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Journal Articles

Modeling the Deformation Behavior of a Sn-Pb Solder Alloy Using the Simplified Viscoplasticity Theory Based on Overstress (VBO)

L. Maciucescu, T.-L. Sham, E. Krempl

Publisher: ASME

J. Electron. Packag. June 1999, 121(2): 92–98.

https://doi.org/10.1115/1.2792673

Published Online: June 1, 1999

View Article titled, Modeling the Deformation Behavior of a Sn-Pb Solder Alloy Using the Simplified Viscoplasticity Theory Based on Overstress (VBO)

Topics: Alloys, Deformation, Modeling, Solders, Tin, Viscoplasticity, Accounting, Creep, Solder joints, Stress analysis (Engineering)

Journal Articles

An Ultra-High Power Two-Phase Jet-Impingement Avionic Clamshell Module

Murray E. Johns, Issam Mudawar

Publisher: ASME

J. Electron. Packag. December 1996, 118(4): 264–270.

https://doi.org/10.1115/1.2792162

Published Online: December 1, 1996

View Article titled, An Ultra-High Power Two-Phase Jet-Impingement Avionic Clamshell Module

Topics: Accounting, Boiling, Cooling, Critical heat flux, Databases, Errors, Flow (Dynamics), Fluids, Heat, Heat transfer

Journal Articles

Stress Analysis of Printed Circuit Boards With Highly Populated Solder Joints and Components: A Micromechanics Approach

K. X. Hu, Y. Huang, C. P. Yeh, K. W. Wyatt

Publisher: ASME

J. Electron. Packag. June 1996, 118(2): 87–93.

https://doi.org/10.1115/1.2792137

Published Online: June 1, 1996

View Article titled, Stress Analysis of Printed Circuit Boards With Highly Populated Solder Joints and Components: A Micromechanics Approach

Topics: Micromechanics (Engineering), Printed circuit boards, Solder joints, Stress analysis (Engineering), Lumber, Accounting, Composite materials, Energy budget (Physics), Finite element analysis, Stress concentration

Journal Articles

Temperature Dependent Viscoplastic Simulation of Controlled Collapse Solder Joint Under Thermal Cycling

V. Sarihan

Publisher: ASME

J. Electron. Packag. March 1993, 115(1): 16–21.

https://doi.org/10.1115/1.2909295

Published Online: March 1, 1993

View Article titled, Temperature Dependent Viscoplastic Simulation of Controlled Collapse Solder Joint Under Thermal Cycling

Topics: Collapse, Simulation, Solder joints, Temperature, Solders, Alloys, Creep, Design, Electronic packages, Flip-chip

Journal Articles

Solder Creep-Fatigue Interactions With Flexible Leaded Parts

R. G. Ross, Jr., L. C. Wen, G. R. Mon, E. Jetter

Publisher: ASME

J. Electron. Packag. June 1992, 114(2): 185–192.

https://doi.org/10.1115/1.2906416

Published Online: June 1, 1992

View Article titled, Solder Creep-Fatigue Interactions With Flexible Leaded Parts

Topics: Creep, Fatigue, Solders, Computer software, Cycles, Stress, Temperature, Accounting, Algorithms, Deflection

Journal Articles

Natural Convection From a Column of Flush Heat Sources in a Vertical Channel in Water

Y. Joshi, D. L. Knight

Publisher: ASME

J. Electron. Packag. December 1990, 112(4): 367–374.

https://doi.org/10.1115/1.2904391

Published Online: December 1, 1990

View Article titled, Natural Convection From a Column of Flush Heat Sources in a Vertical Channel in Water

Topics: Heat, Natural convection, Water, Heat transfer, Temperature measurement, Accounting, Computation, Flow visualization, Heating, Temperature

Journal Articles

An Analysis of Shrinkage Porosity in Aluminum Ball Bonding Process

L. J. Huang, K. Ramakrishna, P. S. Ayyaswamy, I. M. Cohen

Publisher: ASME

J. Electron. Packag. September 1989, 111(3): 199–206.

https://doi.org/10.1115/1.3226534

Published Online: September 1, 1989

View Article titled, An Analysis of Shrinkage Porosity in Aluminum Ball Bonding Process

Topics: Aluminum, Bonding, Porosity, Shrinkage (Materials), Alloys, Metals, Density, Solidification, Accounting, Geometry

Journal Articles

An Experimental Study of Natural Convection From an Array of Heated Protrusions on a Vertical Surface in Water

Y. Joshi, T. Willson, S. J. Hazard, III

Publisher: ASME

J. Electron. Packag. June 1989, 111(2): 121–128.

https://doi.org/10.1115/1.3226516

Published Online: June 1, 1989

View Article titled, An Experimental Study of Natural Convection From an Array of Heated Protrusions on a Vertical Surface in Water

Topics: Natural convection, Water, Fluids, Transients (Dynamics), Accounting, Energy dissipation, Flow (Dynamics), Heat transfer, Probes, Steady state

Journal citation

NARROW

Modeling the Deformation Behavior of a Sn-Pb Solder Alloy Using the Simplified Viscoplasticity Theory Based on Overstress (VBO)

An Ultra-High Power Two-Phase Jet-Impingement Avionic Clamshell Module

Stress Analysis of Printed Circuit Boards With Highly Populated Solder Joints and Components: A Micromechanics Approach

Temperature Dependent Viscoplastic Simulation of Controlled Collapse Solder Joint Under Thermal Cycling

Solder Creep-Fatigue Interactions With Flexible Leaded Parts

Natural Convection From a Column of Flush Heat Sources in a Vertical Channel in Water

An Analysis of Shrinkage Porosity in Aluminum Ball Bonding Process

An Experimental Study of Natural Convection From an Array of Heated Protrusions on a Vertical Surface in Water

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