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Atomic force microscopy
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041101.
Published Online: November 13, 2008
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 246–250.
Published Online: November 29, 2005
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 362–366.
Published Online: December 12, 2002
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 345–351.
Published Online: December 12, 2002
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1999, 121(4): 291–296.
Published Online: December 1, 1999
Journal Articles
Jang-hi Im, Mem. ASME, Edward O. Shaffer, II, Theodore Stokich,, Jr., Andrew Strandjord, Jack Hetzner, James Curphy, Cheryl Karas, Greg Meyers, David Hawn, Ashok Chakrabarti, Steve Froelicher
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2000, 122(1): 28–33.
Published Online: October 20, 1999