Volume 128 Issue 3 | J. Electron. Packag.

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Volume 128, Issue 3

September 2006

ISSN 1043-7398

EISSN 1528-9044

Research Papers

Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection

Liu Caroline Chen, Zonghe Lai, Zhaonian Cheng, Johan Liu

J. Electron. Packag. September 2006, 128(3): 177–183. doi: https://doi.org/10.1115/1.2227057

Abstract

View articletitled, Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection

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Topics: Adhesives , Contact resistance , Finite element methods , Flip-chip devices , Reliability , Simulation , Stress , Temperature , Warping , Flip-chip

A Model for Assessing the Shape of Solder Joints in the Presence of PCB and Package Warpage

Mahidhar Rayasam, Terrace B. Thompson, Ganesh Subbarayan, C. Gurumurthy, J. R. Wilcox

J. Electron. Packag. September 2006, 128(3): 184–191. doi: https://doi.org/10.1115/1.2227058

Abstract

View articletitled, A Model for Assessing the Shape of Solder Joints in the Presence of PCB and Package Warpage

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Topics: Shapes , Solder joints , Solders , Warping , Equilibrium (Physics)

An Evaluation of Gold and Copper Wire Bonds on Shear and Pull Testing

S. Murali, N. Srikanth, Charles J. Vath, III

J. Electron. Packag. September 2006, 128(3): 192–201. doi: https://doi.org/10.1115/1.2229214

Abstract

View articletitled, An Evaluation of Gold and Copper Wire Bonds on Shear and Pull Testing

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Topics: Bonding , Copper , Fracture (Materials) , Shear (Mechanics) , Wire , Fracture (Process) , Testing , Aluminum , Stress , Displacement

Experimental Study of Void Formation in Eutectic and Lead-Free Solder Bumps of Flip-Chip Assemblies

Daijiao Wang, Ronald L. Panton

J. Electron. Packag. September 2006, 128(3): 202–207. doi: https://doi.org/10.1115/1.2229215

Abstract

View articletitled, Experimental Study of Void Formation in Eutectic and Lead-Free Solder Bumps of Flip-Chip Assemblies

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Topics: Cooling , Heating , Lead-free solders , Solders , Flip-chip assemblies

Discussion on the Reliability Issues of Solder-Bump and Direct-Solder Bonded Power Device Packages Having Double-Sided Cooling Capability

John G. Bai, Jesus N. Calata, Guo-Quan Lu

J. Electron. Packag. September 2006, 128(3): 208–214. doi: https://doi.org/10.1115/1.2229218

Abstract

View articletitled, Discussion on the Reliability Issues of Solder-Bump and Direct-Solder Bonded Power Device Packages Having Double-Sided Cooling Capability

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Topics: Cooling , Finite element analysis , Reliability , Solders , Temperature , Stress , Thermomechanics , Thermal expansion

Electronics Packaging Cooling: Technologies From Gas Turbine Engine Cooling

M. Arik, R. S. Bunker

J. Electron. Packag. September 2006, 128(3): 215–225. doi: https://doi.org/10.1115/1.2229219

Abstract

View articletitled, Electronics Packaging Cooling: Technologies From Gas Turbine Engine Cooling

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Topics: Cooling , Flow (Dynamics) , Heat transfer , Gas turbines , Heat sinks , Turbines

Study of Flow and Heat Transfer Characteristics in Asymmetrically Heated Sintered Porous Heat Sinks With Periodical Baffles

Tzer-Ming Jeng, Sheng-Chung Tzeng

J. Electron. Packag. September 2006, 128(3): 226–235. doi: https://doi.org/10.1115/1.2229220

Abstract

View articletitled, Study of Flow and Heat Transfer Characteristics in Asymmetrically Heated Sintered Porous Heat Sinks With Periodical Baffles

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Topics: Flow (Dynamics) , Heat sinks , Heat transfer , Porous materials , Fluids , Reynolds number , Heat conduction

Fabrication and Characterization of Flexible Substrates for Use in the Development of Miniaturized Wireless Sensor Network Modules

Bivragh Majeed, Kieran Delaney, John Barton, Niall McCarthy, Sean C. O’Mathuna, John Alderman

J. Electron. Packag. September 2006, 128(3): 236–245. doi: https://doi.org/10.1115/1.2229221

Abstract

View articletitled, Fabrication and Characterization of Flexible Substrates for Use in the Development of Miniaturized Wireless Sensor Network Modules

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Topics: Circuits , Copper , Manufacturing , Packaging , Polymers , Semiconductor wafers , Stiffness , Stress , Wireless sensor networks , Lasers

The Effects of Multiple Zincation Process on Aluminum Bond Pad Surface for Electroless Nickel Immersion Gold Deposition

M. K. Md Arshad, I. Ahmad, A. Jalar, G. Omar, U. Hashim

J. Electron. Packag. September 2006, 128(3): 246–250. doi: https://doi.org/10.1115/1.2229223

Abstract

View articletitled, The Effects of Multiple Zincation Process on Aluminum Bond Pad Surface for Electroless Nickel Immersion Gold Deposition

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Topics: Adhesion , Aluminum , Atomic force microscopy , Nickel , Shear strength , Solders , Focused ion beams , Metallurgy , Scanning electron microscopy , X-rays

Heightened Thermal Convection as a Result of Splitting a Square Cavity Diagonally in Half

El Hassan Ridouane, Antonio Campo

J. Electron. Packag. September 2006, 128(3): 251–258. doi: https://doi.org/10.1115/1.2229224

Abstract

View articletitled, Heightened Thermal Convection as a Result of Splitting a Square Cavity Diagonally in Half

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Topics: Cavities , Temperature , Convection

Metal Foam and Finned Metal Foam Heat Sinks for Electronics Cooling in Buoyancy-Induced Convection

A. Bhattacharya, R. L. Mahajan

J. Electron. Packag. September 2006, 128(3): 259–266. doi: https://doi.org/10.1115/1.2229225

Abstract

View articletitled, Metal Foam and Finned Metal Foam Heat Sinks for Electronics Cooling in Buoyancy-Induced Convection

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Topics: Aluminum , Buoyancy , Computer cooling , Convection , Heat sinks , Metal foams , Porous materials

Numerical Thermal Simulation of Cryogenic Power Modules Under Liquid Nitrogen Cooling

Hua Ye, Harry Efstathiadis, Pradeep Haldar

J. Electron. Packag. September 2006, 128(3): 267–272. doi: https://doi.org/10.1115/1.2229226

Abstract

View articletitled, Numerical Thermal Simulation of Cryogenic Power Modules Under Liquid Nitrogen Cooling

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Topics: Cooling , Heat , MOSFET transistors , Nitrogen , Simulation , Temperature , Critical heat flux , Junctions , Energy dissipation , Boiling

Laminar Heat Transfer in Constructal Microchannel Networks With Loops

Xiang-Qi Wang, Christopher Yap, Arun S. Mujumdar

J. Electron. Packag. September 2006, 128(3): 273–280. doi: https://doi.org/10.1115/1.2229228

Abstract

View articletitled, Laminar Heat Transfer in Constructal Microchannel Networks With Loops

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Topics: Damage , Disks , Flow (Dynamics) , Heat sinks , Heat transfer , Microchannels , Pressure drop , Temperature , Temperature distribution , Fluids

Transient Thermal Analysis for Board-Level Chip-Scale Packages Subjected to Coupled Power and Thermal Cycling Test Conditions

Tong Hong Wang, Chang-Chi Lee, Yi-Shao Lai, Yu-Cheng Lin

J. Electron. Packag. September 2006, 128(3): 281–284. doi: https://doi.org/10.1115/1.2229229

Abstract

View articletitled, Transient Thermal Analysis for Board-Level Chip-Scale Packages Subjected to Coupled Power and Thermal Cycling Test Conditions

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Topics: Boundary-value problems , Temperature , Thermal analysis , Transients (Dynamics) , Vehicles , Finite element analysis , Junctions

Heat Sinks With Enhanced Heat Transfer Capability for Electronic Cooling Applications

Evan Small, Sadegh M. Sadeghipour, Mehdi Asheghi

J. Electron. Packag. September 2006, 128(3): 285–290. doi: https://doi.org/10.1115/1.2229230

Abstract

View articletitled, Heat Sinks With Enhanced Heat Transfer Capability for Electronic Cooling Applications

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Topics: Fins , Heat sinks , Heat transfer , Pressure drop

Technical Briefs

A Three-Dimensional Solder Shape Model Incorporating Top Pad Inclination and Misalignment

Mahidhar Rayasam, Ganesh Subbarayan

J. Electron. Packag. September 2006, 128(3): 291–293. doi: https://doi.org/10.1115/1.2229232

Abstract

View articletitled, A Three-Dimensional Solder Shape Model Incorporating Top Pad Inclination and Misalignment

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Topics: Shapes , Solder joints , Solders

Influence of the Fluid on the Experimental Performances of Triangular Silicon Microheat Pipes

Guillaume Pandraud, Martine Le Berre, Panagiota Morfouli, Monique Lallemand

J. Electron. Packag. September 2006, 128(3): 294–296. doi: https://doi.org/10.1115/1.2229233

Abstract

View articletitled, Influence of the Fluid on the Experimental Performances of Triangular Silicon Microheat Pipes

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Topics: Fluids , Methanol , Microchannels , Pipes , Silicon , Thermal conductivity , Semiconductor wafers , Water , Bonding , Ethanol

Reliability of Lead-Free Solder Joints

John H. Lau

J. Electron. Packag. September 2006, 128(3): 297–301. doi: https://doi.org/10.1115/1.2229234

Abstract

View articletitled, Reliability of Lead-Free Solder Joints

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Topics: Lead-free solders , Reliability , Solder joints , Solders

Research Papers

Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection

A Model for Assessing the Shape of Solder Joints in the Presence of PCB and Package Warpage

An Evaluation of Gold and Copper Wire Bonds on Shear and Pull Testing

Experimental Study of Void Formation in Eutectic and Lead-Free Solder Bumps of Flip-Chip Assemblies

Discussion on the Reliability Issues of Solder-Bump and Direct-Solder Bonded Power Device Packages Having Double-Sided Cooling Capability

Electronics Packaging Cooling: Technologies From Gas Turbine Engine Cooling

Study of Flow and Heat Transfer Characteristics in Asymmetrically Heated Sintered Porous Heat Sinks With Periodical Baffles

Fabrication and Characterization of Flexible Substrates for Use in the Development of Miniaturized Wireless Sensor Network Modules

The Effects of Multiple Zincation Process on Aluminum Bond Pad Surface for Electroless Nickel Immersion Gold Deposition

Heightened Thermal Convection as a Result of Splitting a Square Cavity Diagonally in Half

Metal Foam and Finned Metal Foam Heat Sinks for Electronics Cooling in Buoyancy-Induced Convection

Numerical Thermal Simulation of Cryogenic Power Modules Under Liquid Nitrogen Cooling

Laminar Heat Transfer in Constructal Microchannel Networks With Loops

Transient Thermal Analysis for Board-Level Chip-Scale Packages Subjected to Coupled Power and Thermal Cycling Test Conditions

Heat Sinks With Enhanced Heat Transfer Capability for Electronic Cooling Applications

Technical Briefs

A Three-Dimensional Solder Shape Model Incorporating Top Pad Inclination and Misalignment

Influence of the Fluid on the Experimental Performances of Triangular Silicon Microheat Pipes

Reliability of Lead-Free Solder Joints

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