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Issues
June 2003
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Foreword
In Honor of Dr. M. M. Yovanovich
J. Electron. Packag. June 2003, 125(2): 165–168.
doi: https://doi.org/10.1115/1.1568123
Topics:
Contact resistance
,
Convection
,
Engineering teachers
,
Graduate students
,
Heat conduction
,
Heat transfer
,
Packaging
,
Students
,
Thermal resistance
,
Modeling
Technical Papers
Thermal Resistances of Circular Source on Finite Circular Cylinder With Side and End Cooling
J. Electron. Packag. June 2003, 125(2): 169–177.
doi: https://doi.org/10.1115/1.1568124
Topics:
Circular cylinders
,
Cooling
,
Cylinders
,
Disks
,
Heat flux
,
Temperature
,
Boundary-value problems
,
Thermal resistance
,
Approximation
Thermal Spreading Resistance of Eccentric Heat Sources on Rectangular Flux Channels
Y. S. Muzychka, Assistant Professor,, J. R. Culham, Associate Professor, Mem. ASME, M. M. Yovanovich, Distinguished Professor Emeritus, Fellow ASME
J. Electron. Packag. June 2003, 125(2): 178–185.
doi: https://doi.org/10.1115/1.1568125
Topics:
Heat
,
Temperature
Thermal and Mechanical Model for Rigid Cylinder Indenting an Elastic Layer Resting on Rigid Base: Application to Turned Surfaces
Zhe Zhang, Graduate Research Assistant,, E. E. Marotta, Senior Engineer/Scientist/Adjunct Professor—Thermal Development,, J. M. Ochterbeck, Associate Professor,
J. Electron. Packag. June 2003, 125(2): 186–191.
doi: https://doi.org/10.1115/1.1568126
Thermal Interfacing Techniques for Electronic Equipment—A Perspective
J. Electron. Packag. June 2003, 125(2): 192–199.
doi: https://doi.org/10.1115/1.1568127
Topics:
Contact resistance
,
Cooling
,
Electrical conductance
,
Electronic equipment
,
Flat heat pipes
,
Flow (Dynamics)
,
Heat
,
Heat conduction
,
Heat sinks
,
Heat transfer
Optimal Internal Structure of Volumes Cooled by Single-Phase Forced and Natural Convection
J. Electron. Packag. June 2003, 125(2): 200–207.
doi: https://doi.org/10.1115/1.1566970
Topics:
Boundary layers
,
Cooling
,
Flow (Dynamics)
,
Forced convection
,
Heat
,
Natural convection
,
Temperature
,
Fluids
,
Design
,
Plates (structures)
Design of Optimum Plate-Fin Natural Convective Heat Sinks
J. Electron. Packag. June 2003, 125(2): 208–216.
doi: https://doi.org/10.1115/1.1568361
Topics:
Design
,
Heat sinks
,
Heat transfer coefficients
,
Optimization
,
Heat transfer
,
Heat
,
Energy dissipation
,
Specific heat
,
Natural convection
The Case for the Elliptical Spine
J. Electron. Packag. June 2003, 125(2): 217–220.
doi: https://doi.org/10.1115/1.1569261
Topics:
Mechanical admittance
,
Heat
,
Temperature
Fundamental Performance Limits of Heatsinks
J. Electron. Packag. June 2003, 125(2): 221–225.
doi: https://doi.org/10.1115/1.1569262
Topics:
Flow (Dynamics)
,
Thermal conductivity
,
Pressure drop
,
Dimensions
,
Fins
,
Cooling
On the Use of Point Source Solutions for Forced Air Cooling of Electronic Components—Part I: Thermal Wake Models for Rectangular Heat Sources
J. Electron. Packag. June 2003, 125(2): 226–234.
doi: https://doi.org/10.1115/1.1569506
Topics:
Cooling
,
Flow (Dynamics)
,
Heat
,
Strips
,
Temperature
,
Wakes
,
Electronic components
,
Turbulence
On the Use of Point Source Solutions for Forced Air Cooling of Electronic Components—Part II: Conjugate Forced Convection From a Discrete Rectangular Source on a Thin Conducting Plate
J. Electron. Packag. June 2003, 125(2): 235–243.
doi: https://doi.org/10.1115/1.1569507
Thermobuoyancy Treatment for Electronic Packaging Using an Improved Advection Scheme
J. Electron. Packag. June 2003, 125(2): 244–250.
doi: https://doi.org/10.1115/1.1569508
Topics:
Approximation
,
Buoyancy
,
Cavities
,
Electronic packaging
,
Flow (Dynamics)
,
Fluid dynamics
,
Heat transfer
,
Modeling
,
Natural convection
,
Rayleigh number
Numerical Investigation of the Steady-State Operation of a Cylindrical Capillary Pumped Loop Evaporator
J. Electron. Packag. June 2003, 125(2): 251–260.
doi: https://doi.org/10.1115/1.1569509
Topics:
Boundary-value problems
,
Flow (Dynamics)
,
Fluids
,
Heat
,
Heat flux
,
Porous materials
,
Pressure
,
Steady state
,
Subcooling
,
Temperature
Modeling of Thermal Stress in Microelectronic and Photonic Structures: Role, Attributes, Challenges, and Brief Review
J. Electron. Packag. June 2003, 125(2): 261–267.
doi: https://doi.org/10.1115/1.1569510
Topics:
Modeling
,
Stress
,
Thermal stresses
,
Finite element analysis
,
Photonics
,
Thermal expansion
,
Design
,
Microelectronic devices
,
Optical fiber
,
Manufacturing
Additional Technical Papers
Computer-Aided Design of a TSOP II LOC Package Using Taguchi’s Parameter Design Method to Optimize Mold-Flow Balance
J. Electron. Packag. June 2003, 125(2): 268–275.
doi: https://doi.org/10.1115/1.1569957
Topics:
Computer-aided design
,
Design
,
Design methodology
,
Flow (Dynamics)
,
Taguchi methods
,
Noise factors
,
Molding
,
Packaging
,
Simulation
,
Manufacturing
Choosing Working Fluid for Two-Phase Thermosyphon Systems for Cooling of Electronics
J. Electron. Packag. June 2003, 125(2): 276–281.
doi: https://doi.org/10.1115/1.1571570
Topics:
Boiling
,
Cooling
,
Fluids
,
Pressure drop
,
Heat transfer
,
Temperature
,
Heat
,
Condensation
Measurement of Creep and Relaxation Behaviors of Wafer-Level CSP Assembly Using Moire´ Interferometry
J. Electron. Packag. June 2003, 125(2): 282–288.
doi: https://doi.org/10.1115/1.1571571
Calibrate Piezoresistive Stress Sensors Through the Assembled Structure
J. Electron. Packag. June 2003, 125(2): 289–293.
doi: https://doi.org/10.1115/1.1572904
Topics:
Calibration
,
Sensors
,
Stress
,
Temperature
Investigation of Variable Frequency Microwave Processing for Electronic Packaging Applications
J. Electron. Packag. June 2003, 125(2): 294–301.
doi: https://doi.org/10.1115/1.1571076
Topics:
Failure
,
Failure analysis
,
Microwaves
,
Proton exchange membranes
,
Radiation (Physics)
,
Stress
,
Delamination
,
Heating
,
Leakage
,
Electronic packaging
Variable Frequency Microwave Processing of Underfill Encapsulants for Flip-Chip Applications
J. Electron. Packag. June 2003, 125(2): 302–307.
doi: https://doi.org/10.1115/1.1571077
Topics:
Convection
,
Delamination
,
Fillers (Materials)
,
Flip-chip
,
Microwaves
,
Ovens
,
Particulate matter
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Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability
J. Electron. Packag
Anand Model Constants of Sn-Ag-Cu Solders: What Do They Actually Mean?
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