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Journal Articles

Sub-millimeter Reflector for Edge-Emitting Laser Package

Accepted Manuscript
Kuo-Tung Huang, Ying-Che Suang, Hsin-Lin Wu, Cheng-Han Wang, Qi-Hong Yang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag.
Paper No: EP-24-1088
https://doi.org/10.1115/1.4068142
Published Online: March 12, 2025
View Article titled, Sub-millimeter Reflector for Edge-Emitting Laser Package
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Topics: Lasers, Packaging, Glass, Semiconductors (Materials)
Journal Articles

Flow Characterization of Capillary Underfill in Multi-Chip Heterogenous Integration Using Computational Fluid Dynamics

Accepted Manuscript
Muhammad Aqil Azman, Mohd Z. Abdullah, Wei Keat Loh, Chun Keang Ooi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag.
Paper No: EP-24-1099
https://doi.org/10.1115/1.4068143
Published Online: March 12, 2025
View Article titled, Flow Characterization of Capillary Underfill in Multi-Chip Heterogenous Integration Using Computational Fluid Dynamics
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Topics: Computational fluid dynamics, Flow (Dynamics), Reliability, Ball-Grid-Array packaging, Electronic packages, Design, Electronic packaging, Engineering simulation, Errors, Flip-chip
Journal Articles

Thomson Effect, Leg Design, Heat Interaction, and Material Impacts on Segmented Thermoelectric Cooler: Insights From Three-Dimensional Simulation

Aakash Mani, Jahar Sarkar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2025, 147(2): 021010.
Paper No: EP-24-1093
https://doi.org/10.1115/1.4067775
Published Online: February 28, 2025
View Article titled, Thomson Effect, Leg Design, Heat Interaction, and Material Impacts on Segmented Thermoelectric Cooler: Insights From Three-Dimensional Simulation
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Topics: Cooling, Heat, Temperature, Thermoelectric coolers, Thermoelectricity, Design, Simulation
Image
Thermoelectric coolers with considered leg geometries: ( a ) square leg, ( ...

Thermoelectric coolers with considered leg geometries: ( a ) square leg, ( ...

in Thomson Effect, Leg Design, Heat Interaction, and Material Impacts on Segmented Thermoelectric Cooler: Insights From Three-Dimensional Simulation > Journal of Electronic Packaging
Published Online: February 28, 2025
Fig. 1 Thermoelectric coolers with considered leg geometries: ( a ) square leg, ( b ) cylindrical leg, ( c ) tapered cylindrical leg, and ( d ) inverted tapered cylindrical leg More about this image found in Thermoelectric coolers with considered leg geometries: ( a ) square leg, ( ...
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Properties of considered thermoelectric materials along with temperature: (...

Properties of considered thermoelectric materials along with temperature: (...

in Thomson Effect, Leg Design, Heat Interaction, and Material Impacts on Segmented Thermoelectric Cooler: Insights From Three-Dimensional Simulation > Journal of Electronic Packaging
Published Online: February 28, 2025
Fig. 2 Properties of considered thermoelectric materials along with temperature: ( a ) Seebeck coefficient, ( b ) electrical resistivity, and ( c ) thermal conductivity More about this image found in Properties of considered thermoelectric materials along with temperature: (...
Image
Finite element model: ( a ) square leg and ( b ) cylindrical leg

Finite element model: ( a ) square leg and ( b ) cylindrical leg

in Thomson Effect, Leg Design, Heat Interaction, and Material Impacts on Segmented Thermoelectric Cooler: Insights From Three-Dimensional Simulation > Journal of Electronic Packaging
Published Online: February 28, 2025
Fig. 3 Finite element model: ( a ) square leg and ( b ) cylindrical leg More about this image found in Finite element model: ( a ) square leg and ( b ) cylindrical leg
Image
Grid independence test

Grid independence test

in Thomson Effect, Leg Design, Heat Interaction, and Material Impacts on Segmented Thermoelectric Cooler: Insights From Three-Dimensional Simulation > Journal of Electronic Packaging
Published Online: February 28, 2025
Fig. 4 Grid independence test More about this image found in Grid independence test
Image
Comparison of the current model with previous results [ 17 ]: ( a ) tempera...

Comparison of the current model with previous results [ 17 ]: ( a ) tempera...

in Thomson Effect, Leg Design, Heat Interaction, and Material Impacts on Segmented Thermoelectric Cooler: Insights From Three-Dimensional Simulation > Journal of Electronic Packaging
Published Online: February 28, 2025
Fig. 5 Comparison of the current model with previous results [ 17 ]: ( a ) temperature of p-type leg along length and ( b ) COP More about this image found in Comparison of the current model with previous results [ 17 ]: ( a ) tempera...
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Coefficient of performance and cooling effect of circular and square cross-...

Coefficient of performance and cooling effect of circular and square cross-...

in Thomson Effect, Leg Design, Heat Interaction, and Material Impacts on Segmented Thermoelectric Cooler: Insights From Three-Dimensional Simulation > Journal of Electronic Packaging
Published Online: February 28, 2025
Fig. 6 Coefficient of performance and cooling effect of circular and square cross-sectional legs More about this image found in Coefficient of performance and cooling effect of circular and square cross-...
Image
Current density distribution at 0.9 A: ( a ) square leg and ( b ) cylindric...

Current density distribution at 0.9 A: ( a ) square leg and ( b ) cylindric...

in Thomson Effect, Leg Design, Heat Interaction, and Material Impacts on Segmented Thermoelectric Cooler: Insights From Three-Dimensional Simulation > Journal of Electronic Packaging
Published Online: February 28, 2025
Fig. 7 Current density distribution at 0.9 A: ( a ) square leg and ( b ) cylindrical leg More about this image found in Current density distribution at 0.9 A: ( a ) square leg and ( b ) cylindric...
Image
Coefficient of performance and cooling effect of circular and square cross-...

Coefficient of performance and cooling effect of circular and square cross-...

in Thomson Effect, Leg Design, Heat Interaction, and Material Impacts on Segmented Thermoelectric Cooler: Insights From Three-Dimensional Simulation > Journal of Electronic Packaging
Published Online: February 28, 2025
Fig. 8 Coefficient of performance and cooling effect of circular and square cross-sectional legs with headers More about this image found in Coefficient of performance and cooling effect of circular and square cross-...
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Effect of different materials for non-segmented circular leg on ( a ) COP a...

Effect of different materials for non-segmented circular leg on ( a ) COP a...

in Thomson Effect, Leg Design, Heat Interaction, and Material Impacts on Segmented Thermoelectric Cooler: Insights From Three-Dimensional Simulation > Journal of Electronic Packaging
Published Online: February 28, 2025
Fig. 9 Effect of different materials for non-segmented circular leg on ( a ) COP and ( b ) cooling effect More about this image found in Effect of different materials for non-segmented circular leg on ( a ) COP a...
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( a ) COP and ( b ) cooling effect of TEC with segmented leg of different m...

( a ) COP and ( b ) cooling effect of TEC with segmented leg of different m...

in Thomson Effect, Leg Design, Heat Interaction, and Material Impacts on Segmented Thermoelectric Cooler: Insights From Three-Dimensional Simulation > Journal of Electronic Packaging
Published Online: February 28, 2025
Fig. 10 ( a ) COP and ( b ) cooling effect of TEC with segmented leg of different materials More about this image found in ( a ) COP and ( b ) cooling effect of TEC with segmented leg of different m...
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Distribution of ( a ) temperature and ( b ) voltage in segmented cylindrica...

Distribution of ( a ) temperature and ( b ) voltage in segmented cylindrica...

in Thomson Effect, Leg Design, Heat Interaction, and Material Impacts on Segmented Thermoelectric Cooler: Insights From Three-Dimensional Simulation > Journal of Electronic Packaging
Published Online: February 28, 2025
Fig. 11 Distribution of ( a ) temperature and ( b ) voltage in segmented cylindrical leg at the current input of 0.9 A More about this image found in Distribution of ( a ) temperature and ( b ) voltage in segmented cylindrica...
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Coefficient of performance and cooling effect of segmented and non-segmente...

Coefficient of performance and cooling effect of segmented and non-segmente...

in Thomson Effect, Leg Design, Heat Interaction, and Material Impacts on Segmented Thermoelectric Cooler: Insights From Three-Dimensional Simulation > Journal of Electronic Packaging
Published Online: February 28, 2025
Fig. 12 Coefficient of performance and cooling effect of segmented and non-segmented leg More about this image found in Coefficient of performance and cooling effect of segmented and non-segmente...
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( a ) Cooling effect and ( b ) COP for the different temperature lift

( a ) Cooling effect and ( b ) COP for the different temperature lift

in Thomson Effect, Leg Design, Heat Interaction, and Material Impacts on Segmented Thermoelectric Cooler: Insights From Three-Dimensional Simulation > Journal of Electronic Packaging
Published Online: February 28, 2025
Fig. 13 ( a ) Cooling effect and ( b ) COP for the different temperature lift More about this image found in ( a ) Cooling effect and ( b ) COP for the different temperature lift
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Coefficient of performance and cooling effect of segmented TEC at different...

Coefficient of performance and cooling effect of segmented TEC at different...

in Thomson Effect, Leg Design, Heat Interaction, and Material Impacts on Segmented Thermoelectric Cooler: Insights From Three-Dimensional Simulation > Journal of Electronic Packaging
Published Online: February 28, 2025
Fig. 14 Coefficient of performance and cooling effect of segmented TEC at different leg ratio More about this image found in Coefficient of performance and cooling effect of segmented TEC at different...
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Coefficient of performance and cooling effect on the variable cross-section...

Coefficient of performance and cooling effect on the variable cross-section...

in Thomson Effect, Leg Design, Heat Interaction, and Material Impacts on Segmented Thermoelectric Cooler: Insights From Three-Dimensional Simulation > Journal of Electronic Packaging
Published Online: February 28, 2025
Fig. 15 Coefficient of performance and cooling effect on the variable cross-sectional area More about this image found in Coefficient of performance and cooling effect on the variable cross-section...
Image
Effect of convection and radiation on COP and cooling effect of TEC

Effect of convection and radiation on COP and cooling effect of TEC

in Thomson Effect, Leg Design, Heat Interaction, and Material Impacts on Segmented Thermoelectric Cooler: Insights From Three-Dimensional Simulation > Journal of Electronic Packaging
Published Online: February 28, 2025
Fig. 16 Effect of convection and radiation on COP and cooling effect of TEC More about this image found in Effect of convection and radiation on COP and cooling effect of TEC
Journal Articles

Applications, Design Methods, and Challenges for Additive Manufacturing of Thermal Solutions for Heterogeneous Integration of Electronics

Ercan M. Dede, Feng Zhou, Yuqing Zhou, Danny J. Lohan, Mehdi Asheghi, Kenneth E. Goodson, Kris Erickson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2025, 147(2): 021009.
Paper No: EP-24-1066
https://doi.org/10.1115/1.4067649
Published Online: February 20, 2025
View Article titled, Applications, Design Methods, and Challenges for Additive Manufacturing of Thermal Solutions for Heterogeneous Integration of Electronics
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Topics: Additive manufacturing, Ceramics, Design, Electronics, Heat sinks, Manifolds, Manufacturing, Metals, Polymers, Cooling