Skip Nav Destination
Issues
December 2003
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Foreword
Thermal and Mechanical Simulation and Experiments in Micro-electronics and Microsystems
J. Electron. Packag. December 2003, 125(4): 465.
doi: https://doi.org/10.1115/1.1634590
Technical Papers
Four-Terminal Measurement and Simulations for Sheet Resistance in Piezoresistive Sensing Elements
J. Electron. Packag. December 2003, 125(4): 466–469.
doi: https://doi.org/10.1115/1.1615250
Topics:
Diffusion (Physics)
,
Finite element analysis
,
Simulation
,
Semiconductor wafers
,
Pressure
Humidity-Induced Voltage Shift on MEMS Pressure Sensors
J. Electron. Packag. December 2003, 125(4): 470–474.
doi: https://doi.org/10.1115/1.1615249
A Vapotron Effect Application for Electronic Equipment Cooling
J. Electron. Packag. December 2003, 125(4): 475–479.
doi: https://doi.org/10.1115/1.1615796
Topics:
Boiling
,
Cavities
,
Cooling
,
Electronic equipment
,
Fluids
,
Forced convection
,
Heat transfer coefficients
,
Heating
,
Refrigerants
,
Temperature
A Board Level Study of an Array of Ball Grid Components—Aerodynamic and Thermal Measurements
J. Electron. Packag. December 2003, 125(4): 480–489.
doi: https://doi.org/10.1115/1.1604811
Response Surface Modeling for Nonlinear Packaging Stresses
J. Electron. Packag. December 2003, 125(4): 490–497.
doi: https://doi.org/10.1115/1.1604149
Topics:
Design
,
Finite element model
,
Packaging
,
Response surface methodology
,
Stress
,
Temperature
,
Optimization
,
Modeling
,
Solders
,
Testing
Parameterized Modeling of Thermomechanical Reliability for CSP Assemblies
J. Electron. Packag. December 2003, 125(4): 498–505.
doi: https://doi.org/10.1115/1.1604150
Topics:
Finite element analysis
,
Reliability
,
Simulation
,
Solder joints
,
Solders
,
Modeling
,
Thermomechanics
,
Sensitivity analysis
,
Design
,
Dimensions
Residual Stresses in Multilayer Ceramic Capacitors: Measurement and Computation
J. Electron. Packag. December 2003, 125(4): 506–511.
doi: https://doi.org/10.1115/1.1604151
Topics:
Capacitors
,
Ceramics
,
Computation
,
Computer simulation
,
Cooling
,
Finite element analysis
,
Residual stresses
,
Simulation
,
Sintering
,
Stress
Thermally Induced Delamination Buckling of a Thin Metal Layer on a Ceramic Substrate
J. Electron. Packag. December 2003, 125(4): 512–519.
doi: https://doi.org/10.1115/1.1604152
Topics:
Buckling
,
Ceramics
,
Copper
,
Delamination
,
Finite element methods
,
Finite element model
,
Simulation
,
Stress
,
Temperature
,
Deformation
Packaging Induced Die Stresses—Effect of Chip Anisotropy and Time-Dependent Behavior of a Molding Compound
J. Electron. Packag. December 2003, 125(4): 520–526.
doi: https://doi.org/10.1115/1.1604153
Topics:
Anisotropy
,
Molding
,
Packaging
,
Stress
,
Temperature
,
Viscoelasticity
,
Finite element analysis
Modeling the Thermal Actuation in a Thermo-Pneumatic Micropump
J. Electron. Packag. December 2003, 125(4): 527–530.
doi: https://doi.org/10.1115/1.1604154
Topics:
Micropumps
,
Simulation
,
Finite element methods
,
Engineering simulation
,
Modeling
,
Membranes
,
Thermomechanics
Characterization of Lead-Free Solders in Flip Chip Joints
J. Electron. Packag. December 2003, 125(4): 531–538.
doi: https://doi.org/10.1115/1.1604155
Topics:
Crack propagation
,
Creep
,
Flip-chip
,
Flip-chip devices
,
Solders
,
Stress
,
Fatigue
,
Temperature
Time- and Temperature-Dependent Thermo-Mechanical Modeling of a Packaging Molding Compound and its Effect on Packaging Process Stresses
J. Electron. Packag. December 2003, 125(4): 539–548.
doi: https://doi.org/10.1115/1.1604156
Topics:
Creep
,
Molding
,
Poisson ratio
,
Stress
,
Temperature
,
Relaxation (Physics)
,
Packaging
Finite Element Modelling of Flip Chip Gold-Gold Thermocompression Bonding
J. Puigcorbe´, S. Marco, S. Leseduarte, M. Carmona, O. Vendier, C. Devron, S. L. Delage, D. Floriot, H. Blanck
J. Electron. Packag. December 2003, 125(4): 549–555.
doi: https://doi.org/10.1115/1.1604157
Topics:
Bonding
,
Creep
,
Finite element analysis
,
Flip-chip devices
,
Modeling
,
Optimization
,
Stress
,
Temperature
,
Transistors
,
Gallium arsenide
Three- and Four-Point Bend Testing for Electronic Packages
J. Electron. Packag. December 2003, 125(4): 556–561.
doi: https://doi.org/10.1115/1.1604158
Topics:
Printed circuit boards
,
Reliability
,
Simulation
,
Solder joints
,
Stress
,
Testing
,
Electronic packages
,
Failure
Reliability Prediction of Area Array Solder Joints
J. Electron. Packag. December 2003, 125(4): 562–568.
doi: https://doi.org/10.1115/1.1604802
Topics:
Ball-Grid-Array packaging
,
Creep
,
Fatigue
,
Modeling
,
Reliability
,
Solder joints
,
Solders
,
Temperature
,
Cycles
,
Geometric modeling
Numerical Simulation of Delamination in IC Packages Using a New Variable-Order Singular Boundary Element
J. Electron. Packag. December 2003, 125(4): 569–575.
doi: https://doi.org/10.1115/1.1604803
Micro to Macro Thermo-Mechanical Simulation of Wafer Level Packaging
J. Electron. Packag. December 2003, 125(4): 576–581.
doi: https://doi.org/10.1115/1.1604159
Solders Fatigue Prediction Using Interfacial Boundary Volume Criterion
J. Electron. Packag. December 2003, 125(4): 582–588.
doi: https://doi.org/10.1115/1.1604160
Topics:
Deformation
,
Fatigue
,
Fatigue life
,
Solder joints
,
Solders
,
Modeling
,
Damage
,
Cycles
,
Packaging
Impact of Die Attach Material and Substrate Design on RF GaAs Power Amplifier Devices Thermal Performance
J. Electron. Packag. December 2003, 125(4): 589–596.
doi: https://doi.org/10.1115/1.1604804
Topics:
Gallium arsenide
,
Metals
,
Temperature
,
Thermal conductivity
,
Wall thickness
,
Thermal resistance
Maskless Process for Fabrication of Ultra-Fine Pitch Solder Bumps for Flip Chip Interconnects
J. Electron. Packag. December 2003, 125(4): 597–601.
doi: https://doi.org/10.1115/1.1604806
Topics:
Flip-chip devices
,
Manufacturing
,
Solders
,
Flip-chip
Thermal Stress and Deflection Analysis of a Glass Window (Circular Plate) Elastically Restrained Along its Edge in a Photonic Device
J. Electron. Packag. December 2003, 125(4): 602–608.
doi: https://doi.org/10.1115/1.1604807
Topics:
Deflection
,
Glass
,
Stress
,
Boundary-value problems
,
Pressure
,
Temperature
,
Double refraction
,
Thermal stresses
Electrical Conductive Characteristics of Anisotropic Conductive Adhesive Particles
J. Electron. Packag. December 2003, 125(4): 609–616.
doi: https://doi.org/10.1115/1.1604808
Topics:
Particulate matter
,
Nickel
Mechanical and Electrical Properties of Au-Al and Cu-Al Intermetallics Layer at Wire Bonding Interface
J. Electron. Packag. December 2003, 125(4): 617–620.
doi: https://doi.org/10.1115/1.1604809
Topics:
Intermetallic compounds
,
Bonding
,
Copper
,
Shear (Mechanics)
,
Electrical properties
,
Electrical resistance
,
Wire bonding
,
Wire
Technical Briefs
3D Nonlinear Stress Analysis of Tin Whisker Initiation on Lead-Free Components
J. Electron. Packag. December 2003, 125(4): 621–624.
doi: https://doi.org/10.1115/1.1604805
Effect of Bonding Force on the Conducting Particle With Different Sizes
J. Electron. Packag. December 2003, 125(4): 624–629.
doi: https://doi.org/10.1115/1.1604810
Topics:
Bonding
,
Particulate matter
,
Deformation
,
Finite element analysis
,
Stress
,
Particle size
Email alerts
RSS Feeds
Anand Model Constants of Sn–Ag–Cu Solders: What Do They Actually Mean?
J. Electron. Packag (June 2025)
Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability
J. Electron. Packag (June 2025)