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Issues
September 2009
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Research Papers
Tensile Behaviors of Lead-Containing and Lead-Free Solders at High Strain Rates
J. Electron. Packag. September 2009, 131(3): 031001.
doi: https://doi.org/10.1115/1.3144151
Topics:
Fractography
,
Lead-free solders
,
Solders
,
Tensile strength
,
Reliability
,
Electronic products
,
Solder joints
,
Stress-strain curves
Effect of Leadframe Oxidation on the Reliability of a Quad Flat No-Lead Package
J. Electron. Packag. September 2009, 131(3): 031002.
doi: https://doi.org/10.1115/1.3144155
Topics:
Delamination
,
Fracture (Materials)
,
Oxidation
,
Reliability
,
Shear (Mechanics)
,
Statistical analysis
,
Copper
,
Stress
In Situ Chip Stress Extractions for LFBGA Packages Through Piezoresistive Sensors
J. Electron. Packag. September 2009, 131(3): 031003.
doi: https://doi.org/10.1115/1.3144149
Topics:
Sensors
,
Simulation
,
Stress
,
Temperature
,
Packaging
,
Finite element analysis
,
Temperature sensors
Thermal Analysis of Miniature Low Profile Heat Sinks With and Without Fins
J. Electron. Packag. September 2009, 131(3): 031004.
doi: https://doi.org/10.1115/1.3144150
Topics:
Design
,
Flow (Dynamics)
,
Heat sinks
,
Cooling
,
Thermal resistance
,
Fans
,
Fins
Effect of Warpage of Flip Chip Packages Due to the Underfill Encapsulating Process on Interconnect Reliability
J. Electron. Packag. September 2009, 131(3): 031005.
doi: https://doi.org/10.1115/1.3144153
Topics:
Flip-chip packages
,
Hardening (Curing)
,
Manufacturing
,
Reliability
,
Temperature
,
Warping
,
Flow (Dynamics)
,
Flip-chip devices
Laser-Based Target Preparation in 3D Integrated Electronic Packages
J. Electron. Packag. September 2009, 131(3): 031006.
doi: https://doi.org/10.1115/1.3144157
Squeezing Flow of a Power Law Fluid Between Grooved Plates
J. Electron. Packag. September 2009, 131(3): 031007.
doi: https://doi.org/10.1115/1.3144158
Topics:
Flow (Dynamics)
,
Fluids
,
Microchannels
,
Plates (structures)
,
Flat plates
Experimental Investigation and Theoretical Model for Subcooled Flow Boiling Pressure Drop in Microchannel Heat Sinks
J. Electron. Packag. September 2009, 131(3): 031008.
doi: https://doi.org/10.1115/1.3144146
Topics:
Boiling
,
Flow (Dynamics)
,
Heat sinks
,
Microchannels
,
Pressure drop
,
Subcooling
,
Temperature
,
Two-phase flow
Multiple Fan-Heat Sink Cooling System With Enhanced Evaporator Base: Design, Modeling, and Experiment
J. Electron. Packag. September 2009, 131(3): 031009.
doi: https://doi.org/10.1115/1.3153407
Topics:
Copper
,
Heat
,
Heat pipes
,
Heat sinks
,
Thermal conductivity
,
Thermal resistance
,
Cooling
,
Modeling
,
Flow (Dynamics)
,
Finite element analysis
Direct Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process—Part I: Theory and Numerical Implementation
J. Electron. Packag. September 2009, 131(3): 031010.
doi: https://doi.org/10.1115/1.3144147
Topics:
Diffusion (Physics)
,
Modeling
,
Temperature
,
Vapor pressure
,
Electronic packages
Direct Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process—Part II: Application to 3D Ultrathin Stacked-Die Chip Scale Packages
J. Electron. Packag. September 2009, 131(3): 031011.
doi: https://doi.org/10.1115/1.3144154
Topics:
Diffusion (Physics)
,
Vapor pressure
,
Failure
,
Modeling
Numerical Performance Analysis of Constructal I and Y Finned Heat Exchanging Modules
J. Electron. Packag. September 2009, 131(3): 031012.
doi: https://doi.org/10.1115/1.3144152
Topics:
Fins
,
Heat
,
Heat exchangers
,
Pressure
,
Shapes
,
Temperature
,
Thermal conductivity
,
Ducts
,
Reynolds number
,
Optimization
An Overmolded Pressure Sensor Package Using an Ultrathick Photoresist Sacrificial Layer
J. Electron. Packag. September 2009, 131(3): 031013.
doi: https://doi.org/10.1115/1.3144156
Topics:
Photoresists
,
Pressure sensors
,
Packaging
,
Membranes
,
Finite element model
Void Formation Mechanism of Flip Chip in Package Using No-Flow Underfill
J. Electron. Packag. September 2009, 131(3): 031014.
doi: https://doi.org/10.1115/1.3153369
Topics:
Flip-chip devices
,
Flow (Dynamics)
,
Solders
,
Hardening (Curing)
,
Chemical reactions
,
Wetting
,
Temperature
,
Flip-chip
,
Manufacturing
Technical Briefs
An Engineering Estimate for Plug-Flow Convection in Porous Media Discarding Fluid Conduction
J. Electron. Packag. September 2009, 131(3): 034501.
doi: https://doi.org/10.1115/1.3143947
Topics:
Convection
,
Flow (Dynamics)
,
Fluids
,
Heat conduction
,
Porous materials
,
Temperature
,
Graphite
,
Metal foams
,
Thermal conductivity
Tungsten Carbide as a Diffusion Barrier on Silicon Nitride Active- Metal-Brazed Substrates for Silicon Carbide Power Devices
J. Electron. Packag. September 2009, 131(3): 034502.
doi: https://doi.org/10.1115/1.3153582
Topics:
Copper
,
Diffusion (Physics)
,
Silicon
,
Silicon nitride ceramics
,
Tungsten
,
Annealing
,
High temperature
,
Metals
,
Temperature
,
Electron spectroscopy
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Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability
J. Electron. Packag
Anand Model Constants of Sn-Ag-Cu Solders: What Do They Actually Mean?
J. Electron. Packag