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Volume 139, Issue 1

March 2017

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ISSN 1043-7398

EISSN 1528-9044

In this Issue

Review Article
Research Papers
Errata

Review Article

Evolution of Hardware Morphology of Large-Scale Computers and the Trend of Space Allocation for Thermal Management

Wataru Nakayama

J. Electron. Packag. March 2017, 139(1): 010801. doi: https://doi.org/10.1115/1.4035019

Abstract

View articletitled, Evolution of Hardware Morphology of Large-Scale Computers and the Trend of Space Allocation for Thermal Management

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Topics: Circuits , Computers , Printed circuit boards , Hardware

Moisture Ingress, Behavior, and Prediction Inside Semiconductor Packaging: A Review

Bongtae Han, Dae-Suk Kim

J. Electron. Packag. March 2017, 139(1): 010802. doi: https://doi.org/10.1115/1.4035598

Abstract

View articletitled, Moisture Ingress, Behavior, and Prediction Inside Semiconductor Packaging: A Review

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Topics: Diffusion (Physics) , Polymers , Temperature , Cavities , Semiconductors (Materials) , Packaging , Water , Vapor pressure

Research Papers

Modeling and Analysis for Thermal Management in Gallium Nitride HEMTs Using Microfluidic Cooling

Gunjan Agarwal, Thomas Kazior, Thomas Kenny, Dana Weinstein

J. Electron. Packag. March 2017, 139(1): 011001. doi: https://doi.org/10.1115/1.4035064

Abstract

View articletitled, Modeling and Analysis for Thermal Management in Gallium Nitride HEMTs Using Microfluidic Cooling

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Topics: Cooling , Flow (Dynamics) , Fluids , Gallium nitride , Microchannels , Microfluidics , Silicon , Temperature , Heat , Geometry

Investigation on the Optimized Binary and Ternary Gallium Alloy as Thermal Interface Materials

Yunxia Gao, Xianping Wang, Jing Liu, Qianfeng Fang

J. Electron. Packag. March 2017, 139(1): 011002. doi: https://doi.org/10.1115/1.4035025

Abstract

View articletitled, Investigation on the Optimized Binary and Ternary Gallium Alloy as Thermal Interface Materials

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Topics: Alloys , Copper , Gallium , Gallium alloys , Temperature , Thermal conductivity , Oxidation , Thermal resistance , Aluminum alloys , Metals

Flexible Thermal Ground Planes Fabricated With Printed Circuit Board Technology

Li-Anne Liew, Ching-Yi Lin, Ryan Lewis, Susan Song, Qian Li, Ronggui Yang, Y. C. Lee

J. Electron. Packag. March 2017, 139(1): 011003. doi: https://doi.org/10.1115/1.4035241

Abstract

View articletitled, Flexible Thermal Ground Planes Fabricated With Printed Circuit Board Technology

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Topics: Copper , Heat , Manufacturing , Printed circuit boards , Vapors , Water , Nylon fabrics , Condensers (steam plant) , Thermal resistance

Maximum Resolution of a Probe-Based, Steady-State Thermal Interface Material Characterization Instrument

Ronald J. Warzoha, Andrew N. Smith, Maurice Harris

J. Electron. Packag. March 2017, 139(1): 011004. doi: https://doi.org/10.1115/1.4035178

Abstract

View articletitled, Maximum Resolution of a Probe-Based, Steady-State Thermal Interface Material Characterization Instrument

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Topics: Heat , Instrumentation , Probes , Resolution (Optics) , Steady state , Uncertainty , Heat flux , Measurement uncertainty , Fillers (Materials) , Temperature measurement

Transient Data Processing of Flow Boiling Local Heat Transfer in a Multi-Microchannel Evaporator Under a Heat Flux Disturbance

Houxue Huang, Nicolas Lamaison, John R. Thome

J. Electron. Packag. March 2017, 139(1): 011005. doi: https://doi.org/10.1115/1.4035386

Abstract

View articletitled, Transient Data Processing of Flow Boiling Local Heat Transfer in a Multi-Microchannel Evaporator Under a Heat Flux Disturbance

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Topics: Boiling , Flow (Dynamics) , Fluids , Heat conduction , Heat flux , Heat transfer , Heat transfer coefficients , Microchannels , Pressure drop , Temperature

Hotspot Thermal Management With Flow Boiling of Refrigerant in Ultrasmall Microgaps

Mohamed H. Nasr, Craig E. Green, Peter A. Kottke, Xuchen Zhang, Thomas E. Sarvey, Yogendra K. Joshi, Muhannad S. Bakir, Andrei G. Fedorov

J. Electron. Packag. March 2017, 139(1): 011006. doi: https://doi.org/10.1115/1.4035387

Abstract

View articletitled, Hotspot Thermal Management With Flow Boiling of Refrigerant in Ultrasmall Microgaps

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Topics: Boiling , Flow (Dynamics) , Flux (Metallurgy) , Heat , Thermal resistance , Heat flux , Wall temperature , Coolants , Pressure drop , Thermal management

Measurement of Air Flow Rate Through Perforated Floor Tiles in a Raised Floor Data Center

Vaibhav K. Arghode, Taegyu Kang, Yogendra Joshi, Wally Phelps, Murray Michaels

J. Electron. Packag. March 2017, 139(1): 011007. doi: https://doi.org/10.1115/1.4035596

Abstract

View articletitled, Measurement of Air Flow Rate Through Perforated Floor Tiles in a Raised Floor Data Center

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Topics: Air flow , Flow (Dynamics) , Tiles , Porosity , Data centers

Characterization and Benchmarking of the Low Intertier Thermal Resistance of Three-Dimensional Hybrid Cu/Dielectric Wafer-to-Wafer Bonding

Herman Oprins, Vladimir Cherman, Tomas Webers, Abdellah Salahouelhadj, Soon-Wook Kim, Lan Peng, Geert Van der Plas, Eric Beyne

J. Electron. Packag. March 2017, 139(1): 011008. doi: https://doi.org/10.1115/1.4035597

Abstract

View articletitled, Characterization and Benchmarking of the Low Intertier Thermal Resistance of Three-Dimensional Hybrid Cu/Dielectric Wafer-to-Wafer Bonding

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Topics: Bonding , Semiconductor wafers , Thermal resistance , Transients (Dynamics) , Temperature , Steady state

Electroplated Connections Between Carbon Fiber and Nickel

Christopher Bilger, Hugh A. Bruck, Abhijit Dasgupta

J. Electron. Packag. March 2017, 139(1): 011009. doi: https://doi.org/10.1115/1.4035703

Abstract

View articletitled, Electroplated Connections Between Carbon Fiber and Nickel

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Topics: Carbon fibers , Nickel , Metals , Carbon , Solders , Batteries , Electroplating

Errata

Erratum: “Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks” [ASME J. Electron. Packag., 2016, 138(4), p. 041009; DOI: 10.1115/1.4034927]

Thomas Brunschwiler, Jonas Zürcher, Luca Del Carro, Gerd Schlottig, Brian Burg, Severin Zimmermann, Uwe Zschenderlein, Bernhard Wunderle, Florian Schindler-Saefkow, Rahel Stässle

J. Electron. Packag. March 2017, 139(1): 017001. doi: https://doi.org/10.1115/1.4035707

Extract

View articletitled, Erratum: “Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks” [ASME J. Electron. Packag., 2016, 138(4), p. 041009; DOI: 10.1115/1.4034927]

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Topics: Electrons , Packaging

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Review Article

Evolution of Hardware Morphology of Large-Scale Computers and the Trend of Space Allocation for Thermal Management

Moisture Ingress, Behavior, and Prediction Inside Semiconductor Packaging: A Review

Research Papers

Modeling and Analysis for Thermal Management in Gallium Nitride HEMTs Using Microfluidic Cooling

Investigation on the Optimized Binary and Ternary Gallium Alloy as Thermal Interface Materials

Flexible Thermal Ground Planes Fabricated With Printed Circuit Board Technology

Maximum Resolution of a Probe-Based, Steady-State Thermal Interface Material Characterization Instrument

Transient Data Processing of Flow Boiling Local Heat Transfer in a Multi-Microchannel Evaporator Under a Heat Flux Disturbance

Hotspot Thermal Management With Flow Boiling of Refrigerant in Ultrasmall Microgaps

Measurement of Air Flow Rate Through Perforated Floor Tiles in a Raised Floor Data Center

Characterization and Benchmarking of the Low Intertier Thermal Resistance of Three-Dimensional Hybrid Cu/Dielectric Wafer-to-Wafer Bonding

Electroplated Connections Between Carbon Fiber and Nickel

Errata

Erratum: “Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks” [ASME J. Electron. Packag., 2016, 138(4), p. 041009; DOI: 10.1115/1.4034927]

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