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Journal Articles

Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies

Ralf Döring, R. Dudek, S. Rzepka, L. Scheiter, E. Noack, B. Seiler

J. Electron. Packag. March 2023, 145(1): 011107.

Paper No: EP-22-1020

DOI: https://doi.org/10.1115/1.4056445

Published Online: December 23, 2022

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Topics: Design, Reliability, Simulation, Thermomechanics, Manufacturing, Solders, Computer simulation, Creep, Stress, Cycles

Journal Articles

A Method for Thermal Performance Characterization of Ultrathin Vapor Chambers Cooled by Natural Convection

Gaurav Patankar, Simone Mancin, Justin A. Weibel, Suresh V. Garimella, Mark A. MacDonald

J. Electron. Packag. March 2016, 138(1): 010903.

Paper No: EP-15-1083

DOI: https://doi.org/10.1115/1.4032345

Published Online: March 10, 2016

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Topics: Calibration, Condensers (steam plant), Copper, Flat heat pipes, Heat, Heat losses, Natural convection, Temperature, Thermal resistance, Vapors

Journal Articles

Experimentally Validated Computational Fluid Dynamics Model for a Data Center With Cold Aisle Containment

Sami A. Alkharabsheh, Bahgat G. Sammakia, Saurabh K. Shrivastava

J. Electron. Packag. June 2015, 137(2): 021010.

Paper No: EP-14-1016

DOI: https://doi.org/10.1115/1.4029344

Published Online: June 1, 2015

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Topics: Air flow, Calibration, Computational fluid dynamics, Containment, Data centers, Flow (Dynamics), Leakage, Stress, Temperature, Tiles

Journal Articles

Thermal Resistance Analysis of High Power Light Emitting Diode Using Aluminum Nitride Thin Film-Coated Copper Substrates as Heat Sink

S. Shanmugan, D. Mutharasu

J. Electron. Packag. September 2014, 136(3): 034502.

Paper No: EP-13-1099

DOI: https://doi.org/10.1115/1.4027379

Published Online: May 12, 2014

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Topics: Aluminum, Calibration, Copper, Currents, Heat sinks, Junctions, Light-emitting diodes, Temperature, Thermal resistance, Thin films

Journal Articles

Parameter Calibrations on MOSFET Stress Sensors

Ren-Tzung Tan, Hsien Chung, Ben-Je Lwo, Chun-Pai Tang, Kun-Fu Tseng

J. Electron. Packag. September 2012, 134(3): 031004.

DOI: https://doi.org/10.1115/1.4006888

Published Online: July 18, 2012

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Topics: Calibration, MOSFET transistors, Sensors, Stress, Temperature

Journal Articles

Meso Scale Pulsating Jets for Electronics Cooling

Jivtesh Garg, Mehmet Arik, Stanton Weaver, Todd Wetzel, Seyed Saddoughi

J. Electron. Packag. December 2005, 127(4): 503–511.

DOI: https://doi.org/10.1115/1.2065727

Published Online: April 20, 2005

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Topics: Heat, Heat flux, Heat transfer, Heat transfer coefficients, Jets, Natural convection, Temperature, Temperature measurement, Thermal management, Cooling

Journal Articles

Testing and Modeling of Solders Using New Test Device, Part 2: Calibration and Validation

Chandrakant S. Desai, Zhichao Wang, Russell Whitenack, Tribikram Kundu

J. Electron. Packag. June 2004, 126(2): 232–236.

DOI: https://doi.org/10.1115/1.1756147

Published Online: July 8, 2004

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Topics: Calibration, Modeling, Solders, Temperature, Testing, Finite element analysis, Electronic packaging, Shear (Mechanics), Stress, Boundary-value problems

Journal Articles

A Hybrid Thermal Energy Storage Device, Part 1: Design Methodology

Ning Zheng, R. A. Wirtz

J. Electron. Packag. March 2004, 126(1): 1–7.

DOI: https://doi.org/10.1115/1.1646419

Published Online: April 30, 2004

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Topics: Design, Engineering prototypes, Heat, Heat sinks, Latent heat, Storage, Temperature, Thermal conductivity, Thermal energy storage, Interfacial thermal resistance

Journal Articles

Calibrate Piezoresistive Stress Sensors Through the Assembled Structure

Ben-Je Lwo, Mem. ASME, Shen-Yu Wu

J. Electron. Packag. June 2003, 125(2): 289–293.

DOI: https://doi.org/10.1115/1.1572904

Published Online: June 10, 2003

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Topics: Calibration, Sensors, Stress, Temperature

Journal Articles

In-Plane Packaging Stress Measurements Through Piezoresistive Sensors

Ben-Je Lwo, Tung-Sheng Chen, Ching-Hsing Kao, Yu-Lin Lin

J. Electron. Packag. June 2002, 124(2): 115–121.

DOI: https://doi.org/10.1115/1.1452244

Published Online: May 2, 2002

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Topics: Packaging, Sensors, Stress, Calibration, Temperature

Journal Articles

On the Study of Piezoresistive Stress Sensors for Microelectronic Packaging

Ben-Je Lwo, Ching-Hsing Kao, Tung-Sheng Chen, Yao-Shing Chen

J. Electron. Packag. March 2002, 124(1): 22–26.

DOI: https://doi.org/10.1115/1.1414134

Published Online: February 21, 2000

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Topics: Calibration, Sensors, Stress, Temperature, Manufacturing, Microelectronic packaging

Journal Articles

A Study of Process-Induced Residual Stress in PBGA Packages

Zhu Wu, Jian Lu, Mem. ASME, Yifan Guo, Mem. ASME

J. Electron. Packag. September 2000, 122(3): 262–266.

DOI: https://doi.org/10.1115/1.1285983

Published Online: December 8, 1999

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Topics: Calibration, Displacement, Stress, Residual stresses, Interferometry

Journal Articles

Thermomechanical Response of Materials and Interfaces in Electronic Packaging: Part I—Unified Constitutive Model and Calibration

C. S. Desai, J. Chia, T. Kundu, J. L. Prince

J. Electron. Packag. December 1997, 119(4): 294–300.

DOI: https://doi.org/10.1115/1.2792252

Published Online: December 1, 1997

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Topics: Calibration, Constitutive equations, Electronic packaging, Thermomechanics, Failure, Creep, Damage, Design, Fatigue, Fatigue failure

Journal Articles

Thermomechanical Modeling of Direct Chip Interconnection Assembly

E. K. Buratynski

J. Electron. Packag. December 1993, 115(4): 382–391.

DOI: https://doi.org/10.1115/1.2909347

Published Online: December 1, 1993

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Topics: Manufacturing, Modeling, Thermomechanics, Anisotropy, Adhesives, Calibration, Hardening (Curing), Stress

Journal citation

NARROW

Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies

A Method for Thermal Performance Characterization of Ultrathin Vapor Chambers Cooled by Natural Convection

Experimentally Validated Computational Fluid Dynamics Model for a Data Center With Cold Aisle Containment

Thermal Resistance Analysis of High Power Light Emitting Diode Using Aluminum Nitride Thin Film-Coated Copper Substrates as Heat Sink

Parameter Calibrations on MOSFET Stress Sensors

Meso Scale Pulsating Jets for Electronics Cooling

Testing and Modeling of Solders Using New Test Device, Part 2: Calibration and Validation

A Hybrid Thermal Energy Storage Device, Part 1: Design Methodology

Calibrate Piezoresistive Stress Sensors Through the Assembled Structure

In-Plane Packaging Stress Measurements Through Piezoresistive Sensors

On the Study of Piezoresistive Stress Sensors for Microelectronic Packaging

A Study of Process-Induced Residual Stress in PBGA Packages

Thermomechanical Response of Materials and Interfaces in Electronic Packaging: Part I—Unified Constitutive Model and Calibration

Thermomechanical Modeling of Direct Chip Interconnection Assembly

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