaging

Specimen Design for Mixed Mode Interfacial Fracture Properties Measurement in Electronic Packages

Dickson T. S. Yeung, David C. C. Lam, Matthew M. F. Yuen

J. Electron. Packag. March 2000, 122(1): 67–72. doi: https://doi.org/10.1115/1.483137

Abstract

View articletitled, Specimen Design for Mixed Mode Interfacial Fracture Properties Measurement in Electronic Packages

Open the PDF for in another window

Topics: Design , Electronic packages , Electronic packaging , Fracture (Materials) , Fracture (Process) , Fracture toughness , Stress , Testing , Geometry , Packaging

Book Reviews

Mechanical Analysis of Electronic Packaging Systems

Stephen A. McKeown,, Author, A. J. Rafanelli,, Reviewer

J. Electron. Packag. March 2000, 122(1): 73. doi: https://doi.org/10.1115/1.483132

Abstract

View articletitled, Mechanical Analysis of Electronic Packaging Systems

Open the PDF for in another window

Topics: Electronic packaging , Engineering education , Integrated circuit packaging , Packaging

Erratum

Erratum: “Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy” [ASME J. Electron. Packag., 121, pp. 179–185]

X. Q. Shi,, W. Zhou,, H. L. J. Pang, and, Z. P. Wang

J. Electron. Packag. March 2000, 122(1): 74. doi: https://doi.org/10.1115/1.483136

Abstract

View articletitled, Erratum: “Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy” [ASME J. Electron. Packag., <strong>121</strong>, pp. 179–185]

Open the PDF for in another window

Topics: Alloys , Electrons , Mechanical properties , Solders , Temperature , Eutectic alloys , Soldering , Stress-strain relations , Thermomechanical treatment

All Issues

Email alerts

Accepted Manuscript Alert

New Issue Alert

RSS Feeds

Open Issues RSS Feed

Latest
Most Read
Most Cited

Understanding the Impact of Data Center Liquid Cooling on Energy and Performance of Machine Learning and Artificial Intelligence Workloads

J. Electron. Packag (June 2025)

Anand Model Constants of Sn–Ag–Cu Solders: What Do They Actually Mean?

J. Electron. Packag (June 2025)

Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability

J. Electron. Packag (June 2025)

Performance Analysis of a Brazed Plate Heat Exchanger during Condensation of R1233zd(E)

J. Electron. Packag

Electrochemical Linked to Mechanical Simulation for an Assessment of State-Of-Health of Thin-flexible Li-ion Batteries on Dynamic Flexing and Calendar Aging

J. Electron. Packag

Editor’s Note

Technical Papers

Predicted Fundamental Vibration Frequency of a Heavy Electronic Component Mounted on a Printed Circuit Board

A System for First Order Reliability Estimation of Solder Joints in Area Array Packages

Decomposition Techniques for the Efficient Analysis of Area-Array Packages

Integrated Flow Analysis During Filling and Post-Filling Stage of Semiconductor Encapsulation

On the Mechanical Reliability of Photo-BCB-Based Thin Film Dielectric Polymer for Electronic Packaging Applications

Temperature-Dependent Popcorning Analysis of Plastic Ball Grid Array Package During Solder Reflow With Fracture Mechanics Method

Over-Temperature Forecasts on Electronic Packages Through a Transient R–C Model

Thermomechanical Fatigue Testing and Analysis of Solder Alloys

New Reworkable High Temperature Low Modulus (in Excess of 400–500 °C) Adhesives for MCM-D Assembly

Interfacial Thermal Stress Analysis of Anisotropic Multi-Layered Electronic Packaging Structures

Specimen Design for Mixed Mode Interfacial Fracture Properties Measurement in Electronic Packages

Book Reviews

Mechanical Analysis of Electronic Packaging Systems

Erratum

Erratum: “Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy” [ASME J. Electron. Packag., 121, pp. 179–185]

Email alerts

RSS Feeds

ASME Journals

ASME Conference Proceedings

ASME eBooks

Resources

Opportunities

Issues

Technical Papers

Book Reviews

Erratum

Email alerts

RSS Feeds

ASME Journals

ASME Conference Proceedings

ASME eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only